发明申请
- 专利标题： LASER ASSISTED TRANSFER WELDING PROCESS
- 专利标题（中）： 激光辅助传输焊接工艺
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申请号： US14879581申请日： 2015-10-09
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公开(公告)号： US20160190091A1公开(公告)日： 2016-06-30
- 发明人: Etienne Menard , Matthew Meitl , John A. Rogers
- 申请人： Semprius, Inc. , The Board of Trustees of the University of Illinois
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/78
摘要：
A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.
公开/授权文献
- US10181483B2 Laser assisted transfer welding process 公开/授权日：2019-01-15
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