In some aspects, the techniques described herein relate to an apparatus including: a ground plane element including: a non-conductive support layer, a conductive layer arranged on the non-conductive support layer, and at least one orifice through the non-conductive support layer and the conductive laminate layer; one or more radiating elements including a feed line and a solder pad, wherein each of the one or more radiating elements is secured to and electrically connected to the ground plane element via soldering of the solder pad to the conductive laminate layer; and at least one connector arranged in the at least one orifice and electrically connected to the feed line.