公开(公告)号：US20180332720A1

公开(公告)日：2018-11-15

申请号：US16031748

申请日：2018-07-10

Applicant: Amphenol Corporation

Inventor： Arthur E. Harkness, JR. ,  Eva M. Kenny-McDermott ,  Paul W. Farineau ,  Raymond A. Lavallee ,  Michael Fancher

IPC: H05K3/46 ,  H05K3/22 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/20

CPC classification number: H05K3/4632 ,  H05K1/0242 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0073 ,  H05K3/202 ,  H05K3/22 ,  H05K3/38 ,  H05K3/382 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4658 ,  H05K3/4685 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1194

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

公开(公告)号：US09980383B2

公开(公告)日：2018-05-22

申请号：US14748623

申请日：2015-06-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Masahiro Ozawa

IPC: H01H47/00 ,  H05K1/16 ,  H01L23/498 ,  H01G4/40 ,  H01G2/06 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H01F17/00 ,  H05K3/38

CPC classification number: H05K1/162 ,  H01F17/0006 ,  H01G2/06 ,  H01G4/40 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/115 ,  H05K1/165 ,  H05K3/383 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2203/0278 ,  H05K2203/0307

Abstract: Sheets are laminated on each other and pressure bonded with fixtures from upper and lower directions of a lamination direction while being heated to produce a laminated circuit substrate including therein a capacitor and a coil. The capacitor is defined by a first conductor pattern and a second conductor pattern that face each other across thermoplastic resin layers. In the laminated circuit substrate, the first conductor pattern includes a first principal surface, the second conductor pattern includes a second principal surface, the first principal surface faces the second conductor pattern, the second principal surface faces the first conductor pattern, and the first principal surface and the second principal surface are subject to a roughening process.

公开(公告)号：US09699916B2

公开(公告)日：2017-07-04

申请号：US14707295

申请日：2015-05-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takahiro Hayashi

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/28 ,  H05K1/02 ,  H05K3/46 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/28 ,  H05K1/0284 ,  H05K3/188 ,  H05K3/243 ,  H05K3/244 ,  H05K3/282 ,  H05K3/381 ,  H05K3/383 ,  H05K3/4007 ,  H05K3/46 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09409 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0307 ,  H05K2203/0574 ,  H05K2203/058 ,  H05K2203/0597 ,  H05K2203/0766 ,  Y10T29/49156

Abstract: A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.

公开(公告)号：US20170084509A1

公开(公告)日：2017-03-23

申请号：US14946044

申请日：2015-11-19

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： YU-CHENG HUANG

IPC: H01L23/13 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L21/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2924/014 ,  H01L2924/15333 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/06 ,  H05K3/383 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/0353

Abstract: A substrate includes a base layer, first and second circuit layers both coupled to the base layer, a third circuit layer, a fourth circuit layer and two solder resist layers. The first/second circuit layer defines a first/second opening. The third and fourth circuit layers are located at two sides of the first and second circuit layers. The solder resist layers cover outer faces of the third and fourth circuit layers. Each solder resist layer defines a window. The first opening is deviated from the second opening. The third and fourth circuit layers each have a portion exposed to the window to be a solder pad. The first circuit layer and the third circuit layer have a total thickness no more than that of the second circuit layer and the fourth circuit layer. A chip package with the substrate and a method for manufacturing the substrate are also provided.

公开(公告)号：US09301399B2

公开(公告)日：2016-03-29

申请号：US14256252

申请日：2014-04-18

Applicant: Mitsubishi Gas Chemical Company, Inc. ,  Ryoko Chemical Co., Ltd.

Inventor： Tomoko Suzuki ,  Norihumi Tashiro ,  Yukihide Naito ,  Akari Hitotsugo

IPC: H05K3/06 ,  H05K3/10 ,  C23F1/18 ,  C23F1/02 ,  C23F1/00 ,  C23G1/10 ,  C23C22/52 ,  C23C18/16 ,  C09K13/04 ,  H01L21/3213 ,  H05K3/38

CPC classification number: H05K3/108 ,  C09K13/04 ,  C23C18/1653 ,  C23C22/52 ,  C23F1/00 ,  C23F1/02 ,  C23F1/18 ,  C23G1/103 ,  H01L21/32134 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0353 ,  H05K2203/0789

Abstract: A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process: (1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and (2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.

Abstract translation: 根据实施例的处理布线基板的方法包括在半添加工艺中：（1）使布线基板与含有氯离子的预蚀刻处理液组合物接触，所述布线基板包含由 化学镀铜和由电解铜形成的布线图案; 和（2）连续地用含有过氧化氢，硫酸，四唑，氯离子，铜离子和水的蚀刻液组合物蚀刻布线基板。

公开(公告)号：US09254993B2

公开(公告)日：2016-02-09

申请号：US12742179

申请日：2008-11-14

Applicant: Hermann Oppermann

Inventor： Hermann Oppermann

IPC: B81B7/00 ,  H05K3/00 ,  C22C1/02 ,  C22C1/08 ,  H01L23/00 ,  H05K3/24 ,  H05K3/38 ,  H05K3/28

CPC classification number: B81B7/0006 ,  C22C1/02 ,  C22C1/08 ,  H01L24/28 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/09701 ,  H05K3/24 ,  H05K3/28 ,  H05K3/383 ,  H05K2201/0116 ,  H05K2203/0361

Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 60% to 80% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.

