公开(公告)号：US20080192423A1

公开(公告)日：2008-08-14

申请号：US11817991

申请日：2006-03-07

申请人： Koichi Nagai ,  Minoru Yamamoto ,  Ken Takano ,  Tatsuo Sasaoka ,  Kazumichi Shimizu

发明人： Koichi Nagai ,  Minoru Yamamoto ,  Ken Takano ,  Tatsuo Sasaoka ,  Kazumichi Shimizu

IPC分类号： H05K7/00 ,  H01L23/12 ,  H01L21/58

CPC分类号： H01L25/0657 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a location off the mounting areas of the bare chips (1), thereby achieving a lower profile, higher lamination, and higher capacity.

摘要翻译： 具有安装在一侧或两侧的裸芯片（1）的多个薄膜基板（2）通过接合部（3）接合成层压状态，并且通过接合部（3）连接到主板（4） 8）在裸芯片（1）的安装区域的位置处，从而实现较低的轮廓，更高的层压和更高的容量。

公开(公告)号：US07355126B2

公开(公告)日：2008-04-08

申请号：US10311476

申请日：2001-06-14

申请人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Shuji Ono ,  Hiroyuki Otani

发明人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Shuji Ono ,  Hiroyuki Otani

IPC分类号： H05K1/16

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/3142 ,  H01L24/06 ,  H01L24/14 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.

摘要翻译： 电子部件和电路形成用物品通过含有树脂的接合材料接合在一起。 在电子部件接合区域和电路形成用品的电极的凸点相互电接触的状态下，电子部件和电路形成用品在接合材料固化时彼此热压接合。 电子部件接合区域的接合材料流动调节部件在电路形成物品与电子部件接合期间调节接合材料向电子部件接合区域的周边部分的流动。

公开(公告)号：US08895359B2

公开(公告)日：2014-11-25

申请号：US13056462

申请日：2009-11-06

申请人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

发明人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L23/58 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75303 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9221 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512

摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.

摘要翻译： 将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中， 被接合在电路板（4）上。 此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。 同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压 形成表面凹凸（16a）。 覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

公开(公告)号：US07907420B2

公开(公告)日：2011-03-15

申请号：US11817991

申请日：2006-03-07

申请人： Koichi Nagai ,  Minoru Yamamoto ,  Ken Takano ,  Tatsuo Sasaoka ,  Kazumichi Shimizu

发明人： Koichi Nagai ,  Minoru Yamamoto ,  Ken Takano ,  Tatsuo Sasaoka ,  Kazumichi Shimizu

IPC分类号： H05K1/11

CPC分类号： H01L25/0657 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a location off the mounting areas of the bare chips (1), thereby achieving a lower profile, higher lamination, and higher capacity.

摘要翻译： 具有安装在一侧或两侧的裸芯片（1）的多个薄膜基板（2）通过接合部（3）接合成层压状态，并且通过接合部（3）连接到主板（4） 8）在裸芯片（1）的安装区域的位置处，从而实现较低的轮廓，更高的层压和更高的容量。

公开(公告)号：US20100187675A1

公开(公告)日：2010-07-29

申请号：US12692872

申请日：2010-01-25

申请人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

发明人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L21/561 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.

摘要翻译： 该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂​​覆盖并密封。 在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。 通过该凹部的作用可以减小半导体器件的翘曲。

公开(公告)号：US07060528B2

公开(公告)日：2006-06-13

申请号：US10253604

申请日：2002-09-25

申请人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Hiroyuki Otani

发明人： Hidenobu Nishikawa ,  Kazuto Nishida ,  Kazumichi Shimizu ,  Hiroyuki Otani

IPC分类号： H01L21/48

CPC分类号： H01L24/742 ,  H01L21/563 ,  H01L23/544 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.

摘要翻译： 提供了高生产率的半导体元件安装方法。 该方法包括在其上形成有多个半导体元件的晶片的电极上形成凸块，通过绝缘树脂临时压接晶片和插入件，通过进行加热和加压来固化树脂，使得晶片和插入件 最后压接，其中晶片的电极和插入器的电极分别相互粘合，并且其中从晶片和插入件之间溢出的绝缘树脂流入设置为与切割线重合的槽 晶片，从而提供均匀的绝缘树脂流动，然后将该结合单元切割并分离成单独的半导体元件。

公开(公告)号：US08207618B2

公开(公告)日：2012-06-26

申请号：US12692872

申请日：2010-01-25

申请人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

发明人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

IPC分类号： H01L23/28

CPC分类号： H01L21/563 ,  H01L21/561 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.

摘要翻译： 该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂​​覆盖并密封。 在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。 通过该凹部的作用可以减小半导体器件的翘曲。

公开(公告)号：US20110175237A1

公开(公告)日：2011-07-21

申请号：US13056462

申请日：2009-11-06

申请人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

发明人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

IPC分类号： H01L23/48 ,  H01L21/50 ,  B29C65/20

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75303 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9221 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512

摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.

摘要翻译： 将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中， 被接合在电路板（4）上。 此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。 同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压 形成表面凹凸（16a）。 覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

公开(公告)号：US06908589B2

公开(公告)日：2005-06-21

申请号：US10461622

申请日：2003-06-13

申请人： Tadashi Kitudo ,  Mamoru Takemura ,  Mituaki Matumuro ,  Hideto Matumoto ,  Takao Horie ,  Kazumichi Shimizu

发明人： Tadashi Kitudo ,  Mamoru Takemura ,  Mituaki Matumuro ,  Hideto Matumoto ,  Takao Horie ,  Kazumichi Shimizu

IPC分类号： B22D1/00 ,  C21C1/10 ,  C22C37/00 ,  C22C37/04 ,  C22C37/10

CPC分类号： C22C37/10

摘要： The purpose of the present invention is to provide high manganese cast iron containing spheroidal vanadium carbide and method for making which is nonmagnetic as well as superior mechanical properties such as wear-resistance and toughness, and further does not require a water toughing heat treatment which has been needed when nonmagnetic high manganese steel (high manganese cast steel) is obtained by crystallized spheroidal vanadium in austenite matrix, and the high manganese cast iron containing spheroidal vanadium carbide is comprised of C 1.5˜4.0 weight %, V 6˜15 weight %, Si 0.2˜4.0 weight %, Mn 10˜18 weight %, Mg 0.01˜0.1 weight %, remaining iron (Fe) and inevitable impurities, spheroidal vanadium carbide is crystallized within a structure.

摘要翻译： 本发明的目的是提供含有球墨铸铁的高锰铸铁及其非磁性制造方法以及耐磨性和韧性等优异的机械性能，而且不需要水韧性热处理， 在奥氏体基体中通过结晶的球状钒获得非磁性高锰钢（高锰铸钢）时需要，并且含有球铁钒的高锰铸铁为C 1.5〜4.0重量％，V 6〜15重量％ Si 0.2〜4.0重量％，Mn 10〜18重量％，Mg 0.01〜0.1重量％，剩余铁（Fe）和不可避免的杂质，球状碳化钒在结构内结晶。