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公开(公告)号：US20250023247A1
公开(公告)日：2025-01-16
申请号：US18219769
申请日：2023-07-10
Applicant: U.S. Army DEVCOM, Army Research Laboratory
Inventor： Amir I. Zaghloul , Quang M. Nguyen , Theodore K. Anthony , Gregory A. Mitchell
Abstract: We disclose an ultrawide-band (UWB) dual polarization three-dimensional (3D) tapered aperture Vivaldi antenna. It is generally comprised of a radiator having two pairs of tapering arms, each pair corresponding to a different polarization and the tapering arms spaced thereof closest to one another at a feed point location of the antenna and taper outwardly in opposite directions, thus forming a 3D Vivaldi antenna aperture therebetween; and a dual feed balun connecting to each of the two pairs of tapering arms and providing a separate channel for each of the polarizations. Embodiments of our antenna have been designed and simulated using full-wave electromagnetics commercial software. The results for our antennas demonstrate over 20:1 operating bandwidth with good radiation characteristics and very low cross polarization.
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公开(公告)号：US12183973B2
公开(公告)日：2024-12-31
申请号：US17972133
申请日：2022-10-24
Applicant: DENSO CORPORATION
Inventor： Yuuji Kakuya , Masakazu Ikeda , Kenichirou Sanji , Tomokazu Miyashita , Ryozou Fujii , Masashi Urabe , Hiromichi Naitoh
Abstract: An antenna device includes a ground plate which is a flat plate-shaped conductor member, an opposing conductive plate which is a flat plate-shaped conductor member installed at a predetermined distance from the ground plate and is electrically connected to a power supply line, and a plurality of short-circuit pins for electrically connecting the opposing conductive plate and the ground plate. One end of a plurality of short-circuit pins extends to a conductive plate plane, which is a plane including the opposing conductive plate, and the other end of the plurality of short-circuit pins extends to the ground plate plane, which is a plane including the ground plate. One or more of the plurality of short-circuit pins connect the opposing conductive plate and the ground plate.
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公开(公告)号：US12160041B2
公开(公告)日：2024-12-03
申请号：US17733019
申请日：2022-04-29
Inventor： Feras Abushakra , Seong Heon Jeong , Omar Asfar
Abstract: A multi-core dielectric circular waveguide (MCDCW) is described. A hybrid mode excitation for multi-core dielectric filled circular waveguide fed parabolic antenna is also described. A multi-core dielectric circular waveguide with four cylinders of different relative permittivity (∈r) inside each other is used to generate the hybrid mode (HE11) directly without need for coupling TE11 and TM11 modes as in prior art corrugated waveguide feeders. This mode is preferable to be used as operating mode to feed the reflector. Four concentric cylinders of different relative permittivity ∈r are used as an example.
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公开(公告)号：US20240396232A1
公开(公告)日：2024-11-28
申请号：US18796323
申请日：2024-08-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yosuke SATO
Abstract: An antenna module that includes dielectric substrates, radiating elements that are of a plate shape and disposed in or on the dielectric substrates, ground electrodes, and a peripheral electrode. The ground electrode is disposed in or on the dielectric substrate to face the radiating element. The ground electrode is disposed in or on the dielectric substrate to face the radiating element and is electrically connected to the ground electrode. The peripheral electrode is disposed in a layer, in the dielectric substrate, between the ground electrode and the radiating element and is electrically connected to the ground electrode. A direction normal to the radiating element is a first direction from the ground electrode toward the radiating element. A direction normal to the radiating element is a second direction different from the first direction. The peripheral electrode extends from the ground electrode in the first direction.
