公开(公告)号：US08425679B2

公开(公告)日：2013-04-23

申请号：US13581573

申请日：2010-11-25

申请人： Taiichiro Mori ,  Kazuto Tabara ,  Kenji Yamamoto ,  Minoru Morioka ,  Takayuki Higuchi

发明人： Taiichiro Mori ,  Kazuto Tabara ,  Kenji Yamamoto ,  Minoru Morioka ,  Takayuki Higuchi

IPC分类号： C04B28/06 ,  C04B14/36 ,  C04B7/32 ,  C04B22/08 ,  C01F7/16 ,  C01G49/00

CPC分类号： C04B28/02 ,  C01G49/0036 ,  C01G49/0045 ,  C01P2002/72 ,  C04B7/32 ,  C04B22/0093 ,  C04B2111/26 ,  Y02W30/92 ,  Y02W30/94 ,  C04B2103/0088 ,  C04B14/106 ,  C04B14/22 ,  C04B18/08 ,  C04B18/10 ,  C04B18/141 ,  C04B18/146

摘要： It is the object of the invention to provide a cement admixture, and a cement composition that can impart good enough rustproofness to reinforcing bars in hardened cement concrete, and can have resistance to penetration of chloride ions entering from the outside, prevent the hardened cement concrete from getting porous due to reduced leaching of Ca ions and have a self-recovery capability.The invention provides a cement admixture characterized by containing a calcium ferroaluminate compound comprising a CaO—Al2O3—Fe2O3 system, and having a Fe2O3 content of 0.5 to 15% by mass and a CaO.2Al2O3 structure with a CaO/Al2O3 molar ratio ranging from 0.15 to 0.7. It is preferable that the fineness is 2,000 to 7,000 cm2/g as represented in terms of the Blaine's specific surface area value; the potentially hydraulic substance and/or pozzolan substance (pozzolan substance or the like) is also used; the pozzolan substance or the like contains one or two or more selected from the group consisting of finely pulverized, quenched, granulated blast-furnace slag, fly ash, silica fume, metakaolin, incinerated pulp sludge ash, incinerated sewage sludge ash, and waste glass powder; and the blending proportion of the calcium ferroaluminate compound to the pozzolan substance or the like ranges from 10/1 to 1/10 by mass. The invention also provides a cement composition containing cement and the cement admixture.

摘要翻译： 本发明的目的是提供一种水泥混合物和一种能够赋予硬化水泥混凝土中的钢筋足够好的防锈性的水泥组合物，并且可以具有抵抗从外部进入的氯离子的渗透性，防止硬化的水泥混凝土 由于Ca离子的浸出减少而变得多孔，并且具有自恢复能力。 本发明提供一种水泥外加剂，其特征在于含有CaO-Al 2 O 3 -Fe 2 O 3体系的铁铝钙钙化合物，Fe 2 O 3含量为0.5〜15质量％，CaO / Al 2 O 3的CaO / Al 2 O 3结构为0.15 至0.7。 如Blaine的比表面积值所示，细度优选为2,000〜7000cm 2 / g; 还使用潜在的水力物质和/或火山灰物质（火山灰物质等）; 火山灰物质等含有选自微粉碎，碾磨，造粒的高炉渣，飞灰，硅灰，偏高岭土，焚烧纸浆泥灰，焚烧污泥，灰渣和废玻璃中的一种或两种以上 粉末; 铁铝钙钙化合物与火山灰物质等的混合比例为10/1〜1/10质量％。 本发明还提供一种含有水泥和水泥外加剂的水泥组合物。

公开(公告)号：US20130062107A1

公开(公告)日：2013-03-14

申请号：US13698539

申请日：2011-12-09

申请人： Takayuki Higuchi ,  Shogo Hirai ,  Tsuyoshi Himori ,  Hiroyuki Ishitomi

发明人： Takayuki Higuchi ,  Shogo Hirai ,  Tsuyoshi Himori ,  Hiroyuki Ishitomi

IPC分类号： H05K1/09 ,  H05K3/46

CPC分类号： H05K3/4069 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425 ,  H05K2203/043 ,  H01L2924/00

摘要： Disclosed is a multilayer wiring board having via-hole conductors for connecting a first copper wiring and a second copper wiring, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region including a link of copper particles as a path for electrically connecting the first and second copper wirings; a second metal region mainly composed of at least one selected from tin, a tin-copper alloy, and a tin-copper intermetallic compound; and a third region mainly composed of bismuth. The copper particles forming the link are in plane-to-plane contact with one another. At least one of the first copper wiring and the second copper wiring is in plane-to-plane contact with the copper particles, and the portion where there is such a plane-to-plane contact is covered with at least a part of the second metal region.

