发明授权
- 专利标题： Method of manufacturing circuits using thick metals and machined bulk dielectrics
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申请号： US14985727申请日： 2015-12-31
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公开(公告)号： US10285277B1公开(公告)日： 2019-05-07
- 发明人: Marc T. Angelucci , Anthony R. Niemczyk
- 申请人： Lockheed Martin Corporation
- 申请人地址： US MD Bethesda
- 专利权人： Lockheed Martin Corporation
- 当前专利权人： Lockheed Martin Corporation
- 当前专利权人地址： US MD Bethesda
- 代理机构： Howard IP Law Group
- 主分类号： H05K3/10
- IPC分类号： H05K3/10 ; H05K3/22 ; H01Q21/00
摘要：
A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.
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