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公开(公告)号：US20230207379A1
公开(公告)日：2023-06-29
申请号：US17928134
申请日：2020-06-29
IPC分类号： H01L21/687 , H01L23/00
CPC分类号： H01L21/68785 , H01L24/83 , H01L2224/83894
摘要： A substrate holder for curving a substrate
the substrate holding including a fixing plate for fixing the substrate,
curving means for curving the fixing plate,
wherein the fixing plate is constituted such that the curvature of the substrate can be adjusted in a targeted manner, as well as a corresponding method.-
公开(公告)号：US20230187259A1
公开(公告)日：2023-06-15
申请号：US17922505
申请日：2020-06-29
发明人： Thomas PLACH
IPC分类号： H01L21/687
CPC分类号： H01L21/68728
摘要： A substrate holder for mounting a substrate, comprising fixing elements for fixing the substrate, wherein the fixing elements can be grouped into zones, and a corresponding method.
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公开(公告)号：US20220173068A1
公开(公告)日：2022-06-02
申请号：US17671732
申请日：2022-02-15
IPC分类号： H01L23/00 , H01L21/67 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.
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公开(公告)号：US20200027768A1
公开(公告)日：2020-01-23
申请号：US16321496
申请日：2016-08-12
IPC分类号： H01L21/68 , H01L21/683 , H01L21/67
摘要： A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.
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公开(公告)号：US20220026196A1
公开(公告)日：2022-01-27
申请号：US17421267
申请日：2019-01-18
发明人： Dominik ZINNER , Jürgen MALLINGER , Thomas PLACH , Boris POVAZAY , Harald ROHRINGER , Jürgen Markus SÜSS
摘要： The invention relates to a measuring device for determining a course of a bonding wave in a gap (3) between a first substrate (2) and a second substrate (4).
Furthermore, the present invention relates to a corresponding method.-
公开(公告)号：US20200168580A1
公开(公告)日：2020-05-28
申请号：US16632643
申请日：2017-09-21
IPC分类号： H01L23/00 , H01L21/67 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
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