公开(公告)号：US20240332810A1

公开(公告)日：2024-10-03

申请号：US18743184

申请日：2024-06-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sho SUZUKI ,  Kengo ONAKA

IPC: H01Q13/08 ,  H01Q5/35 ,  H01Q21/06

CPC classification number: H01Q13/08 ,  H01Q5/35 ,  H01Q21/06

Abstract: An antenna module that includes a bent portion and a first flat portion. The first flat portion has a connection surface connected to the bent portion, a back surface intersecting the connection surface, a power feed pad connected to a flexible cable, a first ground electrode, and a radiating element. The first ground electrode is connected to a second ground electrode of the bent portion on the connection surface and is connected to the power feed pad.

公开(公告)号：US20240322435A1

公开(公告)日：2024-09-26

申请号：US18678348

申请日：2024-05-30

Applicant: AGC Inc.

Inventor： Toshiki SAYAMA ,  Hideaki Shoji ,  Yusuke Kato

IPC: H01Q9/04 ,  H01Q1/32 ,  H01Q9/40 ,  H01Q13/08

CPC classification number: H01Q9/0414 ,  H01Q9/40 ,  H01Q13/08 ,  H01Q1/32

Abstract: An antenna includes a radiation plate 56 equipped with a radiation surface that radiates radio waves and a feed point that is a location supplied with power from a transmission line. When looking at the radiation plate along a horizontal direction, the feed point is provided at a position separated from a centroid of the radiation plate by a distance A. When looking along a thickness direction of the radiation plate, locations between an end portion of the transmission line connected to the feed point and an intersection portion intersecting with a peripheral edge portion of the conductor plate, overlap in the thickness direction of the radiation plate with a specified area between a third straight line and a fourth straight line.

公开(公告)号：US11950373B2

公开(公告)日：2024-04-02

申请号：US16404293

申请日：2019-05-06

Applicant: Lockheed Martin Corporation

Inventor： Marc T. Angelucci ,  Anthony R. Niemczyk

IPC: H05K3/10 ,  H01Q13/10 ,  H01Q21/00 ,  H01Q21/06 ,  H05K3/22 ,  H01Q13/08

CPC classification number: H05K3/101 ,  H01Q13/10 ,  H01Q21/0087 ,  H01Q21/064 ,  H05K3/22 ,  H01Q13/08 ,  H05K2203/061

Abstract: A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.

公开(公告)号：US20240055774A1

公开(公告)日：2024-02-15

申请号：US18494855

申请日：2023-10-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kohei HARATANI

IPC: H01Q21/06 ,  H01Q13/08 ,  H01Q1/52

CPC classification number: H01Q21/065 ,  H01Q13/08 ,  H01Q1/52

Abstract: An antenna device includes: a main substrate provided with a ground electrode extending in a Y-axis direction; and a sub-substrate mounted on the main substrate. The sub-substrate includes: an upper surface on which a first antenna element and a second antenna element are arranged side by side in the Y-axis direction; and a lower surface on which a mounting terminal portion is disposed. A recessed portion recessed toward the upper surface is formed in a central region (a region between the first antenna element and the second antenna element of the lower surface of the sub-substrate.

公开(公告)号：US11855363B2

公开(公告)日：2023-12-26

申请号：US17628902

申请日：2020-05-07

Applicant: YOKOWO CO., LTD.

Inventor： Takeshi Sampo

IPC: H01Q5/40 ,  H01Q23/00 ,  H01Q5/10 ,  H01Q13/08 ,  H01Q21/24

CPC classification number: H01Q5/40 ,  H01Q5/10 ,  H01Q13/08 ,  H01Q21/24 ,  H01Q23/00

Abstract: A first conductive plate (110) is located at a first surface (302) side of a substrate (300) away from the first surface (302) of the substrate (300). The first conductive plate (110) has an opening (112). A first conductive part (120) electrically connects the first conductive plate (110) and the substrate (300) to each other. A second conductive plate (210) is located at the first surface (302) side of the substrate (300) away from the first surface (302) of the substrate (300). A second conductive part (220) electrically connects the second conductive plate (210) and the substrate (300) to each other. The second conductive plate (210) is located inside the opening (112) of the first conductive plate (110).

公开(公告)号：US20230238708A1

公开(公告)日：2023-07-27

申请号：US18009540

申请日：2021-07-09

Applicant: Sony Semiconductor Solutions Corporation

Inventor： Yudai Takahashi

IPC: H01Q13/08 ,  H01Q1/52 ,  H01Q1/38

CPC classification number: H01Q13/08 ,  H01Q1/52 ,  H01Q1/38

Abstract: An antenna device (1) includes an antenna element (6) and a plurality of EBG elements (10), in which the plurality of EBG elements (10) includes a plurality of first EBG elements (11) and a plurality of second EBG elements (12) having a structure different from a structure of the plurality of first EGB elements (11).

