公开(公告)号：US20110175237A1

公开(公告)日：2011-07-21

申请号：US13056462

申请日：2009-11-06

申请人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

发明人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

IPC分类号： H01L23/48 ,  H01L21/50 ,  B29C65/20

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75303 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9221 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512

摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.

摘要翻译： 将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中， 被接合在电路板（4）上。 此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。 同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压 形成表面凹凸（16a）。 覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

公开(公告)号：US20080211143A1

公开(公告)日：2008-09-04

申请号：US11987260

申请日：2007-11-28

申请人： Takaaki Morita

发明人： Takaaki Morita

IPC分类号： B29C70/72 ,  B29C43/10 ,  B29C43/20

CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/24 ,  H01L24/25 ,  H01L24/75 ,  H01L24/82 ,  H01L2221/68345 ,  H01L2224/24011 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/75313 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/83209 ,  H01L2224/83855 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2203/025 ,  H05K2203/074 ,  H05K2203/1469 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512

摘要： There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substrate 200 in which a plurality of semiconductor devices 220 are embedded, after disposing the plurality of semiconductor devices 220 on an unhardened resin layer 212, this is stored in a container 31 of a pressurizing and heating unit 3, the plurality of semiconductor devices 220 are simultaneously, collectively and isotropically pressurized by use of an internal gas in the container 31 as a pressure medium to simultaneously press the plurality of semiconductor devices 220 to the unhardened resin layer 212, and the resin layer 212 is heated and hardened. In consequence, the plurality of semiconductor devices 220 are collectively and uniformly fixed and mounted onto the resin layer 212 without being influenced by a state change of the resin layer 212.

摘要翻译： 在电子部件和树脂层固定的情况下，公开了电子部件的集合安装方法，其中多个电子部件能够在短时间内均匀地被按压到绝缘层。 为了制造其中嵌入有多个半导体器件220的半导体嵌入式衬底200，在将多个半导体器件220设置在未硬化树脂层212上之后，将其存储在加压和加热单元3的容器31中， 多个半导体器件220通过使用容器31中的内部气体作为压力介质同时并且各向同性地加压，以将多个半导体器件220同时按压到未硬化的树脂层212，并且树脂层212被加热，并且 硬化 因此，多个半导体器件220被集中且均匀地固定并安装到树脂层212上，而不受树脂层212的状态变化的影响。

公开(公告)号：US09842823B2

公开(公告)日：2017-12-12

申请号：US14584889

申请日：2014-12-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  HsiaoYun Lo ,  Yi-Hsiu Chen ,  Wen-Chih Chiou

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/7501 ,  H01L2224/75304 ,  H01L2224/75305 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/8013 ,  H01L2224/80132

摘要： A chip-stacking apparatus for stacking a chip on a substrate is provided. The chip-stacking apparatus includes a substrate support configured to carry the substrate and a transport device configured to dispose a chip to the substrate. The transport device includes a bond head including a bond base and an attaching element disposed on the bond base and configured to allow the chip to be attached thereon. The center area of the attaching element is higher than an edge area of the attaching element relative to the bond base.

公开(公告)号：US20020029857A1

公开(公告)日：2002-03-14

申请号：US09928516

申请日：2001-08-14

发明人： Yukio Yamada

IPC分类号： B32B031/00

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29019 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75313 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T156/1744 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor device by electrically connecting an electrode of the semiconductor device 4 to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process comprising: the step of tentatively thermocompression bonding a conductive particle-free filmy insulating adhesive onto a wiring board 22 to thereby form an insulating adhesive layer 23; the step of forming a concave 23a of a predetermined size in said insulating adhesive layer 23 by using a compression bonding head 2 provided with a pressing chip 21 at a predetermined position; the step of putting in the concave 23a of said insulating adhesive layer 23 an anisotropic conductive adhesive film of a predetermined size; and the step of mounting a predetermined IC chip 11 at a predetermined position of the compression bonding head 2 and then positioning said IC chip 11 and thermocompression bonding to said wiring board 22.

摘要翻译： 一种用于安装半导体器件和安装设备的方法，由此能够可靠地连接细间距半导体器件和布线板的电极。 一种通过使用具有分散在绝缘粘合剂中的导电粒子的各向异性导电粘合膜将半导体器件4的电极电连接到布线板的电极来安装半导体器件的工艺，该方法包括：暂时热压接 将导电无颗粒的膜状绝缘粘合剂粘合到布线板22上，从而形成绝缘粘合剂层23; 通过使用在预定位置设置有加压芯片21的压接头2，在所述绝缘粘合剂层23中形成预定尺寸的凹部23a的步骤; 将绝缘粘合剂层23的凹部23a放入预定尺寸的各向异性导电粘合膜的步骤; 以及将预定的IC芯片11安装在压接头2的预定位置，然后将所述IC芯片11定位并热压接到所述布线板22上的步骤。

公开(公告)号：US6015081A

公开(公告)日：2000-01-18

申请号：US206270

申请日：1994-03-07

申请人： Takahiro Okabayashi ,  Tetsuo Yoshizawa ,  Toyohide Miyazaki ,  Hiroshi Kondo ,  Yoshimi Terayama ,  Takashi Sakaki ,  Yuichi Ikegami ,  Kazuo Kondo ,  Yoichi Tamura ,  Yasuo Nakatsuka

发明人： Takahiro Okabayashi ,  Tetsuo Yoshizawa ,  Toyohide Miyazaki ,  Hiroshi Kondo ,  Yoshimi Terayama ,  Takashi Sakaki ,  Yuichi Ikegami ,  Kazuo Kondo ,  Yoichi Tamura ,  Yasuo Nakatsuka

IPC分类号： B23K31/02 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R12/55 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01R12/714 ,  H05K3/368 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75313 ,  H01L2224/758 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K3/325 ,  H05K3/328

摘要： A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical connection between said electrical joints with a biasing force which is exerted by an elastic member from at least one side of said electric circuit component so that the biasing force is exerted consecutively from an intermediate position of connecting area where said joints are located to the periphery of said connecting area.

摘要翻译： 一种用于电气电路部件的电接头之间的电连接的方法包括布置所述电路部件，使得所述用于电连接的所述接头彼此相对，并且以所述电接头之间的电连接以由 来自所述电路部件的至少一侧的弹性部件，使得所述偏置力从所述接头所在的连接区域的中间位置连续地施加到所述连接区域的周边。

公开(公告)号：US08895359B2

公开(公告)日：2014-11-25

申请号：US13056462

申请日：2009-11-06

申请人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

发明人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L23/58 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75303 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9221 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512

摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.

摘要翻译： 将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中， 被接合在电路板（4）上。 此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。 同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压 形成表面凹凸（16a）。 覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

公开(公告)号：US20120247664A1

公开(公告)日：2012-10-04

申请号：US13184084

申请日：2011-07-15

申请人： Kazuhiko KOBAYASHI

发明人： Kazuhiko KOBAYASHI

IPC分类号： B29C65/18 ,  B32B37/02

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/75704 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/81048 ,  H01L2224/8109 ,  H01L2224/81093 ,  H01L2224/83048 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

摘要翻译： 接合装置能够有效地增加衬底的温度并减少在将半导体器件倒装芯片接合到衬底的工艺中位置间隙的发生和连接不良。 接合装置包括：用于支撑基板的支撑单元，半导体器件已经通过非导电粘附在该基板上; 以及用于加热和加压基板的加热/加压单元，加热/加压单元具有内置的热源和夹紧面，由支撑单元支撑的基板被压在该加热/加压单元上。 由支撑单元支撑的基板朝向加热/加压单元的夹紧面移动，以便通过辐射热预热基板和半导体器件。 然后，将半导体器件按压到加热/加压单元的夹紧面上，以固化不导电粘合剂并将半导体器件的凸起接合到衬底的端子部分。

