公开(公告)号：US09673168B2

公开(公告)日：2017-06-06

申请号：US15114453

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi Saruyama ,  Yasushi Akutsu

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83499 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/069 ,  H01L2924/0635 ,  H01L2924/01006

Abstract: Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched between each main surface of the substrate electrodes and electrode terminals are sufficiently compressed, ensuring electrical conduction. An electronic component is connected to a circuit substrate via an anisotropic conductive adhesive agent, on respective edge-side areas of substrate electrodes of the circuit substrate and electrode terminals of the electronic component, stepped sections are formed and abutted, conductive particles are sandwiched between each main surface and stepped sections of the substrate electrodes and electrode terminals; the conductive particles and stepped sections satisfy formula, a+b+c≦0.8 D (1), wherein a is height of the stepped section of the electrode terminals, b is height of the stepped section of the substrate electrodes, c is gap distance between each stepped sections and D is diameter of conductive particles.

公开(公告)号：US09585247B2

公开(公告)日：2017-02-28

申请号：US14418743

申请日：2013-08-02

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu

IPC: C09J133/04 ,  H05K1/03 ,  C09J163/00 ,  H01R4/04 ,  H01B1/22 ,  H01L23/00 ,  C09D4/00 ,  C09D133/04 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K1/036 ,  C09D4/00 ,  C09D133/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/01322 ,  H01L2924/15788 ,  H01L2924/181 ,  H01R4/04 ,  H05K1/11 ,  H05K3/1283 ,  H05K3/323 ,  Y10T428/31511 ,  Y10T428/31928 ,  H01L2924/00

Abstract: An anisotropic conductive film includes a first connection layer and a second connection layer formed on one side of the first connection layer. The first connection layer is obtained by photo-radical polymerization of a photo-radical polymerizable resin layer containing an acrylate compound and a photo-radical polymerization initiator. The second connection layer includes a thermal- or photo-, cationic or anionic polymerizable resin layer containing an epoxy compound and a thermal- or photo-, cationic or anionic polymerization initiator, or a thermal- or photo-radical polymerizable resin layer containing an acrylate compound and a thermal- or photo-radical polymerization initiator. Conductive particles for anisotropic conductive connection are arranged in a single layer on a second connection layer-side surface of the first connection layer.

Abstract translation: 各向异性导电膜包括形成在第一连接层的一侧上的第一连接层和第二连接层。 第一连接层通过含有丙烯酸酯化合物和光自由基聚合引发剂的光自由基聚合性树脂层的光自由基聚合而获得。 第二连接层包括含有环氧化合物和热或光阳离子或阴离子聚合引发剂的热或光阳离子或阴离子可聚合树脂层，或含有丙烯酸酯的热或光自由基聚合性树脂层 化合物和热或光自由基聚合引发剂。 用于各向异性导电连接的导电颗粒被布置在第一连接层的第二连接层侧表面上的单层中。

公开(公告)号：US11923333B2

公开(公告)日：2024-03-05

申请号：US17690276

申请日：2022-03-09

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu

IPC: H01L23/00

CPC classification number: H01L24/32 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29082 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/83203 ,  H01L2224/83851

Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.

公开(公告)号：US11195813B2

公开(公告)日：2021-12-07

申请号：US15115813

申请日：2015-02-04

Applicant: DEXERIALS CORPORATION

Inventor： Reiji Tsukao ,  Yasushi Akutsu

IPC: H01L23/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B32B27/38 ,  B32B27/40 ,  H01R11/01 ,  C09J163/00 ,  C09J4/00 ,  C09J201/00

Abstract: A first anisotropic conductive film 1A or a second anisotropic conductive film 1B has a first insulating resin layer 2 and a second insulating resin layer 3. The first insulating resin layer 2 is formed of a photopolymerized resin, and the second insulating resin layer 3 is formed of a polymerizable resin. Conductive particles 10 are disposed in a single layer on a surface of the first insulating resin layer 2 on a side of the second insulating resin layer 3. The first anisotropic conductive film further has a third insulating resin layer 4 formed of a polymerizable resin, and the second anisotropic conductive film 1B has an intermediate insulating resin layer 6. The intermediate insulating resin layer 6 is formed of a resin containing no polymerization initiator, and is in contact with the conductive particles 10. These anisotropic conductive films have favorable connection reliability.

