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公开(公告)号：US20230207379A1
公开(公告)日：2023-06-29
申请号：US17928134
申请日：2020-06-29
IPC分类号： H01L21/687 , H01L23/00
CPC分类号： H01L21/68785 , H01L24/83 , H01L2224/83894
摘要： A substrate holder for curving a substrate
the substrate holding including a fixing plate for fixing the substrate,
curving means for curving the fixing plate,
wherein the fixing plate is constituted such that the curvature of the substrate can be adjusted in a targeted manner, as well as a corresponding method.-
公开(公告)号：US20200227299A1
公开(公告)日：2020-07-16
申请号：US16830389
申请日：2020-03-26
IPC分类号： H01L21/68 , H01L21/67 , H01L23/544
摘要： A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
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公开(公告)号：US20200168580A1
公开(公告)日：2020-05-28
申请号：US16632643
申请日：2017-09-21
IPC分类号： H01L23/00 , H01L21/67 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
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公开(公告)号：US20150228521A1
公开(公告)日：2015-08-13
申请号：US14693074
申请日：2015-04-22
CPC分类号： H01L21/68 , H01L21/67092 , H01L21/67288 , H01L21/683 , H01L22/12
摘要： A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
摘要翻译： 一种用于接收和安装由安装表面组成的晶片的接收装置，用于将晶片安装在安装表面上的安装装置和用于主动地，局部可控地补偿晶片局部和/或全局失真的补偿装置。
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公开(公告)号：US20220301907A1
公开(公告)日：2022-09-22
申请号：US17631261
申请日：2019-08-23
摘要： A device and a method for the alignment of substrates. The device includes a first substrate holder for receiving a first substrate that has at least two alignment marks, a second substrate holder for receiving a second substrate that has at least two alignment marks, at least one alignment optic for detecting the alignment marks of the first and second substrates, and at least one positioning optic for detecting positioning marks, wherein the alignment marks of the first substrate and the alignment marks of the second substrate can be aligned with one another depending on the positioning marks. The method of alignment includes the steps of fixing the first and second substrates on respective first and second substrate holders, detecting alignment marks on the substrates, detecting positioning marks, and aligning the alignment marks of the substrates with one another in dependence on the positioning marks.
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公开(公告)号：US20220173068A1
公开(公告)日：2022-06-02
申请号：US17671732
申请日：2022-02-15
IPC分类号： H01L23/00 , H01L21/67 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.
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公开(公告)号：US20200027768A1
公开(公告)日：2020-01-23
申请号：US16321496
申请日：2016-08-12
IPC分类号： H01L21/68 , H01L21/683 , H01L21/67
摘要： A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.
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