公开(公告)号：US20240274583A1

公开(公告)日：2024-08-15

申请号：US18514107

申请日：2023-11-20

申请人： Micron Technology, Inc.

发明人： Seng Kim Ye ,  Hong Wan Ng

IPC分类号： H01L25/065 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/18

CPC分类号： H01L25/0657 ,  H01L21/78 ,  H01L24/32 ,  H01L24/33 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/18 ,  H01L25/50 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/207

摘要： Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.

公开(公告)号：US11682598B2

公开(公告)日：2023-06-20

申请号：US17527767

申请日：2021-11-16

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  H01L23/00 ,  G06V40/13 ,  H01L23/498 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/15 ,  G06V40/1329 ,  H01L24/48 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/05647 ,  H01L2924/00015 ,  H01L2224/05624 ,  H01L2924/00015 ,  H01L2224/05639 ,  H01L2924/00015 ,  H01L2224/05644 ,  H01L2924/00015 ,  H01L2224/05655 ,  H01L2924/00015 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/2919 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US20190164859A1

公开(公告)日：2019-05-30

申请号：US15823467

申请日：2017-11-27

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Tsan-Hsien CHEN ,  Ian HU ,  Jin-Feng YANG ,  Shih-Wei CHEN ,  Hui-Chen HSU

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/373

CPC分类号： H01L23/3128 ,  H01L21/4814 ,  H01L21/565 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/1134 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.

公开(公告)号：US20190157525A1

公开(公告)日：2019-05-23

申请号：US16091321

申请日：2017-04-07

申请人： OSRAM Opto Semiconductors GmbH

发明人： Thomas Reeswinkel

IPC分类号： H01L33/56 ,  H01L27/02 ,  H01L33/62 ,  H01L33/60 ,  H01L23/00

CPC分类号： H01L33/56 ,  H01L24/73 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An optoelectronic component includes a carrier having a chip mounting face, wherein the chip mounting face has a reflection coating, and an optoelectronic semiconductor chip adhesively bonded on the reflection coating by an adhesive so that the reflection coating is subdivided into a first subsection covered by the semiconductor chip and a second subsection, which is free of the semiconductor chip, wherein the adhesive has reflection particles that reflect electromagnetic radiation emitted by the semiconductor chip, and the second subsection is at least partially covered by a corrosion protection layer.

公开(公告)号：US20190026533A1

公开(公告)日：2019-01-24

申请号：US15830651

申请日：2017-12-04

申请人： Primax Electronics Ltd.

发明人： Tsung-Yi Lu

IPC分类号： G06K9/00 ,  H01L23/13 ,  H01L23/00 ,  H01L23/04 ,  H01L23/498 ,  H01L23/10 ,  H01L23/14 ,  H01L23/08 ,  H01L23/31

CPC分类号： G06K9/00087 ,  G06K9/00053 ,  H01L21/50 ,  H01L23/04 ,  H01L23/08 ,  H01L23/10 ,  H01L23/13 ,  H01L23/14 ,  H01L23/142 ,  H01L23/3142 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/29194 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/3511 ,  H01L2924/00

摘要： The present invention provides a package structure of a fingerprint identification chip, including: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having a bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening, where the bonding pad is electrically connected to the first metal contact through a wire.

公开(公告)号：US10074781B2

公开(公告)日：2018-09-11

申请号：US14471697

申请日：2014-08-28

申请人： Cree, Inc.

发明人： Robert Wilcox ,  Brian Thomas Collins

IPC分类号： H05B33/14 ,  H01L51/54 ,  H01L33/50 ,  C09K11/08 ,  C09K11/77

CPC分类号： H01L33/504 ,  C09K11/0883 ,  C09K11/7734 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A light emitting device includes a light emitting diode chip (“LED”) that emits light having a dominant wavelength in the blue color range and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. The recipient luminophoric medium includes a green phosphor, a yellow phosphor, a first red phosphor having a first dominant wavelength and a second red phosphor having a second dominant wavelength that is different from the first dominant wavelength.

公开(公告)号：US20180254385A1

公开(公告)日：2018-09-06

申请号：US15756651

申请日：2016-08-30

申请人： OSRAM Opto Semiconductors GmbH

发明人： Thomas Kippes ,  Claus Jaeger

IPC分类号： H01L33/46 ,  H01L33/48 ,  H01L23/00

CPC分类号： H01L33/46 ,  H01L24/47 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

摘要： An optoelectronic component includes a semiconductor chip, the semiconductor chip emitting infrared radiation; a reflector that reflects the infrared radiation of the semiconductor chip; and a filter configured in the form of a coating, the filter being transparent for the infrared radiation of the semiconductor chip, wherein visible light striking the optoelectronic component being absorbed to at least 75%.

公开(公告)号：US20180226552A1

公开(公告)日：2018-08-09

申请号：US15506203

申请日：2015-08-20

申请人： LG INNOTEK CO., LTD.

发明人： Gun Kyo LEE ,  Kwang Hee LEE

IPC分类号： H01L33/62 ,  H01L33/50 ,  H01L25/075 ,  H01L33/56 ,  H01L23/00

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0753 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L33/52 ,  H01L33/56 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting element package according to an embodiment comprises: a substrate; a conductive layer arranged on the substrate; at least one light-emitting chip arranged on the substrate; a wire for electrically connecting the conductive layer and the at least one light-emitting chip; a wavelength conversion unit arranged on the light-emitting chip; and a molding unit arranged on the substrate so as to enclose the light-emitting chip and the wire and to expose the upper surface of the wavelength conversion unit, wherein the distance from the upper surface of the light-emitting chip to the upper surface of the wavelength conversion unit is larger than a value obtained by adding 37 μm to the distance from the upper surface of the light-emitting chip to the highest point of the wire.

公开(公告)号：US20180209865A1

公开(公告)日：2018-07-26

申请号：US15576436

申请日：2016-04-07

申请人： Robert Bosch GmbH

发明人： Markus Reinhard ,  Masoud Habibi ,  Winfried Kuhnt

IPC分类号： G01L13/02 ,  G01L19/14

CPC分类号： G01L13/025 ,  G01L19/143 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A device for detecting a pressure of a fluid medium is described. The device includes at least one housing having at least two pressure feeds; at least one sensor module, the sensor module being accommodated in the housing, the sensor module including at least one support element, the support element including at least one substrate and at least one molding compound, the support element further including at least one passage opening, the passage opening entirely penetrating the support element; at least one pressure sensor element for detecting the pressure, the pressure sensor element including at least one diaphragm, the pressure sensor element covering the passage opening; at least one control and evaluation unit, the control and evaluation unit being at least partially enclosed by the molding compound. A method for manufacturing the device is also described.

公开(公告)号：US10026701B1

公开(公告)日：2018-07-17

申请号：US14444867

申请日：2014-07-28

申请人： Sandia Corporation

发明人： Christopher T. Rodenbeck ,  Kenneth A. Peterson

IPC分类号： H01L23/66 ,  H01L21/56 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6616 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8192 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration.