公开(公告)号：US11950373B2

公开(公告)日：2024-04-02

申请号：US16404293

申请日：2019-05-06

申请人： Lockheed Martin Corporation

发明人： Marc T. Angelucci ,  Anthony R. Niemczyk

IPC分类号： H05K3/10 ,  H01Q13/10 ,  H01Q21/00 ,  H01Q21/06 ,  H05K3/22 ,  H01Q13/08

CPC分类号： H05K3/101 ,  H01Q13/10 ,  H01Q21/0087 ,  H01Q21/064 ,  H05K3/22 ,  H01Q13/08 ,  H05K2203/061

摘要： A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.

公开(公告)号：US11728065B2

公开(公告)日：2023-08-15

申请号：US17374299

申请日：2021-07-13

申请人： Ticona LLC

发明人： Young Shin Kim

IPC分类号： H01B1/12 ,  H05K1/09 ,  H05K9/00 ,  H05K3/10

CPC分类号： H01B1/124 ,  H05K1/09 ,  H05K3/101 ,  H05K9/0083 ,  H05K2201/0141 ,  H05K2201/0329

摘要： A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.

公开(公告)号：US20170060299A1

公开(公告)日：2017-03-02

申请号：US15072958

申请日：2016-03-17

申请人： Samsung Display Co., Ltd.

发明人： Won Il CHOI ,  Je Won YOO ,  Jong Ho HONG ,  Hye Jin JOO

IPC分类号： G06F3/044 ,  H05K3/10 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC分类号： G06F3/044 ,  G06F2203/04103 ,  H05K1/0283 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/101 ,  H05K3/107

摘要： A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels.

摘要翻译： 一种触摸传感器，包括：第一基板，其沿第一方向延伸并且可以在其上形成并拉伸第一通道;第一导电液体，其注入到所述第一通道中;第二基板，沿与第一方向相交的第二方向延伸， 其上可以形成和拉伸第二通道，并将第二导电液体注入第二通道。

公开(公告)号：US09504142B2

公开(公告)日：2016-11-22

申请号：US14629697

申请日：2015-02-24

申请人： YAZAKI CORPORATION

发明人： Hisashi Hanazaki

IPC分类号： H05K1/02 ,  H01B7/08 ,  H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12

CPC分类号： H05K1/0263 ,  H01B7/0838 ,  H05K1/0265 ,  H05K1/028 ,  H05K1/0293 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/101 ,  H05K3/102 ,  H05K3/125 ,  H05K3/1275 ,  H05K2201/0305 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10181 ,  H05K2203/107

摘要： A flexible flat circuit includes a pair of insulation sheets, and a plurality of conductors that are held between and covered with the pair of insulation sheets in a state that the plurality of conductors are separated to each other. Among from the plurality of conductors, at least conductors with different current capacities are different in thickness to each other.

摘要翻译： 柔性扁平电路包括一对绝缘片，以及多个导体，其以多个导体彼此分离的状态保持在一对绝缘片之间并被其覆盖。 在多个导体中，至少具有不同电流容量的导体的厚度彼此不同。

公开(公告)号：US09256334B2

公开(公告)日：2016-02-09

申请号：US14403971

申请日：2013-05-28

申请人： NISSHA PRINTING CO., LTD.

发明人： Seiichi Yamazaki ,  Toshihiro Higashikawa ,  Tomohiro Matsuzaki ,  Masahiko Kariya

IPC分类号： H05K7/02 ,  G06F3/044 ,  H01R4/04 ,  H01Q1/40 ,  H01R43/24 ,  H01Q1/24 ,  B29C45/14 ,  H05K3/10 ,  G06F1/16 ,  H05K3/00 ,  H05K3/40 ,  B29L31/34 ,  H05K1/02

CPC分类号： G06F3/044 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14639 ,  B29C2045/14114 ,  B29L2031/3437 ,  B29L2031/3481 ,  G06F1/16 ,  G06F2203/04112 ,  H01Q1/243 ,  H01Q1/40 ,  H01R4/04 ,  H01R43/24 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/101 ,  H05K3/4015 ,  H05K7/02 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10318

摘要： An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.

摘要翻译： 提供了其中接触针和电极图案之间的电连接足够的注塑产品及其制造方法。 注塑产品包括：基膜; 形成在基膜上的电极图案; 导电粘合剂，其形成在电极图案的上表面上; 与导电粘合剂接触的接触销通过导电粘合剂电连接到电极图案，并且是导电的; 以及模塑树脂，其沿着基底膜注射成型，使得导电粘合剂和接触销的一部分被嵌入。

公开(公告)号：US20150305158A1

公开(公告)日：2015-10-22

申请号：US14258448

申请日：2014-04-22

申请人： David G. Findley

发明人： David G. Findley

IPC分类号： H05K1/16 ,  H05K3/46 ,  B29C67/00 ,  H05K1/03 ,  H05K1/02

CPC分类号： H05K1/162 ,  B28B1/001 ,  B29C64/165 ,  B32B18/00 ,  B33Y10/00 ,  B33Y80/00 ,  C04B35/528 ,  C04B35/532 ,  C04B35/571 ,  C04B2235/386 ,  C04B2235/404 ,  C04B2235/425 ,  C04B2235/427 ,  C04B2235/48 ,  C04B2235/483 ,  C04B2235/5288 ,  C04B2235/5292 ,  C04B2235/5454 ,  C04B2235/6026 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/76 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/101 ,  H05K2201/0323

摘要： According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.

