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公开(公告)号：US20220415769A1
公开(公告)日：2022-12-29
申请号：US17897556
申请日：2022-08-29
发明人： Jae Yun Kim , Gi Tae Lim , Woon Kab Jung , Ju Hoon Yoon , Dong Joo Park , Byong Woo Cho , Gyu Wan Han , Ji Young Chung , Jin Seong Kim , Do Hyun Na
IPC分类号： H01L23/498 , H01L23/31 , H01L21/50 , H01L23/00 , H01L23/538
摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
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公开(公告)号：US12002725B2
公开(公告)日：2024-06-04
申请号：US18199215
申请日：2023-05-18
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , G06V40/13 , H01L23/00 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/85 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2224/05647 , H01L2924/00015 , H01L2224/05624 , H01L2924/00015 , H01L2224/05639 , H01L2924/00015 , H01L2224/05644 , H01L2924/00015 , H01L2224/05655 , H01L2924/00015 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/92247 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/2919 , H01L2924/00014 , H01L2224/48091 , H01L2924/00014
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US11996369B2
公开(公告)日：2024-05-28
申请号：US17973057
申请日：2022-10-25
发明人： Myung Jea Choi , Gyu Wan Han , Gi Tae Lim , Dong Joo Park , Ji Hun Yi , Jin Young Khim
IPC分类号： H01L23/538 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/31
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L23/3128 , H01L23/5383 , H01L23/5385 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2224/214
摘要： In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20230290699A1
公开(公告)日：2023-09-14
申请号：US18199215
申请日：2023-05-18
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
CPC分类号： H01L23/15 , H01L24/48 , G06V40/1329 , H01L23/49805
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US11495505B2
公开(公告)日：2022-11-08
申请号：US17018434
申请日：2020-09-11
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee , Sang Goo Kang , Kyung Rok Park
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/13 , H01L21/56 , H01L23/00 , H01L25/065 , H01L23/31 , H01L25/18 , H01L23/498
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
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公开(公告)号：US11682598B2
公开(公告)日：2023-06-20
申请号：US17527767
申请日：2021-11-16
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , H01L23/00 , G06V40/13 , H01L23/498 , H01L23/495 , H01L23/31 , H01L21/56
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/85 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2224/05647 , H01L2924/00015 , H01L2224/05624 , H01L2924/00015 , H01L2224/05639 , H01L2924/00015 , H01L2224/05644 , H01L2924/00015 , H01L2224/05655 , H01L2924/00015 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/92247 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/2919 , H01L2924/00014 , H01L2224/48091 , H01L2924/00014
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20230088061A1
公开(公告)日：2023-03-23
申请号：US18071318
申请日：2022-11-29
发明人： Dong Hyeon Park , Min Ho Kim , Dong Su Ryu , Seok Ho Na , Choong Hoe Kim , Yun Seok Song , Woo Kyung Ju , Dong Joo Park
IPC分类号： H01L23/00 , B23K1/005 , B23K26/067 , B23K26/06
摘要： In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20220122921A1
公开(公告)日：2022-04-21
申请号：US17073025
申请日：2020-10-16
发明人： Myung Jea Choi , Gyu Wan Han , Gi Tae Lim , Dong Joo Park , Ji Hun Yi , Jin Young Khim
IPC分类号： H01L23/538 , H01L23/31 , H01L23/00 , H01L21/48 , H01L21/56
摘要： In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20200381395A1
公开(公告)日：2020-12-03
申请号：US16429553
申请日：2019-06-03
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee
IPC分类号： H01L25/065 , H01L25/00
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.
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公开(公告)号：US20240321658A1
公开(公告)日：2024-09-26
申请号：US18680167
申请日：2024-05-31
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , G06V40/13 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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