公开(公告)号：US20080211086A1

公开(公告)日：2008-09-04

申请号：US11987262

申请日：2007-11-28

申请人： Takaaki Morita

发明人： Takaaki Morita

IPC分类号： H01L23/14 ,  H01L21/58

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/04105 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/2505 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/75313 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83856 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/303 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/074 ,  H05K2203/0776 ,  H05K2203/082 ,  H05K2203/1484 ,  Y02P70/613 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： There is disclosed a fixing method of an electronic component or the like in which when the electronic component and a resin layer are fixed, warp and bend of the electronic component can be inhibited. During manufacturing of a semiconductor-embedded substrate 200 in which a semiconductor device 220 is embedded, after the semiconductor device 220 is disposed on an unhardened resin layer 212, this device is stored in a container 31 of a pressurizing and heating unit 3, and the semiconductor device 220 is isotropically pressurized using an internal gas in the container 31 as a pressure medium, whereby the semiconductor device 220 is pressed to the unhardened resin layer 212, and the resin layer 212 is heated to harden. In consequence, the semiconductor device 220 is fixed and mounted on the resin layer 212 without being warped or bent.

摘要翻译： 公开了电子部件等的固定方法，其中当电子部件和树脂层固定时，可以抑制电子部件的翘曲和翘曲。 在其中嵌入半导体器件220的半导体嵌入式衬底200的制造期间，在将半导体器件220设置在未硬化树脂层212上之后，将该器件存储在加压和加热单元3的容器31中，并且 半导体器件220使用容器31内的内部气体作为压力介质进行各向同性加压，由此将半导体器件220压到未硬化树脂层212上，并且加热树脂层212以使其硬化。 因此，半导体器件220固定并安装在树脂层212上而不会翘曲或弯曲。

公开(公告)号：US5823419A

公开(公告)日：1998-10-20

申请号：US715188

申请日：1996-09-17

申请人： Shigeru Ichikawa

发明人： Shigeru Ichikawa

IPC分类号： H01L21/60 ,  B23K20/00 ,  B23K3/00

CPC分类号： B23K20/004 ,  H01L24/75 ,  H01L2224/75313 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01082 ,  Y10T403/7094

摘要： A bonding tool used in a bonding apparatus for bonding, for example, pellet and leads of a lead frame including a tool attachment part to which a tool member is mounted. The tool member has four inclined surfaces, and the tool attachment part includes two fixed guide members and two detachable guide members fastened to the tool attachment part by bolts. Inclined surfaces that position two adjacent inclined surfaces of the tool member are formed on the fixed guide members, and inclined surfaces that position the other two inclined surfaces of the tool member are formed on the detachable guide members. The tool member is mounted on and dismounted from the tool attachment part by merely removing the detachable guide members.

摘要翻译： 一种用于接合的接合装置中的接合工具，例如，包括安装有工具构件的工具安装部的引线框的颗粒和引线。 工具构件具有四个倾斜表面，并且工具附接部分包括两个固定引导构件和两个通过螺栓紧固到工具附接部分的可拆卸导向构件。 在固定导向部件上形成定位工具部件的两个相邻倾斜面的倾斜面，并且在可拆卸引导部件上形成有将工具部件的另外两个倾斜面定位的倾斜面。 通过仅移除可拆卸的引导构件，将工具构件安装在工具附件部分上并从其上拆下。

公开(公告)号：US20160190087A1

公开(公告)日：2016-06-30

申请号：US14584889

申请日：2014-12-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua YU ,  HsiaoYun LO ,  Yi-Hsiu CHEN ,  Wen-Chih CHIOU

IPC分类号： H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/7501 ,  H01L2224/75304 ,  H01L2224/75305 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/8013 ,  H01L2224/80132

摘要： A chip-stacking apparatus for stacking a chip on a substrate is provided. The chip-stacking apparatus includes a substrate support configured to carry the substrate and a transport device configured to dispose a chip to the substrate. The transport device includes a bond head including a bond base and an attaching element disposed on the bond base and configured to allow the chip to be attached thereon. The center area of the attaching element is higher than an edge area of the attaching element relative to the bond base.

摘要翻译： 提供了一种用于在基板上堆叠芯片的芯片堆叠装置。 芯片堆叠装置包括被配置为承载基板的基板支撑件和配置成将芯片配置到基板的输送装置。 输送装置包括：接合头，其包括接合基底和设置在接合基底上并被配置为允许芯片附接在其上的附接元件。 附着元件的中心区域比附着元件相对于接合基座的边缘区域高。