TWO-DIMENSIONAL GRATING COUPLER AND METHODS OF MAKING SAME

    公开(公告)号:US20240361533A1

    公开(公告)日:2024-10-31

    申请号:US18769241

    申请日:2024-07-10

    CPC classification number: G02B6/34 G02B6/305

    Abstract: Disclosed are apparatus and methods for optical coupling. In one example, a method for forming an optical coupler, includes: forming an insulation layer on a semiconductor substrate; epitaxially growing a semiconductor material on the insulation layer to form a semiconductor layer; etching, according to a predetermined pattern, the semiconductor layer to form: an array of etched holes in the semiconductor layer to form a grating region, a first taper structure extending from a first side of the grating region, wherein a shape of the first taper structure in the semiconductor layer is a first triangle that is asymmetric about any line perpendicular to the first side of the grating region, and a second taper structure extending from a second side of the grating region, wherein a shape of the second taper structure in the semiconductor layer is a second triangle that is asymmetric about any line perpendicular to the second side of the grating region, wherein the first side and the second side are substantially perpendicular to each other; and depositing a dielectric material into the array of etched regions to form an array of scattering elements in the semiconductor layer, wherein the scattering elements are arranged to form a two-dimensional (2D) grating.

    OPTICAL COUPLER
    2.
    发明公开
    OPTICAL COUPLER 审中-公开

    公开(公告)号:US20240361530A1

    公开(公告)日:2024-10-31

    申请号:US18766541

    申请日:2024-07-08

    CPC classification number: G02B6/305

    Abstract: An optical coupler is provided. The optical coupler includes: a first optical structure, and a second optical structure disposed over the first optical structure. The first optical structure includes: a first substrate, a first cladding layer disposed on the first substrate, and a first waveguide disposed on the first cladding layer. The first waveguide includes a first coupling portion, and the first coupling portion including a first taper part. The second optical structure includes: a second substrate, a dielectric layer disposed on the second substrate; and a second waveguide disposed on the dielectric layer. The second waveguide includes a second coupling portion, and the second coupling portion including a second taper part. The second taper part is disposed on and optically coupled with the first taper part, and a taper direction of the first taper part is the same as a taper direction of the second taper part.

    TECHNIQUES FOR GRATING COUPLER AND EDGE COUPLER INTEGRATION

    公开(公告)号:US20240353625A1

    公开(公告)日:2024-10-24

    申请号:US18302224

    申请日:2023-04-18

    CPC classification number: G02B6/305

    Abstract: Some embodiments relate to an integrated chip (IC) including a handle substrate; a semiconductor layer comprising a grating coupler region and an edge coupler region; an insulative layer between the handle substrate and the semiconductor layer; a grating coupler in the grating coupler region comprising a plurality of trenches arranged in the semiconductor layer; and an edge coupler in the edge coupler region of the semiconductor layer including: a base structure having an end proximate to an edge of the insulative layer, and tapered sidewalls extending laterally from the end; and an upper structure extending over the base structure, the upper structure having an end proximate to the edge of the insulative layer, and tapered sidewalls extending laterally from the end between the tapered sidewalls of the base structure; where the handle substrate continuously extends from directly beneath the plurality of trenches to directly beneath the upper structure.

    OPTICAL COUPLER FOR VERTICAL OPTICAL COUPLING

    公开(公告)号:US20240248258A1

    公开(公告)日:2024-07-25

    申请号:US18157626

    申请日:2023-01-20

    CPC classification number: G02B6/305

    Abstract: An optical coupler and a method performed by the optical coupler are described. The optical coupler includes an interlayer dielectric, a waveguide disposed within the interlayer dielectric, and an epoxy disposed on the interlayer dielectric and in the first cavity such that the epoxy defines an upper surface and a bottom surface. The interlayer dielectric includes a first surface and a second surface coupled to the first surface. The first surface and the second surface define a first cavity in the interlayer dielectric. The waveguide emits an optical signal through the first surface. The bottom surface is positioned between the interlayer dielectric and the upper surface. The epoxy directs the optical signal from the first surface to the second surface. The second surface and the epoxy direct a first portion of the optical signal through the upper surface.

