公开(公告)号：US08895359B2

公开(公告)日：2014-11-25

申请号：US13056462

申请日：2009-11-06

申请人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

发明人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L23/58 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75303 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9221 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512

摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.

摘要翻译： 将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中， 被接合在电路板（4）上。 此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。 同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压 形成表面凹凸（16a）。 覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

公开(公告)号：US08358018B2

公开(公告)日：2013-01-22

申请号：US12431855

申请日：2009-04-29

申请人： Makoto Imanishi ,  Yoshihiro Tomura ,  Kentaro Kumazawa

发明人： Makoto Imanishi ,  Yoshihiro Tomura ,  Kentaro Kumazawa

IPC分类号： H01L23/29

CPC分类号： H01L23/3135 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85148 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edge, in the vicinity of which the wire (5) passes, of the outer perimeter edge portions of the component (2) is formed to be a chamfered oblique surface (31), and the wire (5) is provided to extend to the board (1) along the oblique surface (31). By this means, the overall height of the electronic component can be kept low.

摘要翻译： 一种电子部件，其中部件（2）的外周部分被第一密封树脂（4）包围，第二密封树脂（3）填充在第一密封树脂（4）的周围，该部件 （2）和电路板（1）通过电线（5）电连接，组件（2）的外周边缘部分中的线（5）附近的边缘形成为 倒角斜面（31），线（5）设置成沿着倾斜面（31）延伸到基板（1）。 通过这种方式，可以将电子部件的整体高度保持为低。

公开(公告)号：US20090267214A1

公开(公告)日：2009-10-29

申请号：US12066534

申请日：2006-10-19

申请人： Kentaro Kumazawa ,  Shigeru Kondou ,  Hidenobu Nishikawa

发明人： Kentaro Kumazawa ,  Shigeru Kondou ,  Hidenobu Nishikawa

IPC分类号： H01L25/065 ,  H01L23/52 ,  H01L21/56 ,  H01L23/12 ,  H01L25/07

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85201 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The electronic circuit device of the present invention includes at least one semiconductor element, a plurality of external connection terminals, a connecting conductor for electrically connecting semiconductor element and external connection terminals, and an insulating resin for covering the semiconductor element and supporting the connecting conductor integrally, in which the semiconductor element is buried in the insulating resin, and the terminal surface of the external connection terminals is exposed from the insulating resin.

摘要翻译： 本发明的电子电路装置包括至少一个半导体元件，多个外部连接端子，用于电连接半导体元件和外部连接端子的连接导体，以及用于覆盖半导体元件并将连接导体一体地支撑的绝缘树脂 其中半导体元件埋在绝缘树脂中，并且外部连接端子的端子表面从绝缘树脂露出。

公开(公告)号：US20080150133A1

公开(公告)日：2008-06-26

申请号：US11722925

申请日：2005-12-28

申请人： Kojiro Nakamura ,  Hidenobu Nishikawa ,  Kentaro Kumazawa

发明人： Kojiro Nakamura ,  Hidenobu Nishikawa ,  Kentaro Kumazawa

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/13 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06593 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.

摘要翻译： 实现了半导体芯片与电路基板之间的连接可靠性更高的半导体芯片双面组件。 这通过包括设置在基板上表面（1a）上的多个上侧焊盘（2a）的组件实现; 多个下侧焊盘（2b）分别设置在跨过衬底（1）的与上侧焊盘（2a）相对应的衬底下表面（1b）上; 第一半导体芯片（4）分别具有接合到所述上侧焊盘（2a）的第一凸起（8a）; 以及第二半导体芯片（5），其具有分别与下侧焊盘（2b）接合的第二凸起（8b）。

公开(公告)号：US08436253B2

公开(公告)日：2013-05-07

申请号：US12992306

申请日：2009-03-23

申请人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

发明人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

IPC分类号： H05K1/00

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.

摘要翻译： 提供一种安装结构，其包括电子部件; 电路板; 第一绝缘树脂和第二绝缘树脂，其被放置在电子部件和电路板之间用于密封; 在电子部件或电路基板上形成多个凸块; 连接到所述多个凸块的所述电路板或所述电子部件的多个对置电极; 和多个接合区域。 多个连接区域由第二绝缘树脂形成，多个第一绝缘树脂区域设置在接合区域周围，使得接合区域被多个第一绝缘树脂区域夹持，第一绝缘树脂和第二绝缘树脂区域 树脂各自含有填料，第二绝缘树脂的固化温度比第一绝缘树脂的固化温度高。

公开(公告)号：US08163599B2

公开(公告)日：2012-04-24

申请号：US12933819

申请日：2009-03-30

申请人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

发明人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

IPC分类号： H01L21/44

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75304 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/249954 ,  H01L2924/00

摘要： A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.

