公开(公告)号：US20240151902A1

公开(公告)日：2024-05-09

申请号：US17982907

申请日：2022-11-08

Applicant: University of South Florida

Inventor： Venkat Rama Bhethanabotla ,  Thomas M. Weller ,  Roger Brandon Tipton ,  John Townsend Bentley ,  Eduardo Antonio Rojas

IPC: G02B6/122 ,  B29C64/118 ,  B33Y10/00 ,  G02B6/138

CPC classification number: G02B6/1221 ,  B29C64/118 ,  B33Y10/00 ,  G02B6/138 ,  B29K2101/12

Abstract: A novel polymer optical waveguide and method of manufacturing is presented herein. A digitally manufactured process is described which utilizes a micro-dispensed UV optical adhesive as the contour guiding cladding, a fused deposition modeling technology for creating a core, and a subtractive laser process to finish the two ends of the optical interconnect. The optical waveguide can be printed directly on a circuit board in some embodiments. Alternatively, using a slightly modified process including a step to bond the optical fiber to the substrate, the optical interconnect can be manufactured on a flexible substrate.

公开(公告)号：US20190137661A1

公开(公告)日：2019-05-09

申请号：US16237536

申请日：2018-12-31

Applicant: HRL LABORATORIES, LLC

Inventor： Jacob M. Hundley ,  Zak C. Eckel ,  Sophia S. Yang ,  Alan J. Jacobsen ,  William Carter

IPC: G02B1/12 ,  G02B1/14 ,  G02B6/138

CPC classification number: G02B1/12 ,  G02B1/14 ,  G02B6/136 ,  G02B6/138 ,  Y10T428/24149

Abstract: Methods of manufacturing a structure having at least one plated region and at least one unplated region. The method includes plating a metal on a polymer structure having a first region accepting the metal and a second region unreceptive to the metal plating. The first region may include fully-cured polymer optical waveguides and the second region may include partially-cured polymer optical waveguides. The first region may include a first polymer composition and the second region may include a second polymer composition different than the first polymer composition.

公开(公告)号：US20180314002A1

公开(公告)日：2018-11-01

申请号：US15957230

申请日：2018-04-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yusuke Ono

IPC: G02B6/02 ,  G02B6/35 ,  G02B6/122

CPC classification number: G02B6/02333 ,  G02B6/122 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43

Abstract: There is provided an optical waveguide apparatus. The optical waveguide apparatus includes: a first clad layer; a core layer formed on the first clad layer; and a second clad layer formed on the first clad layer to cover the core layer. At least one of the first clad layer and the second clad layer includes a fully cured portion and a semi-cured portion.

公开(公告)号：US10073226B2

公开(公告)日：2018-09-11

申请号：US15307695

申请日：2015-05-15

Applicant: IMEC VZW

Inventor： Jeroen Missinne ,  Geert Van Steenberger

IPC: G02B6/10 ,  G02B6/42 ,  G02B6/30 ,  G02B6/138

CPC classification number: G02B6/421 ,  G02B6/138 ,  G02B6/30 ,  G02B6/4228 ,  G02B6/4239 ,  G02B6/4257

Abstract: A method for optically and mechanically coupling an optical fiber to an optical or optoelectronic component on a substrate is provided. The method comprises: providing an optical fiber comprising a core and a cladding, the core being exposed at an end face of the optical fiber; forming a polymer waveguide core on the end face, the polymer waveguide core extending from the fiber core; bringing the polymer waveguide core in proximity of the optical or optoelectronic component; providing a liquid optical material, the liquid optical material embedding the polymer waveguide core; and curing the liquid optical material, thereby forming a polymer cladding layer encapsulating the polymer waveguide core and mechanically attaching the optical fiber to the optical or optoelectronic component.

公开(公告)号：US20180239088A1

公开(公告)日：2018-08-23

申请号：US15692571

申请日：2017-08-31

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Sylvain Guerber ,  Charles Baudot ,  Florian Domengie

IPC: G02B6/122 ,  G02B6/26 ,  G02B6/30 ,  G02B6/43 ,  G02B6/138 ,  G02B6/13 ,  G02B6/14

CPC classification number: G02B6/1228 ,  G02B6/12002 ,  G02B6/126 ,  G02B6/13 ,  G02B6/138 ,  G02B6/14 ,  G02B6/262 ,  G02B6/305 ,  G02B6/43

Abstract: A photonic integrated circuit includes an optical coupling device situated between two successive interconnection metal levels. The optical coupling device includes a first optical portion that receives an optical signal having a transverse electric component in a fundamental mode and a transverse magnetic component. A second optical portion converts the transverse magnetic component of the optical signal into a converted transverse electric component in a higher order mode. A third optical portion separates the transverse electric component from the converted transverse electric component and switches the higher order mode to the fundamental mode. A fourth optical portion transmits the transverse electric component to one waveguide and transmits the converted transverse electric component to another waveguide.

