公开(公告)号：US20240170442A1

公开(公告)日：2024-05-23

申请号：US17989775

申请日：2022-11-18

申请人： ASMPT Singapore Pte. Ltd.

发明人： Yiu Ming CHEUNG ,  Man Hon CHENG ,  Siu Cheung SO ,  So Ying KWOK ,  Ming LI

IPC分类号： H01L23/00

CPC分类号： H01L24/80 ,  H01L24/08 ,  H01L24/74 ,  H01L2224/0801 ,  H01L2224/08059 ,  H01L2224/08245 ,  H01L2224/80031 ,  H01L2224/80099 ,  H01L2224/8018 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80907 ,  H01L2224/80948 ,  H01L2924/10253 ,  H01L2924/1511 ,  H01L2924/1515 ,  H01L2924/15738

摘要： When locating a semiconductor die on a substrate, the die is picked up and carried with a die-holding surface of a bonding tool having a protrusion. The protrusion of the bonding tool is configured to be movable between a retracted position within the die-holding surface and an extended position protruding from the die-holding surface. When the protrusion is located in the extended position, the die is bent when the bonding tool is carrying the die. Thereafter, the bonding tool is moved to flatten the die against the substrate while the substrate urges the protrusion to retract from the extended position towards the retracted position.