摘要翻译： 倒装芯片安装装置在工具保护片（10）的加压膜（10b）侧具有屏蔽膜（18）。 当通过工具保护片（10）对半导体芯片（1）加热加压时，加压膜（10b）通过片材固定夹具（9）从模具中释放，并通过加压/加热工具 11）抵靠从半导体芯片（1）的周围突出的绝缘树脂膜（5），并施加外部压力使绝缘树脂膜（5）固化。

公开(公告)号：US08050049B2

公开(公告)日：2011-11-01

申请号：US12427056

申请日：2009-04-21

申请人： Teppei Iwase ,  Kazuhiro Nobori ,  Yoshihiro Tomura ,  Koujiro Nakamura ,  Kentaro Kumazawa

发明人： Teppei Iwase ,  Kazuhiro Nobori ,  Yoshihiro Tomura ,  Koujiro Nakamura ,  Kentaro Kumazawa

IPC分类号： H05K7/00

CPC分类号： H05K1/181 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/611

摘要： The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion 21 (or a protruding portion 22) is formed in the surfaces of the circuit board 2.

摘要翻译： 本发明提供了一种双面安装结构的半导体器件，其包括在电路板的相对表面上布置和接合在一起的电路板和多个半导体芯片，其中在安装在电路板上的半导体芯片31的区域中 电路板2的顶面与安装在电路基板2的底面的半导体芯片32重叠，在电路基板2的表面形成有凹部21（或突出部22）。

公开(公告)号：US07994638B2

公开(公告)日：2011-08-09

申请号：US12531819

申请日：2008-05-09

申请人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

发明人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05076 ,  H01L2224/05554 ,  H01L2224/05576 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.

摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。

公开(公告)号：US20110042808A1

公开(公告)日：2011-02-24

申请号：US12989777

申请日：2009-04-14

申请人： Kentaro Kumazawa ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Yoshihiro Tomura

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L24/05 ,  B33Y80/00 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0501 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor element having a plurality of element electrodes formed thereon, a circuit board having board electrodes respectively corresponding to the element electrodes formed thereon and having the semiconductor element mounted thereon, and bumps each of which is provided on at least one of the element electrode and the board electrode, and connects together the element electrode and the board electrode corresponding to each other when the semiconductor element is mounted on the circuit board. Furthermore, at least one of a dielectric layer and a resistive layer is provided between at least one of the bumps and the element or board electrode on which the at least one of the bumps is provided, so that the element or board electrode, the dielectric layer or the resistive layer, and the bump form a parallel-plate capacitor or electrical resistance.

摘要翻译： 半导体器件包括其上形成有多个元件电极的半导体元件，具有分别对应于其上形成有元件电极并且具有安装有半导体元件的基板电极的电路板，以及设置在其上的至少一个上的凸块 元件电极和基板电极，并且当将半导体元件安装在电路板上时，将元件电极和板电极彼此对应连接在一起。 此外，在至少一个凸块和设置有至少一个凸块的元件或电路板电极之间提供电介质层和电阻层中的至少一个，使得元件或基板电极，电介质 层或电阻层，并且凸起形成平行板电容器或电阻。

公开(公告)号：US20090278265A1

公开(公告)日：2009-11-12

申请号：US12431855

申请日：2009-04-29

申请人： Makoto Imanishi ,  Yoshihiro Tomura ,  Kentaro Kumazawa

发明人： Makoto Imanishi ,  Yoshihiro Tomura ,  Kentaro Kumazawa

IPC分类号： H01L23/28 ,  B32B3/02 ,  H05K3/00

CPC分类号： H01L23/3135 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85148 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edge, in the vicinity of which the wire (5) passes, of the outer perimeter edge portions of the component (2) is formed to be a chamfered oblique surface (31), and the wire (5) is provided to extend to the board (1) along the oblique surface (31). By this means, the overall height of the electronic component can be kept low.

摘要翻译： 一种电子部件，其中部件（2）的外周部分被第一密封树脂（4）包围，第二密封树脂（3）填充在第一密封树脂（4）的周围，该部件 （2）和电路板（1）通过电线（5）电连接，组件（2）的外周边缘部分中的线（5）附近的边缘形成为 倒角斜面（31），线（5）设置成沿着倾斜面（31）延伸到基板（1）。 通过这种方式，可以将电子部件的整体高度保持为低。