公开(公告)号：US12188138B1

公开(公告)日：2025-01-07

申请号：US18723935

申请日：2023-01-03

Applicant: TOTALENERGIES ONETECH ,  COLLÈGE DE FRANCE

Inventor： Moritz Wilhelm Schreiber ,  Hong-Phong Duong ,  Ngoc Huan Tran ,  Marc Fontecave

IPC: C25B3/03 ,  C23C8/10 ,  C23C28/00 ,  C25B1/23 ,  C25B3/25 ,  C25B3/26 ,  C25B9/19 ,  C25B9/23 ,  C25B11/032 ,  C25B11/052 ,  C25B11/061 ,  C25B11/075 ,  C25D3/38 ,  C25D5/50

Abstract: The invention relates to a process for electrolysing carbon oxides selected from carbon monoxide and/or carbon dioxide into ethylene by means of an electrolyser comprising a cathode catalyst being a dendritic copper oxide catalyst or a dendritic copper catalyst.

公开(公告)号：US11773494B2

公开(公告)日：2023-10-03

申请号：US16569994

申请日：2019-09-13

Applicant: Brandon Strahin

Inventor： Brandon Strahin

IPC: C23C30/00 ,  C22C14/00 ,  B32B15/04 ,  C23C8/24 ,  C23C8/10 ,  C01B21/06 ,  C23C8/12 ,  C23C8/34

CPC classification number: C23C30/005 ,  B32B15/04 ,  C22C14/00 ,  C23C8/10 ,  C23C8/24 ,  C01B21/06 ,  C23C8/12 ,  C23C8/34 ,  Y10T428/252 ,  Y10T428/265

Abstract: A surface treatment layer for a titanium-containing substrate includes a disordered metal oxide lattice having metal nitride compounds doped in the disordered metal oxide lattice. A method of surface treating a metal substrate includes introducing oxygen to a titanium-containing substrate to thereby form an oxide layer within the titanium-containing substrate, and, after the step of introducing oxygen, introducing nitrogen to the titanium-containing substrate to thereby modify the oxide layer to form a surface treatment layer.

公开(公告)号：US11718906B2

公开(公告)日：2023-08-08

申请号：US17188571

申请日：2021-03-01

Applicant: TREADSTONE TECHNOLOGIES, INC.

Inventor： Conghua Wang ,  Yong Tao ,  Lin Zhang ,  Gerald A. Gontarz

IPC: C23C14/32 ,  C23C4/02 ,  C23C4/08 ,  C23C8/10 ,  C23C14/16 ,  C23C28/00 ,  C23F1/26 ,  C25B15/00 ,  H01G9/055 ,  H01G11/70 ,  H01M8/0206 ,  H01M8/0208 ,  H01M8/0228 ,  C21D6/00 ,  C21D9/00 ,  C22C14/00 ,  C22F1/18 ,  C23C4/12 ,  C23C14/02 ,  C23C14/35 ,  C23F1/28 ,  C23F17/00 ,  H01M8/021 ,  H01M8/1018 ,  H01M4/66 ,  H01M8/10

CPC classification number: C23C14/325 ,  C21D6/002 ,  C21D9/0068 ,  C22C14/00 ,  C22F1/183 ,  C23C4/02 ,  C23C4/08 ,  C23C4/12 ,  C23C8/10 ,  C23C14/02 ,  C23C14/021 ,  C23C14/16 ,  C23C14/165 ,  C23C14/35 ,  C23C28/321 ,  C23C28/345 ,  C23F1/26 ,  C23F1/28 ,  C23F17/00 ,  C25B15/00 ,  H01G9/055 ,  H01G11/70 ,  H01M8/021 ,  H01M8/0206 ,  H01M8/0208 ,  H01M8/0228 ,  H01M8/1018 ,  H01M4/661 ,  H01M4/662 ,  H01M4/667 ,  H01M2008/1095 ,  Y02E60/13

Abstract: Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm2 and 5 billion cm2.

公开(公告)号：US11702729B2

公开(公告)日：2023-07-18

申请号：US16967619

申请日：2019-01-30

Applicant: Salzgitter Flachstahl GmbH

Inventor： Marc Debeaux ,  Nils Köpper

IPC: C23C8/10 ,  C23C2/06 ,  C23C2/40 ,  C21D9/56 ,  C21D9/573 ,  C22C38/38 ,  C22C38/02 ,  C22C38/06

CPC classification number: C23C8/10 ,  C21D9/561 ,  C21D9/5732 ,  C21D9/5735 ,  C22C38/02 ,  C22C38/06 ,  C22C38/38 ,  C23C2/06 ,  C23C2/40

Abstract: A method for producing a steel strip containing, in addition to iron as the main component and unavoidable impurities, one or more of the following oxygen-affine elements in wt. %: Al: more than 0.02, Cr: more than 0.1, Mn: more than 1.3 or Si: more than 0.1, where the surface of the steel strip is cleaned, oxidation-treated and annealed. The treated and annealed steel strip is subsequently coated with a hot-dip coat. In order to be less cost-intensive and to achieve uniform, reproducible adhesion conditions for the coat, the steel strip is oxidation-treated prior to the annealing at temperatures below 200° C., where on the surface of the steel strip, with the formation of oxides with iron from the steel strip, an oxide layer is formed, which contains iron oxide and is reduction-treated during the course of the annealing under a reducing atmosphere to achieve a surface consisting substantially of metallic iron.