公开(公告)号：US20180113385A1

公开(公告)日：2018-04-26

申请号：US15333117

申请日：2016-10-24

Applicant: HRL Laboratories, LLC

Inventor： Sophia S. Yang ,  Alan J. Jacobsen ,  Joanna A. Kolodziejska ,  Robert E. Doty ,  William Carter ,  Jacob M. Hundley

IPC: G03F7/20 ,  G02B6/138

CPC classification number: G02B6/138 ,  G03F7/0005 ,  G03F7/0037 ,  G03F7/201 ,  G03F7/2012

Abstract: A system for fabricating micro-truss structures. A reservoir holds a volume of a liquid photomonomer configured to polymerize to form a photopolymer when exposed to suitable light such as ultraviolet light. A mask at the bottom of the reservoir includes a plurality of apertures. Light enters the reservoir through each aperture from several directions, forming a plurality of self-guided photopolymer waveguides within the reservoir. The light is supplied by one or more sources of collimated light. A plurality of mirrors may reflect the light from a single source of collimated light to form a plurality of collimated beams, that illuminate the photomonomer in the reservoir, through the mask, from a corresponding plurality of directions, to form a micro-truss structure including a plurality of self-guided waveguide members.

公开(公告)号：US09951269B2

公开(公告)日：2018-04-24

申请号：US14683985

申请日：2015-04-10

Applicant: The General Hospital Corporation

Inventor： Seok-Hyun Yun ,  Malte C. Gather

IPC: H01S3/16 ,  C09K11/06 ,  G01N21/64 ,  G02B6/138 ,  H01S3/213 ,  H01S3/20 ,  G01N21/77 ,  G02B6/293 ,  H01S3/08 ,  H01S3/094 ,  H01S3/083

CPC classification number: C09K11/06 ,  C09K2211/10 ,  C09K2211/14 ,  G01N21/645 ,  G01N21/7746 ,  G02B6/138 ,  G02B6/29341 ,  H01S3/08022 ,  H01S3/08059 ,  H01S3/083 ,  H01S3/094034 ,  H01S3/094076 ,  H01S3/168 ,  H01S3/20 ,  H01S3/213

Abstract: In one exemplary embodiment, an apparatus can be provided which includes at least one biological medium that causes gain. According to another exemplary embodiment, an arrangement can be provided which is configured to be provided in an anatomical structure. This exemplary arrangement can include at least one emitter having a cross-sectional area of at most 10 microns within the anatomical structure, and which is configured to generate at least one laser radiation. In a further exemplary embodiment, an apparatus can be provided which can include at least one medium which is configured to cause gain; and at least one optical biological resonator which is configured to provide an optical feedback to the medium. In still another exemplary embodiment, a process can be whereas, a solution of an optical medium can be applied to a substrate. Further, it is possible to generate a wave guide having a shape that is defined by (i) at least one property of the solution of the optical medium, or (ii) drying properties thereof.

公开(公告)号：US09939578B2

公开(公告)日：2018-04-10

申请号：US13891543

申请日：2013-05-10

Applicant: Intel Corporation

Inventor： Peter L. D. Chang ,  Jai-Hung Tseng

IPC: G02B6/12 ,  G02B6/138 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/138 ,  G02B6/4204 ,  G02B6/4212 ,  G02B2006/12171 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: Planar lightwave circuits with a polymer coupling waveguide optically coupling a planar waveguide over a first region of a substrate to an optical component, such as a laser, affixed to a second region of the substrate. The coupling waveguide may be formed from a polymer layer applied over the planar waveguide and optical component such that any misalignment between the two may be accommodated by patterning the polymer into a waveguide having a first end aligned to an end of the planar waveguide and a second end aligned to an edge of the optical component. In embodiments, the polymer is photo-definable, such as a negative resist, and may be patterned through direct laser writing. In embodiments, the optical component is a thin film affixed to the substrate through micro-transfer printing. In other embodiments, the optical component is a semiconductor chip affixed to the substrate by flip-chip bonding.

公开(公告)号：US20170351042A1

公开(公告)日：2017-12-07

申请号：US15173328

申请日：2016-06-03

Applicant: International Business Machines Corporation

Inventor： Eric J. CAMPBELL ,  Joseph KUCZYNSKI ,  Timothy J. TOFIL

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/138

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/12019 ,  G02B6/122 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4257

Abstract: A circuit board substrate includes a reinforcing element embedded in a resin material. The reinforcing element includes an optical waveguide. The circuit board substrate can be used in electronic devices as a printed circuit board or the like. A circuit board substrate for use in electronic devices can be formed by embedding a reinforcing element comprising an optical waveguide in a resin. The optical waveguide can be coupled to optical signal transmission and reception elements to transmit an optical signal through the reinforcing element. The optical waveguide may be an optical fiber or the like in some examples.

公开(公告)号：US09831634B2

公开(公告)日：2017-11-28

申请号：US15342226

申请日：2016-11-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Hao Tseng ,  Ying-Hao Kuo ,  Kuo-Chung Yee

IPC: H01S5/026 ,  G02B6/12 ,  G02B6/138 ,  G02B6/122 ,  G02B6/132

CPC classification number: H01S5/026 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/132 ,  G02B6/138 ,  G02B2006/12121 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92244

Abstract: An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding compound layer over the LD die and the adhesive layer. The method still further includes curing the molding compound layer and partially removing the molding compound layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure.