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公开(公告)号：US20240049400A1
公开(公告)日：2024-02-08
申请号：US18127531
申请日：2023-03-28
发明人： Youngja KIM , Donguk KWON , Youngmin LEE , Byungkeun KANG , Gongmyeong KIM , Chaein MOON
CPC分类号： H05K3/3494 , H01L24/13 , H05K3/3447 , H01L2224/81815
摘要： A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a plurality of vapor passage holes that penetrate the substrate; disposing the electronic components on the substrate via bumps; heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state; supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state.
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公开(公告)号：US20230039736A1
公开(公告)日：2023-02-09
申请号：US17746454
申请日：2022-05-17
发明人： Youngja KIM , Hyunggil BAEK , Younhwan SHIN
摘要： A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.
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公开(公告)号：US20210111094A1
公开(公告)日：2021-04-15
申请号：US17019522
申请日：2020-09-14
发明人： Youngja KIM , Yongjin KIM
IPC分类号： H01L23/367 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/10
摘要： A semiconductor package includes a circuit substrate including a ground pad. At least one semiconductor chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. An encapsulation layer encapsulates the at least one semiconductor chip. A heat spreader surrounds the encapsulation layer. The heat spreader includes a side heat spreader disposed on a first surface of the circuit substrate and lateral side surfaces of the encapsulation layer. The side heat spreader is connected to the ground pad. A surface heat spreader is disposed on an upper surface of the encapsulation layer.
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公开(公告)号：US20240363579A1
公开(公告)日：2024-10-31
申请号：US18588268
申请日：2024-02-27
发明人： Seungyeop OH , Youngja KIM
CPC分类号： H01L24/75 , B23K1/012 , B23K3/0471 , B23K3/087 , H01L24/16 , H01L24/81 , B23K2101/40 , H01L23/3121 , H01L2224/16227 , H01L2224/75272 , H01L2224/75651 , H01L2224/75652 , H01L2224/81815
摘要： A solder reflow apparatus may include a vapor generating chamber configured to accommodate a heat transfer fluid, a heater configured to heat the heat transfer fluid, a vertical transfer portion, and at least one substrate stage. The vertical transfer portion may include a vertical conveyer supported by a driving pulley and a driven pulley so as to be rotatable in an endless track, the vertical conveyer having a conveying route of a descending path and an ascending path in the vapor generating chamber, and at least one substrate stage fixedly fastened to one side of the vertical conveyor by a fastening portion so as to be raised and lowered in the vapor generating chamber by rotation of the vertical conveyor. The at least one substrate stage may be configured to support a substrate on which an electronic component may be mounted via a solder.
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公开(公告)号：US20240113067A1
公开(公告)日：2024-04-04
申请号：US18136416
申请日：2023-04-19
发明人： Youngja KIM
CPC分类号： H01L24/75 , B23K1/0016 , B23K1/008 , B23K1/015 , B23K3/087 , B23K2101/40
摘要： A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.
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公开(公告)号：US20240047411A1
公开(公告)日：2024-02-08
申请号：US18127513
申请日：2023-03-28
发明人： Junga LEE , Youngja KIM , Hyunki KIM , Youngmin LEE
CPC分类号： H01L24/75 , B23K1/015 , B23K1/0016 , B23K3/047 , B23K2101/40
摘要： An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.
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公开(公告)号：US20240145259A1
公开(公告)日：2024-05-02
申请号：US18201932
申请日：2023-05-25
发明人： Youngja KIM
IPC分类号： H01L21/60 , H01L21/677 , H01L21/687
CPC分类号： H01L21/60 , H01L21/67778 , H01L21/68764 , H01L2021/6003 , H01L2021/60135
摘要： A solder reflow apparatus may include a reflow chamber receiving a heat transfer fluid. The heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate. A heater heats the heat transfer fluid in the reflow chamber. A rail is arranged in an upper region of the reflow chamber and extends along a horizontal direction. A stage module may be movably connected to the rail and supports the substrate. The controller controls a positioning of the stage module to move the substrate supported by the stage module to different heights in a vertical direction.
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公开(公告)号：US20240047410A1
公开(公告)日：2024-02-08
申请号：US18126858
申请日：2023-03-27
发明人： Youngja KIM
CPC分类号： H01L24/75 , H01L24/97 , H01L24/81 , B23K1/0016 , B23K1/015 , B23K3/087 , B23K3/047 , H01L2224/75272 , H01L2224/75804 , H01L2224/75984 , H01L2224/7598 , H01L2224/97 , H01L2224/95092 , H01L2224/81092 , H01L2224/759 , H01L2224/81815 , H01L2224/81211 , H01L2224/81908 , H01L21/561
摘要： A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.
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