公开(公告)号：US08860913B2

公开(公告)日：2014-10-14

申请号：US13263870

申请日：2009-11-18

申请人： Yohei Nakanishi ,  Yuichiro Yamada ,  Masanobu Mizusaki

发明人： Yohei Nakanishi ,  Yuichiro Yamada ,  Masanobu Mizusaki

IPC分类号： G02F1/1337 ,  C09K19/32 ,  C09K19/04

CPC分类号： G02F1/133788 ,  C09K19/322 ,  C09K2019/0448 ,  G02F1/133707 ,  G02F2001/133742

摘要： The present invention provides a liquid crystal display device producing less image sticking. The liquid crystal display device of the present invention comprises: a pair of substrates; and a liquid crystal layer between the substrates, wherein at least one of the substrates comprises an alignment film and a photopolymer film on the alignment film, the photopolymer film comprises polymers constituted by a photopolymerizable monomer, the photopolymerizable monomer includes two or more polymerizable functional groups, the polymerizable functional groups are bonded to each other through two or more aromatic rings, the aromatic rings include at least one naphthalene ring, and a bond between the naphthalene ring and another aromatic ring has a rotational degree of freedom.

摘要翻译： 本发明提供一种产生较少图像粘附的液晶显示装置。 本发明的液晶显示装置包括：一对基板; 以及基板之间的液晶层，其中至少一个基板在取向膜上包括取向膜和光聚合物膜，光聚合物膜包含由光聚合单体构成的聚合物，光聚合单体包括两个或更多个可聚合官能团 可聚合的官能团通过两个或更多个芳环彼此键合，芳环包括至少一个萘环，萘环与另一个芳环之间的键具有旋转自由度。

公开(公告)号：US20140168586A1

公开(公告)日：2014-06-19

申请号：US14003759

申请日：2012-03-08

申请人： Masanobu Mizusaki ,  Yuichiro Yamada ,  Satoshi Enomoto ,  Yuki Hara ,  Hideo Kikuchi

发明人： Masanobu Mizusaki ,  Yuichiro Yamada ,  Satoshi Enomoto ,  Yuki Hara ,  Hideo Kikuchi

IPC分类号： C09K19/56 ,  G02F1/1337

CPC分类号： G02F1/1337 ,  C09K19/2014 ,  C09K19/56 ,  C09K2019/0448 ,  G02F1/133707 ,  G02F1/133711 ,  G02F1/133788 ,  G02F1/1343 ,  G02F2001/133715

摘要： Several aspects of the present invention provide a liquid crystal composition capable of shortening the takt time and achieving excellent display qualities, and a liquid crystal display device and a method for producing a liquid crystal display device which use the liquid crystal composition. The liquid crystal composition of several aspects of the present invention includes a liquid crystal material and one or more kinds of radical polymerizable monomers, at least one kind of the radical polymerizable monomers being a compound generating radicals through a self-cleavage reaction by exposure to light and having at least two radical polymerizable groups.

摘要翻译： 本发明的几个方面提供能够缩短打印时间并实现优异的显示质量的液晶组合物，液晶显示装置和使用该液晶组合物的液晶显示装置的制造方法。 本发明的几个方面的液晶组合物包括液晶材料和一种或多种可自由基聚合的单体，至少一种可自由基聚合的单体是通过曝光而通过自裂解反应产生自由基的化合物 并具有至少两个可自由基聚合的基团。

公开(公告)号：US20130128202A1

公开(公告)日：2013-05-23

申请号：US13814055

申请日：2011-07-27

申请人： Masanobu Mizusaki ,  Youhei Nakanishi ,  Takeshi Noma ,  Yuichiro Yamada ,  Satoshi Enomoto ,  Yuki Hara ,  Hideo Kikuchi

发明人： Masanobu Mizusaki ,  Youhei Nakanishi ,  Takeshi Noma ,  Yuichiro Yamada ,  Satoshi Enomoto ,  Yuki Hara ,  Hideo Kikuchi

