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公开(公告)号：US10454165B2
公开(公告)日：2019-10-22
申请号：US15834263
申请日：2017-12-07
摘要： A radiating element for a radar array antenna comprising a ground plane, a first electrically conductive disk arranged at a first distance from and generally parallel to the ground plane, and a second electrically conductive disk arranged at a second distance from and generally parallel to the ground plane. An electrically conductive element extends along a central axis of the radiating element and conductively couples the ground plane, the first electrically conductive disk and the second electrically conductive disk. The radiating element further includes a first wing defining a first surface opposing the electrically conductive element that is arranged at a first distance from the central axis, and a second surface opposing the electrically conductive element that is arranged at a second distance, different from the first distance, from the central axis.
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公开(公告)号：US20190181547A1
公开(公告)日：2019-06-13
申请号：US15834263
申请日：2017-12-07
CPC分类号： H01Q1/523 , H01Q1/36 , H01Q1/48 , H01Q1/50 , H01Q3/26 , H01Q9/0414 , H01Q9/0428 , H01Q9/045 , H01Q21/06
摘要： A radiating element for a radar array antenna comprising a ground plane, a first electrically conductive disk arranged at a first distance from and generally parallel to the ground plane, and a second electrically conductive disk arranged at a second distance from and generally parallel to the ground plane. An electrically conductive element extends along a central axis of the radiating element and conductively couples the ground plane, the first electrically conductive disk and the second electrically conductive disk. The radiating element further includes a first wing defining a first surface opposing the electrically conductive element that is arranged at a first distance from the central axis, and a second surface opposing the electrically conductive element that is arranged at a second distance, different from the first distance, from the central axis.
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公开(公告)号：US10285277B1
公开(公告)日：2019-05-07
申请号：US14985727
申请日：2015-12-31
摘要： A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.
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公开(公告)号：US11355862B1
公开(公告)日：2022-06-07
申请号：US16706089
申请日：2019-12-06
摘要： An antenna includes at least one antenna element mounted on a substrate and extending normally thereto. The at least one antenna element is constructed from a plurality of antenna components, one of which is an upper antenna component that is furthest from the substrate. A support material surrounds the at least one antenna element and is disposed between the antenna components. A material layer is disposed on the upper antenna component and the support material. Heating elements may be interposed between the upper antenna component and the material layer, and an additional material layer, such as an ablative layer, may be disposed on the material layer.
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公开(公告)号：US20190181562A1
公开(公告)日：2019-06-13
申请号：US15834276
申请日：2017-12-07
摘要： A method of manufacturing a radiating element for a radar array antenna includes arranging a dielectric puck over a surface of a ground plane. A first conductive disk assembly is realized by forming a first conductive disk having a plurality of through holes, inserting a plurality of conductive posts through the plurality of holes, and attaching the plurality of conductive posts to the first conductive disk. The method further comprises arranging the first conductive disk assembly on the dielectric puck such that at least a portion of the plurality of conductive posts extend therethrough. A conductive rod is inserted through the first conductive disk and the dielectric puck, and a second conductive disk is attached thereto. At least one wing element is attached to the ground plane.
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公开(公告)号：US11950373B2
公开(公告)日：2024-04-02
申请号：US16404293
申请日：2019-05-06
CPC分类号： H05K3/101 , H01Q13/10 , H01Q21/0087 , H01Q21/064 , H05K3/22 , H01Q13/08 , H05K2203/061
摘要： A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.
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公开(公告)号：US20190261516A1
公开(公告)日：2019-08-22
申请号：US16404293
申请日：2019-05-06
摘要： A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.
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