公开(公告)号：US10943879B2

公开(公告)日：2021-03-09

申请号：US15542343

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu ,  Tomoyuki Ishimatsu

IPC: H01L23/00

Abstract: A bump-forming film is used for forming, on a semiconductor device such as a bumpless IC chip, bumps which are low in cost and can achieve stable conduction reliability. The bump-forming film is configured such that conductive fillers for bumps are arranged regularly in a planar view in an insulating adhesive resin layer. The regular arrangement has a periodic repeating unit in the longitudinal direction of the film. The straight line which connects one ends of the conductive fillers for bumps in the thickness direction of the film is substantially parallel to the surface of the film.

公开(公告)号：US10373926B2

公开(公告)日：2019-08-06

申请号：US15926210

申请日：2018-03-20

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato ,  Yasushi Akutsu

IPC: G02F1/1345 ,  H01L23/00 ,  C09J9/02 ,  B32B7/12 ,  C09J7/00 ,  C09J7/10 ,  B29C35/08 ,  B29C59/02 ,  B29C71/04 ,  B32B3/30 ,  B32B33/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US10304796B2

公开(公告)日：2019-05-28

申请号：US15988065

申请日：2018-05-24

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu

IPC: H01L23/00

Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.

公开(公告)号：US10154587B2

公开(公告)日：2018-12-11

申请号：US15027422

申请日：2014-09-17

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu

IPC: C08F2/44 ,  H05K1/18 ,  C09J163/00 ,  C09J201/00 ,  H01R4/04 ,  C08F2/48 ,  H01L23/00 ,  H01B1/22 ,  H01B3/40 ,  H05K1/03 ,  H05K1/09 ,  H05K3/06 ,  H01R12/57 ,  H05K3/32 ,  C08F222/10

Abstract: An electrical connection material such as anisotropic conductive film that suppresses generation of warpage at electrical connection portion such as anisotropic conductive connection portion, and does not allow conduction reliability of connection body obtained by electrical connection such as anisotropic conductive connection to be reduced has a structure in which a conductive particle-containing layer is disposed between first insulating thermosetting resin composition layer and second insulating thermosetting resin composition layer. The conductive particle-containing layer is obtained by irradiating conductive particle-containing resin composition layer that contains radically polymerizable acrylate compound, photoradical polymerization initiator, non-radically polymerizable epoxy-based compound, and conductive particles with light, resulting in photoradical polymerization to form B stage state of conductive particle-containing resin composition layer. The first insulating thermosetting resin composition layer and second insulating thermosetting resin composition layer each contain non-radically polymerizable epoxy-based compound and thermal cationic polymerization initiator or thermal anionic polymerization initiator.

公开(公告)号：US09960139B2

公开(公告)日：2018-05-01

申请号：US14428582

申请日：2013-09-17

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato ,  Yasushi Akutsu

IPC: H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B23B3/30 ,  C09J9/02 ,  B29C59/02 ,  B32B33/00 ,  C09J7/00 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34 ,  B29C35/08

CPC classification number: H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US20150231803A1

公开(公告)日：2015-08-20

申请号：US14422470

申请日：2013-08-23

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro Shinohara ,  Yasushi Akutsu

IPC: B29C43/20 ,  H01L23/00 ,  B29D7/01 ,  B29C43/00 ,  B29C35/08

CPC classification number: B29C43/203 ,  B29C35/0805 ,  B29C43/003 ,  B29C2035/0827 ,  B29D7/01 ,  B29K2063/00 ,  B29K2505/00 ,  B29K2995/0005 ,  C09J5/06 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01R4/04 ,  H05K3/323 ,  Y10T428/24612

Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.

Abstract translation: 制备各向异性导电膜，其中制备具有设置在其中的具有导电颗粒的开口的透光转印模头，并将可光聚合绝缘树脂挤压入开口以将导电颗粒转印到可光聚合绝缘树脂层的表面上，形成第一连接层，其具有 导电粒子在光聚合性绝缘树脂层的平面方向上排列成单层的结构，相邻的导电粒子之间的中央区域的光聚合性绝缘树脂层的厚度小于光聚合性绝缘树脂层的厚度 接近导电颗粒; 第一连接层通过透光转印模具用紫外线照射; 从第一连接层去除脱模膜; 第二连接层形成在与透光转移模具相对的第一连接层的表面上; 并且第三连接层形成在第一连接层的表面上。