Abstract translation: 本发明涉及一种将贵金属表面连接到聚合物上的方法，其中将由20％至40％的金和60％至80％的银制成的层沉积在基底上，随后选择性地除去银，以便产生 纳米多孔金层。 将流体聚合物施加到金层并固化。

公开(公告)号：US20150332982A1

公开(公告)日：2015-11-19

申请号：US14615006

申请日：2015-02-05

Applicant: Mitsubishi Electric Corporation

Inventor： Mariko ONO ,  Akira GOTO ,  Rei YONEYAMA ,  Takami OTSUKI

IPC: H01L23/043 ,  H01L23/495 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00 ,  H01L21/48 ,  H05K1/05 ,  H05K1/09 ,  H05K3/38 ,  H01L23/29

CPC classification number: H05K3/44 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/043 ,  H01L23/053 ,  H01L23/14 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/48 ,  H01L23/49534 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0326 ,  H05K1/056 ,  H05K1/09 ,  H05K3/38 ,  H05K3/381 ,  H05K3/383 ,  H05K2201/066 ,  H05K2203/06 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

Abstract: A metal base substrate of the present invention includes a copper plate made of copper, a metal layer that is formed on the copper plate and is made of a metal different from the copper, an insulating resin sheet that is formed by bonding a sheet made of an insulating resin onto the metal layer, and a circuit pattern formed on the insulating resin sheet.

Abstract translation: 本发明的金属基底板包括由铜制成的铜板，形成在铜板上并由不同于铜的金属制成的金属层，绝缘树脂片，其通过将由 金属层上的绝缘树脂和形成在绝缘树脂片上的电路图案。

公开(公告)号：US20150296621A1

公开(公告)日：2015-10-15

申请号：US14748623

申请日：2015-06-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Masahiro OZAWA

IPC: H05K1/16 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/162 ,  H01F17/0006 ,  H01G2/06 ,  H01G4/40 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/115 ,  H05K1/165 ,  H05K3/383 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2203/0278 ,  H05K2203/0307

Abstract: Sheets are laminated on each other and pressure bonded with fixtures from upper and lower directions of a lamination direction while being heated to produce a laminated circuit substrate including therein a capacitor and a coil. The capacitor is defined by a first conductor pattern and a second conductor pattern that face each other across thermoplastic resin layers. In the laminated circuit substrate, the first conductor pattern includes a first principal surface, the second conductor pattern includes a second principal surface, the first principal surface faces the second conductor pattern, the second principal surface faces the first conductor pattern, and the first principal surface and the second principal surface are subject to a roughening process.

Abstract translation: 将片材彼此层压并且在层叠方向的上下方向上与固定装置进行加压粘合，同时加热以产生包括电容器和线圈的层叠电路基板。 电容器由通过热塑性树脂层彼此面对的第一导体图案和第二导体图案限定。 在层叠电路衬底中，第一导体图案包括第一主表面，第二导体图案包括第二主表面，第一主表面面向第二导体图案，第二主表面面向第一导体图案，第一主体 表面和第二主表面经受粗糙化处理。

公开(公告)号：US09011712B2

公开(公告)日：2015-04-21

申请号：US14360783

申请日：2013-06-25

Applicant: Mec Company Ltd.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura ,  Yuki Ogino

IPC: C09K13/00 ,  C23F1/18 ,  H05K3/38 ,  H05K3/06

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 公开了一种微蚀刻溶液，添加到所述微蚀刻溶液中的补充溶液和使用所述微蚀刻溶液生产布线板的方法。 用于铜的微蚀刻溶液由含有铜离子，有机酸，卤离子，聚合物和非离子表面活性剂的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 在本发明的微蚀刻溶液中，A / B的值为2000〜9000，A / D的值为500〜9000，卤化物离子的浓度为A％（重量），聚合物的浓度为 B重量％，非离子表面活性剂的浓度为D重量％。 使用该微蚀刻溶液，即使在低蚀刻量下也能均匀地保持对树脂等的粘附。

公开(公告)号：US08932719B2

公开(公告)日：2015-01-13

申请号：US12530940

申请日：2008-03-12

Applicant: Masanori Naritomi ,  Naoki Andoh

Inventor： Masanori Naritomi ,  Naoki Andoh

IPC: B32B15/092 ,  B32B15/20 ,  C23C8/10 ,  B32B43/00 ,  B32B7/12 ,  B32B15/08 ,  B32B27/04 ,  C09J163/00 ,  C23C22/83 ,  C23F1/36 ,  H05K3/38 ,  B32B38/08 ,  H05K1/05

CPC classification number: B32B43/00 ,  B32B5/024 ,  B32B5/08 ,  B32B5/147 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/38 ,  B32B38/08 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/306 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2605/00 ,  B32B2605/18 ,  C09J163/00 ,  C23C22/83 ,  C23F1/36 ,  H05K1/056 ,  H05K3/383 ,  H05K3/385 ,  H05K3/386 ,  H05K2203/0315 ,  Y10T428/24322 ,  Y10T428/24355 ,  Y10T428/265 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

Abstract translation: 本发明的目的是将铝合金部件与FRP预浸料坯强力连接。 通过对铝合金进行适当的液体处理以形成具有大的微米级不规则性的表面并且具有几十纳米的周期的微细凹凸而获得的目的，从而从表面消除钠离子的存在，另外 已经发现形成比天然氧化物层厚的氧化铝的表面膜具有与环氧基粘合剂强大的粘合强度。 通过同时固化在基体中使用相同的环氧基粘合剂的FRP预浸料，产生了以前所未有的大小结合强度的FRP和铝合金的整体复合材料或结构。