公开(公告)号：US11700697B2

公开(公告)日：2023-07-11

申请号：US16908827

申请日：2020-06-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Saneaki Ariumi ,  Tomoshige Furuhi ,  Sho Suzuki

IPC: H01Q1/38 ,  H05K3/46 ,  H01P3/08 ,  H01Q13/08 ,  H05K1/09 ,  H05K3/38

CPC classification number: H05K3/46 ,  H01P3/08 ,  H01Q1/38 ,  H01Q13/08 ,  H05K1/09 ,  H05K3/38

Abstract: The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.

公开(公告)号：US11652297B2

公开(公告)日：2023-05-16

申请号：US17524419

申请日：2021-11-11

Applicant: AT&T Intellectual Property I, L.P.

Inventor： Paul Shala Henry ,  Robert Bennett ,  Farhad Barzegar ,  Irwin Gerszberg ,  Donald J. Barnickel ,  Thomas M. Willis, III

IPC: H01Q13/08 ,  H01Q25/04 ,  H01Q13/26 ,  H04B3/52 ,  H01Q15/14 ,  H01P5/02 ,  H01Q13/06 ,  H01P1/10 ,  H01Q1/50

CPC classification number: H01Q13/06 ,  H01P1/10 ,  H01Q1/50 ,  H01Q13/08 ,  H01Q13/26 ,  H01Q15/14 ,  H01Q25/04 ,  H04B3/52 ,  H01P5/026

Abstract: Aspects of the subject disclosure may include, for example, a system having a plurality of transmitters for launching, according to a signal, instances of first electromagnetic waves having different phases to induce propagation of a second electromagnetic wave at an interface of a transmission medium, the second electromagnetic wave having a non-fundamental wave mode and a non-optical operating frequency, wherein the plurality of transmitters has a corresponding plurality of antennas. A reflective plate is spaced a distance behind the plurality of antennas relative to a direction of the propagation of the second electromagnetic wave. Other embodiments are disclosed.

公开(公告)号：US20180357524A1

公开(公告)日：2018-12-13

申请号：US16107793

申请日：2018-08-21

Applicant: PHOENIX SOLUTION CO., LTD.

Inventor： Shiro SUGIMURA ,  Tatsuji NIWATA

IPC: G06K19/077 ,  H01Q9/04 ,  H01Q1/22 ,  G06K19/07 ,  H01Q1/38 ,  H01Q13/08

CPC classification number: G06K19/07773 ,  G06K19/07 ,  G06K19/077 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/0421 ,  H01Q13/08

Abstract: [Problem to be Solved]To provide an RF tag antenna capable of improving readability and a method of manufacturing the same, and an RF tag.[Solution]An RF tag antenna 10 according to an embodiment includes a first insulating substrate 40 having a first principal surface and a second principal surface, a first waveguide device 20 provided on the first principal surface, a second waveguide device 30 provided on the second principal surface, a power feeding part 50 electrically connected to the second waveguide device 30 at one end thereof, and a short-circuit part 60 electrically connected to the first waveguide device 20 at one end thereof and to the second waveguide device 30 at another end thereof, the first insulating substrate 40, the first waveguide device 20, the second waveguide device 30, the power feeding part 50 and the short-circuit part 60 form a plate-shaped inverted-F antenna that receives a radio wave transmitted from a reader, and an inductor pattern L formed by the first waveguide device 20, the short-circuit part 60, the second waveguide device 30 and the power feeding part 50 and a capacitor 93 formed by the first waveguide device 20, the second waveguide device 30 and the first insulating substrate 40 form a resonant circuit that resonates in a frequency band of the radio wave.

公开(公告)号：US20180191073A1

公开(公告)日：2018-07-05

申请号：US15394309

申请日：2016-12-29

Applicant: Trimble Inc.

Inventor： Nuri Celik

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

CPC classification number: H01Q9/0428 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q5/40 ,  H01Q9/0435 ,  H01Q9/0464 ,  H01Q9/0478 ,  H01Q13/08 ,  H01Q13/10 ,  H01Q15/006 ,  H01Q15/0086

Abstract: An antenna includes a dielectric substrate, a circular patch overlying the dielectric substrate, and a metamaterial ground plane. One or more antenna feeds are coupled to the circular patch. The antenna feeds may include impedance transformers. The metamaterial ground plane includes a plurality of conductive patches and a ground plane. The conductive patches are arranged along a first plane below the circular patch and are separated from the circular patch by at least the dielectric substrate. The conductive patches are arranged in a pattern that provides circular symmetry with respect to a center of the circularly polarized antenna. The ground plane is arranged along a second plane and is electrically coupled to at least a first portion of the conductive patches. One or more of the conductive patches and the ground plane are coupled to ground.