摘要翻译： 公开了一种具有用于连接第一铜布线和第二铜布线的通孔导体的多层布线板，所述通孔导体包括金属部分和树脂部分。 金属部分包括第一金属区域，其包括作为用于电连接第一和第二铜布线的路径的铜颗粒的连接; 主要由选自锡，锡 - 铜合金和锡 - 铜金属间化合物中的至少一种组成的第二金属区域; 和主要由铋组成的第三区域。 形成连接件的铜粒子彼此面对面接触。 所述第一铜布线和所述第二铜布线中的至少一个与所述铜粒子平面接触，并且所述第二铜布线和所述第二铜布线中的至少一个与所述铜粒子平面接触，并且所述第二铜布线和所述第二铜布线的至少一部分被覆盖有所述第二铜布线 金属区域。

公开(公告)号：US20120318172A1

公开(公告)日：2012-12-20

申请号：US13581573

申请日：2010-11-25

申请人： Taiichiro Mori ,  Kazuto Tabara ,  Kenji Yamamoto ,  Minoru Morioka ,  Takayuki Higuchi

发明人： Taiichiro Mori ,  Kazuto Tabara ,  Kenji Yamamoto ,  Minoru Morioka ,  Takayuki Higuchi

IPC分类号： C04B14/00 ,  C04B14/22 ,  C04B14/10 ,  C04B18/06 ,  C04B28/08

CPC分类号： C04B28/02 ,  C01G49/0036 ,  C01G49/0045 ,  C01P2002/72 ,  C04B7/32 ,  C04B22/0093 ,  C04B2111/26 ,  Y02W30/92 ,  Y02W30/94 ,  C04B2103/0088 ,  C04B14/106 ,  C04B14/22 ,  C04B18/08 ,  C04B18/10 ,  C04B18/141 ,  C04B18/146

摘要： It is the object of the invention to provide a cement admixture, and a cement composition that can impart good enough rustproofness to reinforcing bars in hardened cement concrete, and can have resistance to penetration of chloride ions entering from the outside, prevent the hardened cement concrete from getting porous due to reduced leaching of Ca ions and have a self-recovery capability.The invention provides a cement admixture characterized by containing a calcium ferroaluminate compound comprising a CaO—Al2O3—Fe2O3 system, and having a Fe2O3 content of 0.5 to 15% by mass and a CaO.2Al2O3 structure with a CaO/Al2O3 molar ratio ranging from 0.15 to 0.7. It is preferable that the fineness is 2,000 to 7,000 cm2/g as represented in terms of the Blaine's specific surface area value; the potentially hydraulic substance and/or pozzolan substance (pozzolan substance or the like) is also used; the pozzolan substance or the like contains one or two or more selected from the group consisting of finely pulverized, quenched, granulated blast-furnace slag, fly ash, silica fume, metakaolin, incinerated pulp sludge ash, incinerated sewage sludge ash, and waste glass powder; and the blending proportion of the calcium ferroaluminate compound to the pozzolan substance or the like ranges from 10/1 to 1/10 by mass. The invention also provides a cement composition containing cement and the cement admixture.

摘要翻译： 本发明的目的是提供一种水泥混合物和一种能够赋予硬化水泥混凝土中的钢筋足够好的防锈性的水泥组合物，并且可以具有抵抗从外部进入的氯离子的渗透性，防止硬化的水泥混凝土 由于Ca离子的浸出减少而变得多孔，并且具有自恢复能力。 本发明提供一种水泥外加剂，其特征在于含有CaO-Al 2 O 3 -Fe 2 O 3体系的铁铝钙钙化合物，Fe 2 O 3含量为0.5〜15质量％，CaO / Al 2 O 3的CaO / Al 2 O 3结构为0.15 至0.7。 如Blaine的比表面积值所示，细度优选为2,000〜7000cm 2 / g; 还使用潜在的水力物质和/或火山灰物质（火山灰物质等）; 火山灰物质等含有选自微粉碎，碾磨，造粒的高炉渣，飞灰，硅灰，偏高岭土，焚烧纸浆泥灰，焚烧污泥，灰渣和废玻璃中的一种或两种以上 粉末; 铁铝钙钙化合物与火山灰物质等的混合比例为10/1〜1/10质量％。 本发明还提供一种含有水泥和水泥外加剂的水泥组合物。

