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公开(公告)号：US20160176045A1
公开(公告)日：2016-06-23
申请号：US15054977
申请日：2016-02-26
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
IPC: B25J9/10 , B25J15/00 , H01L23/00 , H01L21/677 , H01L21/68 , B25J7/00 , H01L21/683
CPC classification number: B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20140241843A1
公开(公告)日：2014-08-28
申请号：US13776158
申请日：2013-02-25
Applicant: LUXVUE TECHNOLOGY CORPORATION
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20120247664A1
公开(公告)日：2012-10-04
申请号：US13184084
申请日：2011-07-15
Applicant: Kazuhiko KOBAYASHI
Inventor： Kazuhiko KOBAYASHI
CPC classification number: H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75102 , H01L2224/75252 , H01L2224/753 , H01L2224/75313 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/755 , H01L2224/75502 , H01L2224/75704 , H01L2224/75755 , H01L2224/75756 , H01L2224/75804 , H01L2224/7598 , H01L2224/75984 , H01L2224/81048 , H01L2224/8109 , H01L2224/81093 , H01L2224/83048 , H01L2224/8309 , H01L2224/83093 , H01L2224/83855 , H01L2224/9211 , H01L2224/95093 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/15787 , H01L2924/00
Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
Abstract translation: 接合装置能够有效地增加衬底的温度并减少在将半导体器件倒装芯片接合到衬底的工艺中位置间隙的发生和连接不良。 接合装置包括：用于支撑基板的支撑单元，半导体器件已经通过非导电粘附在该基板上; 以及用于加热和加压基板的加热/加压单元，加热/加压单元具有内置的热源和夹紧面，由支撑单元支撑的基板被压在该加热/加压单元上。 由支撑单元支撑的基板朝向加热/加压单元的夹紧面移动，以便通过辐射热预热基板和半导体器件。 然后，将半导体器件按压到加热/加压单元的夹紧面上，以固化不导电粘合剂并将半导体器件的凸起接合到衬底的端子部分。
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公开(公告)号：US20240014167A1
公开(公告)日：2024-01-11
申请号：US18021807
申请日：2020-08-19
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA
CPC classification number: H01L24/75 , B23K1/0016 , B23K3/087 , H01L2224/75984 , H01L2224/75744 , H01L2224/75755 , H01L2224/7598 , B23K2101/40
Abstract: A bonding system (90) is provided with a bonding device (80) for bonding semiconductor chips (45) to individual substrates (41), and a substrate holder (10) for holding the individual substrates (41), the bonding device (80) being provided with a stage (31) for fixing, by suction, the substrate holder (10) on a placement surface (13a), the substrate holder (10) being provided with a plate-shaped base (11) and a positioning member (21) that is provided on the base (11) and that defines the position of the individual substrates (41), the base (11) having an upper surface (11a) on which the individual substrates (41) are placed and a lower surface (11b) that is fixed by suction onto the placement surface (31a).
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公开(公告)号：US09308649B2
公开(公告)日：2016-04-12
申请号：US13776158
申请日：2013-02-25
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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Patent Agency Ranking
公开(公告)号：US20130260534A1
公开(公告)日：2013-10-03
申请号：US13437309
申请日：2012-04-02
Applicant: Vijayeshwar D. Khanna , Sri M. Sri-Jayantha
Inventor： Vijayeshwar D. Khanna , Sri M. Sri-Jayantha
CPC classification number: H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75272 , H01L2224/75744 , H01L2224/75984 , H01L2224/81191 , H01L2224/81815 , H01L2225/06513 , H01L2225/06568 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/15787 , H01L2924/351 , H01L2924/3511 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: A method is provided for bonding a semiconductor chip to a packaging substrate while minimizing the variation in the solder ball heights and controlling the stress in the solder balls and the stress in the packaging substrate. During the solder reflow, the warp of the packaging substrate, including the absolute warp, thermal warp, and substrate to substrate variations of the warp, is constrained at a minimal level by providing a clamping constraint to the packaging substrate. During cool down of the solder balls, the stresses and strains of the solder joints are maintained at levels that do not cause tear of the solder joints or breakage of the packaging substrate by removing the clamping constraint. Thus, the bonding process provides both uniform solder height with minimized solder non-wets and stress minimization of the solder balls and the packaging substrate.