IPC分类号： G02F1/1337

CPC分类号： G02F1/133711 ,  B32B2457/202 ,  C08F20/20 ,  G02F1/133723 ,  G02F1/133788 ,  G02F2001/133742 ,  G02F2202/023 ,  Y10T428/1018 ,  Y10T428/1023

摘要： The present invention provides a liquid crystal display device in which a high wettability can be achieved, and also image sticking seldom occurs. The liquid crystal display device according to the present invention includes a pair of substrates, and a liquid crystal layer disposed between the pair of substrates, wherein the liquid crystal layer includes a liquid crystal material having a negative dielectric constant anisotropy, at least one of the pair of substrates is provided with an alignment film for vertically aligning adjacent liquid crystal molecules, and a polymer layer formed on the alignment film for controlling the alignment of the adjacent liquid crystal molecules, the polymer layer is formed by polymerization of at least one monomer, the polymerization being initiated by radicals generated of the monomer upon absorption of light, the alignment film includes a polymer compound having a main chain that contains an imide structure, and the main chain has an imidization ratio of less than 50%.

摘要翻译： 本发明提供一种能够实现高润湿性的液晶显示装置，并且也很少发生图像残留。 根据本发明的液晶显示装置包括一对基板和设置在该对基板之间的液晶层，其中液晶层包括具有负介电常数各向异性的液晶材料，至少一个 一对基板设置有用于垂直排列相邻液晶分子的取向膜和形成在取向膜上的用于控制相邻液晶分子的取向的聚合物层，聚合物层通过至少一种单体的聚合形成， 聚合由吸收光时由单体产生的自由基引发，取向膜包括具有含有酰亚胺结构的主链的聚合物化合物，并且主链的酰亚胺化率小于50％。

公开(公告)号：US08130340B2

公开(公告)日：2012-03-06

申请号：US11990751

申请日：2006-08-14

申请人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Kiwamu Takehisa ,  Mitsuo Matsumoto ,  Tokuo Ikari ,  Toshiaki Sato ,  Ikuo Onishi ,  Etsuo Nakazato ,  Yuichiro Yamada ,  Tokihiko Shinomiya ,  Takashi Ishizumi ,  Yuhsaku Ajichi

发明人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Kiwamu Takehisa ,  Mitsuo Matsumoto ,  Tokuo Ikari ,  Toshiaki Sato ,  Ikuo Onishi ,  Etsuo Nakazato ,  Yuichiro Yamada ,  Tokihiko Shinomiya ,  Takashi Ishizumi ,  Yuhsaku Ajichi

IPC分类号： G02F1/13357

CPC分类号： G02B6/0046 ,  G02B6/002 ,  G02B6/0053 ,  G02F1/133605 ,  G02F1/133611 ,  G02F1/133615

摘要： A large liquid crystal display (100) comprises a light guide plate (3) arranged on the back side of a liquid crystal panel (1). The front surface of the light guide plate (3) is flat, while the back surface thereof is concave. The upper and lower end faces of the light guide plate (3) respectively facing hot cathode fluorescent lamps (2a, 2b) have a convex shape projecting toward the respective lamps. White light from the fluorescent lamps is incident on the upper and lower end faces of the light guide plate directly or by being reflected by reflectors (4a, 4b), and propagates within the light guide plate while being reflected by the front and back surfaces of the light guide plate. At the front surface of the light guide plate, a part of the white light is directed toward the back side of the liquid crystal panel (1) by a light guide portion (5).

摘要翻译： 大型液晶显示器（100）包括布置在液晶面板（1）背面的导光板（3）。 导光板（3）的前表面是平坦的，而其后表面是凹形的。 分别面对热阴极荧光灯（2a，2b）的导光板（3）的上端面和下端面具有向各个灯突出的凸形。 来自荧光灯的白光直接入射到导光板的上端面和下端面，或者被反射器（4a，4b）反射，并在导光板内传播，同时由导光板的正面和背面反射 导光板。 在导光板的前表面，一部分白光通过导光部（5）指向液晶面板（1）的背面。