公开(公告)号：US20110049439A1

公开(公告)日：2011-03-03

申请号：US12744994

申请日：2008-11-21

申请人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

发明人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

IPC分类号： H01B1/22 ,  H05K3/30

CPC分类号： H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部中形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

公开(公告)号：US20110020983A1

公开(公告)日：2011-01-27

申请号：US12933819

申请日：2009-03-30

申请人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

发明人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

IPC分类号： H01L23/14 ,  B32B3/00 ,  B32B37/10

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75304 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/249954 ,  H01L2924/00

摘要： A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.

摘要翻译： 倒装芯片安装装置在工具保护片（10）的加压膜（10b）侧具有屏蔽膜（18）。 当通过工具保护片（10）对半导体芯片（1）加热加压时，加压膜（10b）通过片材固定夹具（9）从模具中释放，并通过加压/加热工具 11）抵靠从半导体芯片（1）的周围突出的绝缘树脂膜（5），并施加外部压力使绝缘树脂膜（5）固化。

公开(公告)号：US07785500B2

公开(公告)日：2010-08-31

申请号：US12092453

申请日：2006-10-31

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

IPC分类号： H01B1/22 ,  C09J9/02

CPC分类号： C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

摘要翻译： 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

公开(公告)号：US20090301771A1

公开(公告)日：2009-12-10

申请号：US12477227

申请日：2009-06-03

申请人： Shozo Ochi ,  Kazuya Ushirokawa ,  Takayuki Higuchi

发明人： Shozo Ochi ,  Kazuya Ushirokawa ,  Takayuki Higuchi

IPC分类号： H05K1/16 ,  H05K1/11 ,  H01R43/02

CPC分类号： H05K3/4007 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/11552 ,  H01L2224/11554 ,  H01L2224/116 ,  H01L2224/11901 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/095 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09827 ,  H05K2203/0514 ,  H05K2203/1476 ,  Y10T29/49213 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

摘要： A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.

摘要翻译： 形成在电子部件的电极上的导电凸块。 导电凸块由在电极上形成有一层或多层的第一凸块组成，并且包括至少包含球形导电填料的树脂和形成在第一凸块的上表面上的第二凸块，并且包括含有 鳞片状导电填料。

公开(公告)号：US20090079706A1

公开(公告)日：2009-03-26

申请号：US12237434

申请日：2008-09-25

申请人： Yasuyuki Mishima ,  Setsuo Kobayashi ,  Takayuki Higuchi

发明人： Yasuyuki Mishima ,  Setsuo Kobayashi ,  Takayuki Higuchi

IPC分类号： G06F3/041

CPC分类号： G02F1/13338 ,  G02F2202/023 ,  G02F2202/28

摘要： In a display device having a touch panel, it is possible to prevent the generation of a screen defect caused by the intrusion of air bubbles into a UV curing resin formed between a touch panel and a display panel. The touch panel is constituted of an upper transparent-electrode-attached film and a lower transparent-electrode-attached film, and an air hole is formed in the lower transparent-electrode-attached film. Due to such constitution, in adhering the touch panel and the display panel to each other in a vacuum using a UV curing resin, air in the touch panel is also discharged and hence, there is no possibility that the touch panel swells. Accordingly, it is possible to prevent warping of the lower transparent-electrode-attached film and hence, in curing the UV curing resin for adhering the touch panel and the display panel to each other, it is possible to prevent the entanglement of air into the UV curing resin. Accordingly, a touch-panel attached display device free from a screen defect attributed to air bubbles can be manufactured.

