- 专利标题： Semiconductor substrate alignment device and a semiconductor substrate bonding system using the same
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申请号： US17203036申请日： 2021-03-16
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公开(公告)号： US12027401B2公开(公告)日： 2024-07-02
- 发明人: Gwanghee Jo , Dongjoo Moon , Siwoong Woo , Sunjung Kim , Donggil Shim , Huijae Kim , Seungdae Seok
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR 20200111052 2020.09.01
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; G03F7/00 ; H01L21/677 ; H01L21/683
摘要：
A semiconductor substrate alignment device includes: a lower chuck; a lower chuck driving unit; an upper chuck above and overlapping the lower chuck; observation windows in the upper chuck, imaging units respectively configured to irradiate light through the observation windows and to obtain images by detecting light reflected from the semiconductor substrates; a distance sensor configured to detect a distance between an edge of the lower chuck and an edge of the upper chuck; and a control unit configured to identify first and second alignment keys from images of first and second semiconductor substrates, determine an alignment error value of the first and second semiconductor substrates, and compensate for the alignment error value by driving the lower chuck driving unit.
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