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公开(公告)号：US20240388001A1
公开(公告)日：2024-11-21
申请号：US18596628
申请日：2024-03-06
Applicant: PEGATRON CORPORATION
Inventor： Chin-Ting Huang , Chun-Kai Wang , Hsi-Kai Hung , Chih-Hui Hsu
Abstract: An antenna structure including a first grounding layer, a microstrip line group, a first conductive layer, a first radiator and a second radiator is provided. The microstrip line group is disposed above the first grounding layer and includes a first microstrip line and a second microstrip line perpendicular to each other. The first microstrip line includes a first feeding end. The second microstrip line includes a second feeding end. The first conductive layer is disposed above the microstrip line group and includes a first slot and a second slot perpendicular to each other. The first slot and the second slot correspond to the first microstrip line and the second microstrip line respectively. The first radiator is disposed above the first slot and the second slot. The second radiator is disposed above the first radiator.
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Patent Agency Ranking
公开(公告)号：US20240332810A1
公开(公告)日：2024-10-03
申请号：US18743184
申请日：2024-06-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sho SUZUKI , Kengo ONAKA
Abstract: An antenna module that includes a bent portion and a first flat portion. The first flat portion has a connection surface connected to the bent portion, a back surface intersecting the connection surface, a power feed pad connected to a flexible cable, a first ground electrode, and a radiating element. The first ground electrode is connected to a second ground electrode of the bent portion on the connection surface and is connected to the power feed pad.
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公开(公告)号：US20240322435A1
公开(公告)日：2024-09-26
申请号：US18678348
申请日：2024-05-30
Applicant: AGC Inc.
Inventor： Toshiki SAYAMA , Hideaki Shoji , Yusuke Kato
CPC classification number: H01Q9/0414 , H01Q9/40 , H01Q13/08 , H01Q1/32
Abstract: An antenna includes a radiation plate 56 equipped with a radiation surface that radiates radio waves and a feed point that is a location supplied with power from a transmission line. When looking at the radiation plate along a horizontal direction, the feed point is provided at a position separated from a centroid of the radiation plate by a distance A. When looking along a thickness direction of the radiation plate, locations between an end portion of the transmission line connected to the feed point and an intersection portion intersecting with a peripheral edge portion of the conductor plate, overlap in the thickness direction of the radiation plate with a specified area between a third straight line and a fourth straight line.
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公开(公告)号：US20240291157A1
公开(公告)日：2024-08-29
申请号：US18175797
申请日：2023-02-28
Applicant: L3Harris Technologies, Inc.
Inventor： Pedro RODRIGUEZ-GARCIA , Joshua MARTIN , James PIERPONT , Robert GEORGE , Philip Clayton WEATHERLY , Emily Marie TOBAR
CPC classification number: H01Q13/085 , H01Q1/48 , H01Q21/24
Abstract: In some aspects, the techniques described herein relate to an apparatus including: a ground plane element including: a non-conductive support layer, a conductive layer arranged on the non-conductive support layer, and at least one orifice through the non-conductive support layer and the conductive laminate layer; one or more radiating elements including a feed line and a solder pad, wherein each of the one or more radiating elements is secured to and electrically connected to the ground plane element via soldering of the solder pad to the conductive laminate layer; and at least one connector arranged in the at least one orifice and electrically connected to the feed line.
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公开(公告)号：US11950373B2
公开(公告)日：2024-04-02
申请号：US16404293
申请日：2019-05-06
Applicant: Lockheed Martin Corporation
Inventor： Marc T. Angelucci , Anthony R. Niemczyk
CPC classification number: H05K3/101 , H01Q13/10 , H01Q21/0087 , H01Q21/064 , H05K3/22 , H01Q13/08 , H05K2203/061
Abstract: A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.
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公开(公告)号：US20240055774A1
公开(公告)日：2024-02-15
申请号：US18494855
申请日：2023-10-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kohei HARATANI
CPC classification number: H01Q21/065 , H01Q13/08 , H01Q1/52
Abstract: An antenna device includes: a main substrate provided with a ground electrode extending in a Y-axis direction; and a sub-substrate mounted on the main substrate. The sub-substrate includes: an upper surface on which a first antenna element and a second antenna element are arranged side by side in the Y-axis direction; and a lower surface on which a mounting terminal portion is disposed. A recessed portion recessed toward the upper surface is formed in a central region (a region between the first antenna element and the second antenna element of the lower surface of the sub-substrate.
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