Abstract translation: 提供了一种用于将半导体芯片接合到封装衬底同时最小化焊球高度的变化并控制焊球中的应力和封装衬底中的应力的方法。 在焊料回流期间，通过向包装衬底提供夹持约束，将包括绝对翘曲，热翘曲以及衬底与衬底对翘曲的变化的包装衬底的翘曲限制在最小水平。 在焊球冷却期间，焊接接头的应力和应变被保持在不会由于消除夹紧约束而引起焊点的撕裂或包装基板破裂的程度。 因此，接合过程提供均匀的焊料高度，并且使焊料球和封装衬底的最小化焊接非湿润和应力最小化。
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公开(公告)号：US20240047410A1
公开(公告)日：2024-02-08
申请号：US18126858
申请日：2023-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngja KIM
CPC classification number: H01L24/75 , H01L24/97 , H01L24/81 , B23K1/0016 , B23K1/015 , B23K3/087 , B23K3/047 , H01L2224/75272 , H01L2224/75804 , H01L2224/75984 , H01L2224/7598 , H01L2224/97 , H01L2224/95092 , H01L2224/81092 , H01L2224/759 , H01L2224/81815 , H01L2224/81211 , H01L2224/81908 , H01L21/561
Abstract: A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.
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公开(公告)号：US11848301B2
公开(公告)日：2023-12-19
申请号：US18128449
申请日：2023-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jonggu Lee , Sunghyup Kim , Byungjo Kim , Sanghoon Lee , Sukwon Lee , Sebin Choi
CPC classification number: H01L24/75 , B29C65/30 , B29C66/8185 , H01L2224/75252 , H01L2224/75502 , H01L2224/75745 , H01L2224/75984
Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
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公开(公告)号：US09016342B2
公开(公告)日：2015-04-28
申请号：US13184084
申请日：2011-07-15
Applicant: Kazuhiko Kobayashi
Inventor： Kazuhiko Kobayashi
CPC classification number: H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75102 , H01L2224/75252 , H01L2224/753 , H01L2224/75313 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/755 , H01L2224/75502 , H01L2224/75704 , H01L2224/75755 , H01L2224/75756 , H01L2224/75804 , H01L2224/7598 , H01L2224/75984 , H01L2224/81048 , H01L2224/8109 , H01L2224/81093 , H01L2224/83048 , H01L2224/8309 , H01L2224/83093 , H01L2224/83855 , H01L2224/9211 , H01L2224/95093 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/15787 , H01L2924/00
Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
Abstract translation: 接合装置能够有效地增加衬底的温度并减少在将半导体器件倒装芯片接合到衬底的工艺中位置间隙的发生和连接不良。 接合装置包括：用于支撑基板的支撑单元，半导体器件已经通过非导电粘附在该基板上; 以及用于加热和加压基板的加热/加压单元，加热/加压单元具有内置的热源和夹紧面，由支撑单元支撑的基板被压在该加热/加压单元上。 由支撑单元支撑的基板朝向加热/加压单元的夹紧面移动，以便通过辐射热预热基板和半导体器件。 然后，将半导体器件按压到加热/加压单元的夹紧面上，以固化不导电粘合剂并将半导体器件的凸起接合到衬底的端子部分。
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10.发明授权公开(公告)号：US06991703B2
公开(公告)日：2006-01-31
申请号：US10668483
申请日：2003-09-22
Applicant: Takeshi Ootsuka , Mamoru Kosakai
Inventor： Takeshi Ootsuka , Mamoru Kosakai
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L24/75 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75724 , H01L2224/75725 , H01L2224/75984 , H01L2224/75985 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/14 , Y10T29/53178 , H01L2224/05624 , H01L2924/00014 , H01L2224/05644
Abstract: A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.
Abstract translation: 提供了一种接合方法，其中电子部件通过凸块连接到基板，电子部件被封装在基板上。 封装电子部件的基板的表面，与基板连接的电子部件的表面和凸部的表面进行等离子体处理。 随后，将凸块加热到低于凸块的熔点的温度，并且基板和电子部件经由凸块压接。
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