发明授权
- 专利标题： Bonding tool
- 专利标题（中）： 粘合工具
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申请号： US715188申请日： 1996-09-17
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公开(公告)号： US5823419A公开(公告)日： 1998-10-20
- 发明人: Shigeru Ichikawa
- 申请人： Shigeru Ichikawa
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-263491 19950918
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; B23K20/00 ; B23K3/00
摘要：
A bonding tool used in a bonding apparatus for bonding, for example, pellet and leads of a lead frame including a tool attachment part to which a tool member is mounted. The tool member has four inclined surfaces, and the tool attachment part includes two fixed guide members and two detachable guide members fastened to the tool attachment part by bolts. Inclined surfaces that position two adjacent inclined surfaces of the tool member are formed on the fixed guide members, and inclined surfaces that position the other two inclined surfaces of the tool member are formed on the detachable guide members. The tool member is mounted on and dismounted from the tool attachment part by merely removing the detachable guide members.
公开/授权文献
- US4643874A Method of making a titanium-containing hydrogen storage alloy 公开/授权日：1987-02-17
信息查询
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