公开(公告)号：US20230039736A1

公开(公告)日：2023-02-09

申请号：US17746454

申请日：2022-05-17

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Youngja KIM ,  Hyunggil BAEK ,  Younhwan SHIN

IPC分类号： B28D5/02 ,  C01B32/25

摘要： A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.