公开(公告)号：US20160190087A1

公开(公告)日：2016-06-30

申请号：US14584889

申请日：2014-12-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua YU ,  HsiaoYun LO ,  Yi-Hsiu CHEN ,  Wen-Chih CHIOU

IPC分类号： H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/7501 ,  H01L2224/75304 ,  H01L2224/75305 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/8013 ,  H01L2224/80132

摘要： A chip-stacking apparatus for stacking a chip on a substrate is provided. The chip-stacking apparatus includes a substrate support configured to carry the substrate and a transport device configured to dispose a chip to the substrate. The transport device includes a bond head including a bond base and an attaching element disposed on the bond base and configured to allow the chip to be attached thereon. The center area of the attaching element is higher than an edge area of the attaching element relative to the bond base.

摘要翻译： 提供了一种用于在基板上堆叠芯片的芯片堆叠装置。 芯片堆叠装置包括被配置为承载基板的基板支撑件和配置成将芯片配置到基板的输送装置。 输送装置包括：接合头，其包括接合基底和设置在接合基底上并被配置为允许芯片附接在其上的附接元件。 附着元件的中心区域比附着元件相对于接合基座的边缘区域高。