公开(公告)号：US20220301863A1

公开(公告)日：2022-09-22

申请号：US17674297

申请日：2022-02-17

Applicant: KOKUSAI ELECTRIC CORPORATION

Inventor： Tatsushi UEDA ,  Masanori NAKAYAMA ,  Katsunori FUNAKI ,  Yasutoshi TSUBOTA ,  Hiroto IGAWA ,  Yuki YAMAKADO ,  Hiroki KISHIMOTO ,  Yuichiro TAKESHIMA ,  Keita ICHIMURA

IPC: H01L21/02 ,  H01J37/32 ,  C23C8/36 ,  C23C8/10

Abstract: A method of manufacturing a semiconductor device includes: (a) generating a reactive species by plasma-exciting a process gas containing oxygen and hydrogen; and (b) supplying the reactive species to a substrate and oxidizing surfaces of a silicon film and a silicon nitride film formed to be exposed respectively on the substrate, wherein a ratio of oxygen and hydrogen contained in the process gas is adjusted such that a ratio of a thickness of a second oxide layer formed by oxidizing the surface of the silicon nitride film to a thickness of a first oxide layer formed by oxidizing the surface of the silicon film in (b) becomes a predetermined thickness ratio.

公开(公告)号：US11377742B2

公开(公告)日：2022-07-05

申请号：US16332958

申请日：2017-09-26

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yutaka Shibata

IPC: C23C22/52 ,  C23C8/10 ,  C23C22/68 ,  C23F11/18 ,  C23C22/78 ,  F28F21/08 ,  F28F19/00 ,  C23F11/00 ,  C23C8/40 ,  F28F19/06

Abstract: A pipe is manufactured through injecting a chloride ion-containing aqueous solution into a copper pipe to fill the copper pipe, thereby forming a copper oxide film on an inner surface of the copper pipe.

公开(公告)号：US11143257B2

公开(公告)日：2021-10-12

申请号：US16087259

申请日：2017-01-24

Applicant: Sumitomo (SEI) Steel Wire Corp.

Inventor： Takafumi Uwano ,  Taketoshi Sasaki ,  Takao Yamazaki

IPC: F16F1/02 ,  C22C38/00 ,  C23C8/10 ,  B21C9/02 ,  C23C28/00 ,  C23C8/80 ,  C21D9/02 ,  C23C8/14 ,  C22C38/04 ,  C22C38/02 ,  C21D1/18

Abstract: A steel wire for a spring includes a steel wire that has Ca or Na adhered thereto in an amount of 0.2 g/m2 or less. The steel wire has an oxide film on a surface thereof, and the oxide film has a thickness of, for example, from 2.0 μm to 20 μm.

公开(公告)号：US20210254208A1

公开(公告)日：2021-08-19

申请号：US17188571

申请日：2021-03-01

Applicant: TREADSTONE TECHNOLOGIES, INC.

Inventor： Conghua WANG ,  Yong TAO ,  Lin ZHANG ,  Gerald A. GONTARZ

IPC: C23C14/32 ,  C23C4/02 ,  C23C4/08 ,  C23C8/10 ,  C23C14/16 ,  C23C28/00 ,  C23F1/26 ,  C25B15/00 ,  H01G9/055 ,  H01G11/70 ,  H01M8/0206 ,  H01M8/0208 ,  H01M8/0228 ,  C21D6/00 ,  C21D9/00 ,  C22C14/00 ,  C22F1/18 ,  C23C4/12 ,  C23C14/02 ,  C23C14/35 ,  C23F1/28 ,  C23F17/00 ,  H01M8/021 ,  H01M8/1018

Abstract: Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm2 and 5 billion cm2.

公开(公告)号：US11090908B2

公开(公告)日：2021-08-17

申请号：US16610980

申请日：2017-11-16

Applicant: Mutsuki Electric Co., Ltd.

Inventor： Seiichi Sai

IPC: B32B3/00 ,  B32B15/08 ,  B29C45/14 ,  B32B15/085 ,  B32B15/18 ,  B32B15/20 ,  C23C8/02 ,  C23C8/10 ,  B29K705/00

Abstract: A surface of a metal substrate formed from a metal is heated, an oxide film is formed on the surface of the metal substrate, at least a portion of the oxide film is heated so as to increase a joining strength of the oxide film to the metal substrate, subsequently a synthetic resin substrate formed from a synthetic resin is joined to the oxide film, and thus a metal-resin joined body is obtained. Thereby, a metal-resin joined body having high joining strength is obtained.

公开(公告)号：US11053572B2

公开(公告)日：2021-07-06

申请号：US16277173

申请日：2019-02-15

Applicant: University of Florida Research Foundation, Inc.

Inventor： Michele Manuel ,  Josephine Allen ,  Jordan P. Ball ,  Harpreet Singh Brar ,  Ida Svensson Berglund

IPC: C23C8/10 ,  C22C23/00 ,  C22C23/06 ,  A61L27/04 ,  A61L27/30 ,  A61L27/58 ,  C22C1/04 ,  C22F1/06

Abstract: Disclosed herein is an article comprising a metal alloy; where the metal alloy comprises a base metal, a second element and a third element; where the base metal is magnesium, calcium, strontium, zinc, or a combination thereof; where the second element is chemically different from the third element; and where the second element and the third element are scandium, yttrium, gadolium, cerium, neodymium, dysporium, or a combination thereof; and a protective layer disposed upon the metal alloy and is reactively bonded to the metal alloy; where the protective layer comprises a base non-metallic derivative, a second non-metallic derivative and a third non-metallic derivative of metals present in the metal alloy; and where the base non-metallic derivative, the second non-metallic derivative and the third non-metallic derivative are all chemically different from one another.