摘要翻译： 根据一些实施例，一种装置包括由多晶金刚石制成的电路板。 电路板通过沉积聚（hydridocarbyne）层形成。 每层具有电路板横截面的几何形状。 电路板进一步通过在大于或等于100摄氏度和小于或等于800摄氏度的温度下热分解聚（hydridocarbyne）层而形成。 该装置还包括形成在电路板内的多个管。 这些管在电路板的一个或多个表面具有多个端接。 每个管包括可操作以允许每个管传导电流的石墨烯层。 每层石墨烯通过多晶金刚石电路板在大于或等于900摄氏度的温度下进行热解来形成。 每个管基本上是中空的，每层石墨烯形成相应管的外表面。

公开(公告)号：US20150103503A1

公开(公告)日：2015-04-16

申请号：US14403971

申请日：2013-05-28

申请人： NISSHA PRINTING CO., LTD.

发明人： Seiichi Yamazaki ,  Toshihiro Higashikawa ,  Tomohiro Matsuzaki ,  Masahiko Kariya

IPC分类号： H05K7/02 ,  H05K3/10

CPC分类号： G06F3/044 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14639 ,  B29C2045/14114 ,  B29L2031/3437 ,  B29L2031/3481 ,  G06F1/16 ,  G06F2203/04112 ,  H01Q1/243 ,  H01Q1/40 ,  H01R4/04 ,  H01R43/24 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/101 ,  H05K3/4015 ,  H05K7/02 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10318

摘要： An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.

摘要翻译： 提供了其中接触针和电极图案之间的电连接足够的注塑产品及其制造方法。 注塑产品包括：基膜; 形成在基膜上的电极图案; 导电粘合剂，其形成在电极图案的上表面上; 与导电粘合剂接触的接触销通过导电粘合剂电连接到电极图案，并且是导电的; 以及模塑树脂，其沿着基底膜注射成型，使得导电粘合剂和接触销的一部分被嵌入。

公开(公告)号：US20150062835A1

公开(公告)日：2015-03-05

申请号：US14102241

申请日：2013-12-10

申请人： Taiyo Yuden Co., Ltd.

发明人： Takehiko KAI ,  Eiji MUGIYA ,  Masaya SHIMAMURA ,  Kenzo KITAZAKI ,  Hiroshi NAKAMURA ,  Tetsuo SAJI

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0218 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/101 ,  H05K9/003 ,  H05K2201/0715 ,  Y10T29/4913

摘要： A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.

摘要翻译： 电路模块包括具有第一，第二和第三区域的安装表面的布线基板; 安装在所述区域上的多个电子部件; 绝缘密封层，其具有主表面和侧表面并且覆盖所述多个电子部件，所述主表面具有沟槽，所述沟槽沿着要沿着所述发散的区域之间的边界顺序地形成，并且具有朝向所述安装件的锥形形状 表面，所述侧表面围绕所述主表面形成; 以及具有第一和第二屏蔽部分并且包括导电树脂的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的侧表面并具有第一厚度，所述第二屏蔽部分设置在所述沟槽中，并且具有大于 第一厚度在第二屏蔽部分的总高度的一半的高度处。

公开(公告)号：US20140284076A1

公开(公告)日：2014-09-25

申请号：US14297715

申请日：2014-06-06

申请人： INTEGRAL TECHNOLOGIES, INC.

发明人： THOMAS AISENBREY

IPC分类号： H01M2/30 ,  H01B7/02 ,  H01B3/30

CPC分类号： H01M2/30 ,  B29C45/0001 ,  B29C45/0013 ,  B29C48/022 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3456 ,  B29L2031/3468 ,  B29L2031/36 ,  G06K19/07749 ,  H01B3/30 ,  H01B3/308 ,  H01B7/02 ,  H01B13/0036 ,  H01M2/00 ,  H01M10/6551 ,  H01Q1/1271 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49108

摘要： Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

摘要翻译： 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的等，或由金属如不锈钢，镍，铜，银，也可以是金属镀，或者 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20140251661A1

公开(公告)日：2014-09-11

申请号：US13784869

申请日：2013-03-05

申请人： RONALD STEVEN COK

发明人： RONALD STEVEN COK

IPC分类号： H05K1/02

CPC分类号： G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

摘要： A micro-channel structure having variable depths includes a substrate and a cured layer formed on the substrate. At least first and second micro-channels are embossed in the cured layer. The first micro-channel has a bottom surface defining a first depth and the second micro-channel has a bottom surface defining a second depth different from the first depth. A cured electrical conductor is making a micro-wire is formed in each of the first and second micro-channels over their respective bottom surfaces.

摘要翻译： 具有可变深度的微通道结构包括基板和形成在基板上的固化层。 至少第一和第二微通道在固化层中压花。 第一微通道具有限定第一深度的底表面，并且第二微通道具有限定不同于第一深度的第二深度的底表面。 固化的电导体正在使第一和第二微通道中的每一个在它们各自的底表面上形成微线。