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公开(公告)号：US11854991B2
公开(公告)日：2023-12-26
申请号：US17510528
申请日：2021-10-26
发明人： Jin Seong Kim , Yeong Beom Ko , Kwang Seok Oh , Jo Hyun Bae , Sung Woo Lim , Yun Ah Kim , Yong Jae Ko , Ji Chang Lee
IPC分类号： H01L23/538 , H01L23/31 , H01L21/78 , H01L21/48 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/78 , H01L23/3121 , H01L23/5383 , H01L23/5386
摘要： In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20220415769A1
公开(公告)日：2022-12-29
申请号：US17897556
申请日：2022-08-29
发明人： Jae Yun Kim , Gi Tae Lim , Woon Kab Jung , Ju Hoon Yoon , Dong Joo Park , Byong Woo Cho , Gyu Wan Han , Ji Young Chung , Jin Seong Kim , Do Hyun Na
IPC分类号： H01L23/498 , H01L23/31 , H01L21/50 , H01L23/00 , H01L23/538
摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
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公开(公告)号：US20210217725A1
公开(公告)日：2021-07-15
申请号：US17129015
申请日：2020-12-21
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L23/552 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/498 , H01L25/00
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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公开(公告)号：US11049828B2
公开(公告)日：2021-06-29
申请号：US15078474
申请日：2016-03-23
发明人： Gyu Wan Han , Jin Seong Kim , Byong Woo Cho
摘要： An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.
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公开(公告)号：US20210175177A1
公开(公告)日：2021-06-10
申请号：US16703240
申请日：2019-12-04
发明人： Jin Seong Kim , Yeong Beom Ko , Kwang Seok Oh , Jo Hyun Bae , Sung Woo Lim , Yun Ah Kim , Yong Jae Ko , Ji Chang Lee
IPC分类号： H01L23/538 , H01L23/31 , H01L21/48 , H01L21/56 , H01L21/78
摘要： In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US12107035B2
公开(公告)日：2024-10-01
申请号：US17897556
申请日：2022-08-29
发明人： Jae Yun Kim , Gi Tae Lim , Woon Kab Jung , Ju Hoon Yoon , Dong Joo Park , Byong Woo Cho , Gyu Wan Han , Ji Young Chung , Jin Seong Kim , Do Hyun Na
IPC分类号： H01L23/498 , H01L21/50 , H01L23/00 , H01L23/31 , H01L23/538
CPC分类号： H01L23/49811 , H01L21/50 , H01L23/3128 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/92 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16227 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73253 , H01L2224/81815 , H01L2224/83191 , H01L2224/83203 , H01L2224/8321 , H01L2224/92225 , H01L2224/92242 , H01L2924/181 , H01L2924/18161 , H01L2224/81815 , H01L2924/00014 , H01L2224/8321 , H01L2924/00014 , H01L2224/83203 , H01L2924/00014 , H01L2224/2929 , H01L2924/0665 , H01L2224/2919 , H01L2924/0665 , H01L2224/293 , H01L2924/00014 , H01L2224/92242 , H01L2224/81 , H01L2924/181 , H01L2924/00 , H01L2224/131 , H01L2924/014 , H01L2224/1329 , H01L2924/00014 , H01L2224/133 , H01L2924/00014
摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
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公开(公告)号：US11869829B2
公开(公告)日：2024-01-09
申请号：US16925599
申请日：2020-07-10
发明人： Dong Joo Park , Jin Seong Kim , Ki Wook Lee , Dae Byoung Kang , Ho Choi , Kwang Ho Kim , Jae Dong Kim , Yeon Soo Jung , Sung Hwan Cho
IPC分类号： H01L23/482 , H01L23/498 , H01L25/065 , H01L23/48 , H01L23/31 , H01L25/03 , H01L23/00 , H01L25/10 , H01L23/538
CPC分类号： H01L23/482 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/10 , H01L23/5389 , H01L24/16 , H01L24/24 , H01L24/32 , H01L2224/04105 , H01L2224/06181 , H01L2224/13025 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/17181 , H01L2224/244 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73253 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/81191 , H01L2224/92224 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2225/06582 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/19107 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2924/181 , H01L2924/00012
摘要： In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. Other embodiments of the semiconductor device comprise one or more interposers which are electrically connected to the through-mold vias, and may be covered by the package body and/or disposed in spaced relation thereto. In yet other embodiments of the semiconductor device, the interposer may not be electrically connected to the through mold vias, but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
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公开(公告)号：US11488892B2
公开(公告)日：2022-11-01
申请号：US16927454
申请日：2020-07-13
发明人： Louis W. Nicholls , Roger D. St. Amand , Jin Seong Kim , Woon Kab Jung , Sung Jin Yang , Robert F. Darveaux
IPC分类号： H01L23/48 , H01L23/498 , H01L21/48 , H01L23/31 , H01L23/538
摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.
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公开(公告)号：US20220181265A1
公开(公告)日：2022-06-09
申请号：US17510528
申请日：2021-10-26
发明人： Jin Seong Kim , Yeong Beom Ko , Kwang Seok Oh , Jo Hyun Bae , Sung Woo Lim , Yun Ah Kim , Yong Jae Ko , Ji Chang Lee
IPC分类号： H01L23/538 , H01L23/31 , H01L21/78 , H01L21/48 , H01L21/56
摘要： In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20220077013A1
公开(公告)日：2022-03-10
申请号：US17527767
申请日：2021-11-16
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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