公开(公告)号：US20120026442A1

公开(公告)日：2012-02-02

申请号：US13263870

申请日：2009-11-18

申请人： Yohei Nakanishi ,  Yuichiro Yamada ,  Masanobu Mizusaki

发明人： Yohei Nakanishi ,  Yuichiro Yamada ,  Masanobu Mizusaki

IPC分类号： G02F1/1337 ,  C07C69/618 ,  C07C43/295 ,  C09K19/54

CPC分类号： G02F1/133788 ,  C09K19/322 ,  C09K2019/0448 ,  G02F1/133707 ,  G02F2001/133742

摘要： The present invention provides a liquid crystal display device producing less image sticking. The liquid crystal display device of the present invention comprises: a pair of substrates; and a liquid crystal layer between the substrates, wherein at least one of the substrates comprises an alignment film and a photopolymer film on the alignment film, the photopolymer film comprises polymers constituted by a photopolymerizable monomer, the photopolymerizable monomer includes two or more polymerizable functional groups, the polymerizable functional groups are bonded to each other through two or more aromatic rings, the aromatic rings include at least one naphthalene ring, and a bond between the naphthalene ring and another aromatic ring has a rotational degree of freedom.

摘要翻译： 本发明提供一种产生较少图像粘附的液晶显示装置。 本发明的液晶显示装置包括：一对基板; 以及基板之间的液晶层，其中至少一个基板在取向膜上包括取向膜和光聚合物膜，光聚合物膜包含由光聚合单体构成的聚合物，光聚合单体包括两个或更多个可聚合官能团 可聚合的官能团通过两个或更多个芳环彼此键合，芳环包括至少一个萘环，萘环与另一个芳环之间的键具有旋转自由度。

公开(公告)号：US20100165587A1

公开(公告)日：2010-07-01

申请号：US12664475

申请日：2008-05-26

申请人： Yuichiro Yamada ,  Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda

发明人： Yuichiro Yamada ,  Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda

IPC分类号： H05K5/00 ,  H05K3/30

CPC分类号： G06K19/077 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin.

摘要翻译： 存储卡包括电路板，安装在电路板上的不同区域上的半导体芯片，半导体芯片，其顶面上具有半导体电极，并被固定，使得其底面的至少一部分面向至少一部分 半导体芯片的顶面，用于连接半导体电极的电线和电路板上的板电极以实现半导体芯片的安装状态，以及用于从电路板的上侧覆盖电路形成区域的盖。 电路形成区域包括三个半导体芯片和导线。 三个半导体芯片，至少一部分电路板和导线中的至少一部分被二次密封树脂和主密封树脂覆盖。

公开(公告)号：US20090283900A1

公开(公告)日：2009-11-19

申请号：US12432791

申请日：2009-04-30

申请人： Yuichiro YAMADA

发明人： Yuichiro YAMADA

IPC分类号： H01L23/04 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L21/566 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises: (a) a wiring board having front surface lands disposed on a front surface and rear surface lands disposed on a rear surface; (b) a semiconductor chip formed with an integrated circuit and electrode terminals electrically connected to the integrated circuit; and (c) a sealing resin that covers a front side of the wiring board when the semiconductor chip is mounted on the front side of the wiring board such that the front surface lands and the rear surface lands are electrically connected to the electrode terminals, wherein (d) holes having a shape and dimensions that allow projecting electrodes of the other semiconductor device to be inserted therein are formed in the sealing resin such that the front surface lands disposed further toward an inner side than a front surface of the semiconductor chip are exposed.

摘要翻译： 一种半导体器件包括：（a）布线板，其具有设置在设置在后表面上的前表面和后表面焊盘上的前表面焊盘; （b）半导体芯片，形成有与集成电路电连接的集成电路和电极端子; 以及（c）当所述半导体芯片安装在所述布线板的前侧以使得所述前表面焊盘和所述后表面焊盘电连接到所述电极端子时，覆盖所述布线板的前侧的密封树脂，其中 （d）在密封树脂中形成具有能够插入其他半导体器件的突出电极的形状和尺寸的孔，使得更靠近半导体芯片的前表面的内侧的前表面焊盘露出 。

公开(公告)号：US20060158593A1

公开(公告)日：2006-07-20

申请号：US11333648

申请日：2006-01-18

申请人： Akira Sakai ,  Masahiro Hasegawa ,  Tokihiko Shinomiya ,  Yuichiro Yamada

发明人： Akira Sakai ,  Masahiro Hasegawa ,  Tokihiko Shinomiya ,  Yuichiro Yamada

IPC分类号： G02F1/1333

CPC分类号： G02F1/13363 ,  G02F1/1393 ,  G02F2001/133635 ,  G02F2413/02

摘要： The liquid crystal display device according to the present invention comprising: a liquid crystal display cell including liquid crystal between two substrates facing to each other; a polarizing element provided on each side of the liquid crystal display cell; and at least one film member provided in at least either one area of areas between the liquid crystal display cell and the polarizing element, the polarizing element being formed from a film made of polyvinylalcohol resin, the film member being attached to the polarizing element with a cohesive layer and/or an adhesive layer having a thickness of less than 10 μm therebetween, and the film member provided in at least either one area of areas between the liquid crystal display cell and the polarizing element having an absolute value of a photoelastic coefficient of less than 10×10−8 cm2/N and having a water absorption of less than 2.0%.

摘要翻译： 根据本发明的液晶显示装置包括：液晶显示单元，其包括彼此面对的两个基板之间的液晶; 设置在液晶显示单元的每一侧的偏振元件; 以及至少一个膜构件，其设置在所述液晶显示单元和所述偏振元件之间的区域的至少一个区域中，所述偏振元件由由聚乙烯醇树脂制成的膜形成，所述膜构件附接到所述偏振元件 粘合层和/或其间厚度小于10μm的粘合剂层，并且设置在液晶显示单元和偏振元件之间的至少一个区域中的膜构件具有光弹性系数的绝对值 小于10×10 -8 cm 2 / N，吸水率小于2.0％。

公开(公告)号：US06900524B1

公开(公告)日：2005-05-31

申请号：US09380312

申请日：1998-06-08

申请人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

发明人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

IPC分类号： H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (13), the anchoring effect to the sealing resin (15), stress acting on a lead portion of a product, and stress to the thin metal wires (14) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.

摘要翻译： 树脂模制型半导体器件具有：半导体芯片（12），其安装在引线框架（9）的芯片焊盘部分（11）上; 将半导体芯片（12）的端子连接到引线框架（9）的内引线部分（13）的细金属线（14）; 和密封树脂（15），并且引线框架（9）经受镦锻处理，使得支撑部分（11）位于比内部引线部分（13）高的位置。 由于对应于镦粗阶梯差的厚度的密封树脂存在于支撑部分的下方，因此可以提高引线框架和密封树脂之间的粘合性，并且实现高可靠性和变薄。 由于至少一个槽部设置在每个内部引线部分（13）的表面中，所以对密封树脂（15）的锚定效应，作用在产品的引线部分上的应力和对金属细线的应力 （14）可以松弛，并且可以防止导线和细金属线剥离。

公开(公告)号：US06861735B2

公开(公告)日：2005-03-01

申请号：US10747982

申请日：2003-12-31

申请人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

发明人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (13), the anchoring effect to the sealing resin (15), stress acting on a lead portion of a product, and stress to the thin metal wires (14) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.

摘要翻译： 树脂模制型半导体器件具有：半导体芯片（12），其安装在引线框架（9）的芯片焊盘部分（11）上; 将半导体芯片（12）的端子连接到引线框架（9）的内引线部分（13）的细金属线（14）; 和密封树脂（15），并且引线框架（9）经受镦锻处理，使得支撑部分（11）位于比内部引线部分（13）高的位置。 由于对应于镦粗阶梯差的厚度的密封树脂存在于支撑部分的下方，因此可以提高引线框架和密封树脂之间的粘合性，并且实现高可靠性和变薄。 由于至少一个槽部设置在每个内部引线部分（13）的表面中，所以对密封树脂（15）的锚定效应，作用在产品的引线部分上的应力和对金属细线的应力 （14）可以松弛，并且可以防止导线和细金属线剥离。