    PHOTONIC INTEGRATED CIRCUIT STRUCTURE
    5.
    发明公开

    公开(公告)号:US20240134123A1

    公开(公告)日:2024-04-25

    申请号:US18334291

    申请日:2023-06-13

    CPC classification number: G02B6/305

    Abstract: A photonic integrated circuit structure includes a substrate, a waveguide structure and a spot size converter. The waveguide structure is disposed over a surface of the substrate and has a receiving end. The spot size converter includes a concave mirror and a curved mirror. The concave mirror and the curved mirror are opposite to each other and have a common focus. The concave mirror is arranged to reflect a parallel beam from a transmitting end such that a first reflected beam is able to converge at the common focus, and the curved mirror is arranged to reflect the first reflected beam such that a second reflected beam is directed parallel to the receiving end of the waveguide structure.

    Assembly of an active semiconductor component and of a silicon-based passive optical component

    公开(公告)号:US11934007B2

    公开(公告)日:2024-03-19

    申请号:US17624922

    申请日:2020-07-03

    Abstract: An assembly of an active semiconductor component and of a silicon-based passive optical component includes a carrier; and the active semiconductor component and the passive optical component both arranged on the carrier. The active semiconductor component includes a first set of semiconductor layers comprising at least one first waveguide configured to guide, in a first section of the assembly, at least one first optical mode; a second set of semiconductor layers, the set being superposed and making contact with the first set of layers, and including at least one second waveguide configured to guide at least one second optical mode. At least some of the layers of the first set of layers and of the second set of layers are doped to form, in a first region of the component, a PIN diode. The at least one first waveguide and the at least one second waveguide are configured to allow evanescent coupling therebetween, in a second section of the assembly. The first set of layers is etched to form, in a second region of the active semiconductor component, a first surface flush with the second waveguide. The passive component includes a substrate; a set of silicon-compound layers comprising at least one waveguide configured to guide at least one optical mode. The at least one waveguide lies flush with a first surface of the set of layers, which surface is opposite a second surface of the set of layers making contact with a surface of the substrate. The first surface of the passive optical component makes contact with the first surface of the active semiconductor component in order to allow evanescent coupling between the at least one waveguide of the passive optical component and the at least one second waveguide of the active semiconductor component.

    Multi-tip optical coupling devices

    公开(公告)号:US11860421B2

    公开(公告)日:2024-01-02

    申请号:US17097270

    申请日:2020-11-13

    CPC classification number: G02B6/305 G02B6/262 G02B6/30

    Abstract: An optical system with different optical coupling device configurations and a method of fabricating the same are disclosed. An optical system includes a substrate, a waveguide disposed on the substrate, an optical fiber optically coupled to the waveguide, and an optical coupling device disposed between the optical fiber and the waveguide. The optical coupling device configured to optically couple the optical fiber to the waveguide. The optical coupling device includes a dielectric layer disposed on the substrate, a semiconductor tapered structure disposed in a first horizontal plane within the dielectric layer, and a multi-tip dielectric structure disposed in a second horizontal plane within the dielectric layer. The first and second horizontal planes are different from each other.

    SOURCE/DRAIN FEATURE SEPARATION STRUCTURE
    8.
    发明公开

    公开(公告)号:US20230375785A1

    公开(公告)日:2023-11-23

    申请号:US18362121

    申请日:2023-07-31

    Inventor: Shih-Wei Lin

    CPC classification number: G02B6/305 G02B6/1228

    Abstract: Structures and methods including a waveguide having a cladding layer surrounding a core layer disposed over a substrate, a cavity extending into the substrate adjacent the waveguide, a fiber disposed in the cavity, and an isolation space extending into the substrate and disposed under the waveguide. A plurality of holes may extend through the cladding layer adjacent the core layer.

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