公开(公告)号：US12027401B2

公开(公告)日：2024-07-02

申请号：US17203036

申请日：2021-03-16

申请人： Samsung Electronics Co., Ltd.

发明人： Gwanghee Jo ,  Dongjoo Moon ,  Siwoong Woo ,  Sunjung Kim ,  Donggil Shim ,  Huijae Kim ,  Seungdae Seok

IPC分类号： H01L21/68 ,  G03F7/00 ,  H01L21/677 ,  H01L21/683

CPC分类号： H01L21/68 ,  G03F7/70775 ,  H01L21/67742 ,  H01L21/683 ,  H01L2224/75701 ,  H01L2224/75703

摘要： A semiconductor substrate alignment device includes: a lower chuck; a lower chuck driving unit; an upper chuck above and overlapping the lower chuck; observation windows in the upper chuck, imaging units respectively configured to irradiate light through the observation windows and to obtain images by detecting light reflected from the semiconductor substrates; a distance sensor configured to detect a distance between an edge of the lower chuck and an edge of the upper chuck; and a control unit configured to identify first and second alignment keys from images of first and second semiconductor substrates, determine an alignment error value of the first and second semiconductor substrates, and compensate for the alignment error value by driving the lower chuck driving unit.

公开(公告)号：US20230163094A1

公开(公告)日：2023-05-25

申请号：US17988469

申请日：2022-11-16

申请人： Samsung Electronics Co., Ltd.

发明人： Euisun Choi ,  Huijae Kim ,  Mingu Lee ,  Hyeonggyun Cheong ,  Yunpyo Hong

IPC分类号： H01L23/00

CPC分类号： H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/7592 ,  H01L2224/8018 ,  H01L2224/08221 ,  H01L2224/8318 ,  H01L2224/32221 ,  H01L2224/75304 ,  H01L2224/75312 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/80093 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83093 ,  H01L2224/83201 ,  H01L2224/83908

摘要： A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.