摘要翻译： 在具有触摸面板的显示装置中，可以防止由触摸面板和显示面板之间形成的UV固化树脂中气泡的侵入而产生的屏幕缺陷。 触摸屏由上部透明电极附着膜和下部透明电极附着膜构成，并且在下部透明电极附着膜中形成空气孔。 由于这样的结构，在使用UV固化树脂的真空中将触摸面板和显示面板彼此粘合时，触摸面板中的空气也被排出，因此触摸面板不会膨胀。 因此，可以防止下部透明电极附着膜发生翘曲，因此，在将触摸面板和显示面板粘接的UV固化树脂固化的同时，可以防止空气的缠结 UV固化树脂。 因此，可以制造不伴有气泡的屏幕缺陷的触摸面板附接显示装置。

公开(公告)号：US20080282936A1

公开(公告)日：2008-11-20

申请号：US11923010

申请日：2007-10-24

申请人： Minoru MORIOKA ,  Takayuki Higuchi ,  Hiroyuki Ohashi ,  Yasuhiro Nakashima

发明人： Minoru MORIOKA ,  Takayuki Higuchi ,  Hiroyuki Ohashi ,  Yasuhiro Nakashima

IPC分类号： C04B28/04 ,  C04B28/26 ,  C04B7/14 ,  C04B7/02 ,  C04B28/00 ,  C04B28/08

CPC分类号： C04B14/042 ,  C04B14/043 ,  C04B28/08 ,  C04B28/082 ,  C04B2111/10 ,  C04B2111/1068 ,  C04B2111/22 ,  C04B20/008 ,  C04B2103/0089 ,  C04B7/02

摘要： A cement admixture and a cement composition having a carbonation suppressing effect and a heat-of-hydration suppressing effect are provided. A cement admixture containing one or more non-hydraulic compounds selected from the group consisting of γ-2CaO.SiO2, α-CaO.SiO2 and calcium magnesium silicate, a cement composition containing said admixture, and a carbonation suppressing method by use of said cement admixture or cement composition. According to the present invention, a remarkable carbonation suppressing effect can be obtained particularly when used in portland blast-furnace slag cement. This leads to an effective use of steelmaking slag and the like, and the load of clinker can be reduced, so that a cement composition of a low environmental load type can be attained. Further, this is suitable for cements in conformity with the EN standards, which are used in civil engineering and building industries.

摘要翻译： 提供了具有碳酸化抑制效果和水合热抑制效果的水泥混合物和水泥组合物。 含有一种或多种非水力化合物的水泥混合物，其选自γ-2CaO，SiO 2，α-CaO，SiO 2和硅酸钙镁， 含有所述混合物的水泥组合物和使用所述水泥掺合剂或水泥组合物的碳酸化抑制方法。 根据本发明，特别是当用于波特兰高炉矿渣水泥时，可以获得显着的碳酸化抑制效果。 这导致有效地利用炼钢炉渣等，并且可以减少熟料的负荷，从而可以获得低环境负荷型的水泥组合物。 此外，这适用于符合在土木工程和建筑行业使用的EN标准的水泥。

公开(公告)号：US20060141862A1

公开(公告)日：2006-06-29

申请号：US10529336

申请日：2003-09-11

申请人： Yukifumi Machida ,  Shinji Yamaguchi ,  Yoshikazu Tanaka ,  Takayuki Higuchi

发明人： Yukifumi Machida ,  Shinji Yamaguchi ,  Yoshikazu Tanaka ,  Takayuki Higuchi

IPC分类号： H01R13/40

CPC分类号： H01R13/4365 ,  H01R13/4223 ,  H01R43/26

摘要： Upon releasing a locking arm from a connecting terminal by inserting a jig through a front holder, the jig could not be erroneously inserted into a terminal inserting hole. Connecting terminals 15 are inserted into a housing 11, and the connecting terminals are prevented from being pulled out of the housing backwardly by means of locking arms 13 arranged above the respective connecting terminals 15. The front holder is engaged with the housing by a clamping mechanism in an axial direction and is movable laterally in a direction perpendicular to the axial direction. A pair of a terminal inserting hole 17 and an arm operating hole 18 provided for respective connecting terminals are shifted laterally. In a first position of the front holder 16, the terminal inserting hole 17 is aligned with an axial line of a female-type connecting terminal 15, but the arm operating hole 18 is shifted laterally from the locking arm.

摘要翻译： 通过将夹具插入前支架而从连接端子释放锁定臂时，夹具不能错误地插入端子插入孔中。 连接端子15被插入壳体11中，并且通过设置在相应的连接端子15上方的锁定臂13防止连接端子从壳体向后拉出。前保持器通过夹紧机构与壳体接合 在轴向方向上可以沿与轴向垂直的方向横向移动。 为各连接端子设置的一对端子插入孔17和臂操作孔18横向移动。 在前保持器16的第一位置，端子插入孔17与阴型连接端子15的轴线对齐，但臂操作孔18从锁定臂横向移位。