公开(公告)号：US20240321658A1

公开(公告)日：2024-09-26

申请号：US18680167

申请日：2024-05-31

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  G06V40/13 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/15 ,  G06V40/1329 ,  H01L24/48 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US20220077013A1

公开(公告)日：2022-03-10

申请号：US17527767

申请日：2021-11-16

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  H01L23/00 ,  G06K9/00

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US11177187B2

公开(公告)日：2021-11-16

申请号：US16890027

申请日：2020-06-02

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  H01L23/00 ,  G06K9/00 ,  H01L23/498 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US11682598B2

公开(公告)日：2023-06-20

申请号：US17527767

申请日：2021-11-16

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  H01L23/00 ,  G06V40/13 ,  H01L23/498 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/15 ,  G06V40/1329 ,  H01L24/48 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/05647 ,  H01L2924/00015 ,  H01L2224/05624 ,  H01L2924/00015 ,  H01L2224/05639 ,  H01L2924/00015 ,  H01L2224/05644 ,  H01L2924/00015 ,  H01L2224/05655 ,  H01L2924/00015 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/2919 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US12002725B2

公开(公告)日：2024-06-04

申请号：US18199215

申请日：2023-05-18

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  G06V40/13 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/15 ,  G06V40/1329 ,  H01L24/48 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/05647 ,  H01L2924/00015 ,  H01L2224/05624 ,  H01L2924/00015 ,  H01L2224/05639 ,  H01L2924/00015 ,  H01L2224/05644 ,  H01L2924/00015 ,  H01L2224/05655 ,  H01L2924/00015 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/2919 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US20230290699A1

公开(公告)日：2023-09-14

申请号：US18199215

申请日：2023-05-18

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC分类号： H01L23/15 ,  H01L23/00 ,  G06V40/13

CPC分类号： H01L23/15 ,  H01L24/48 ,  G06V40/1329 ,  H01L23/49805

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.