公开(公告)号：US20160155706A1

公开(公告)日：2016-06-02

申请号：US14825922

申请日：2015-08-13

申请人： Mitsubishi Electric Corporation

发明人： Rei YONEYAMA ,  Akira GOTO

IPC分类号： H01L23/552 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3114 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.

摘要翻译： 半导体模块包括壳体，设置在用于切换设置在用于覆盖半导体部件的壳体中的电流的封装树脂的壳体中的半导体部件，与封装树脂接触并容纳磁性材料的磁屏蔽和嵌入的嵌入式磁屏蔽 在这种情况下，包含磁性材料的嵌入式磁屏蔽。

公开(公告)号：US20190103329A1

公开(公告)日：2019-04-04

申请号：US15921704

申请日：2018-03-15

申请人： Mitsubishi Electric Corporation

发明人： Nobuchika AOKI ,  Rei YONEYAMA ,  Akira GOTO ,  Akihiko YAMASHITA

IPC分类号： H01L23/055 ,  H01L23/06 ,  H01L23/10 ,  H01L23/49

摘要： A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion.

公开(公告)号：US20140225238A1

公开(公告)日：2014-08-14

申请号：US14099592

申请日：2013-12-06

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Yoshitaka KIMURA ,  Mariko ONO ,  Akira GOTO

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/495 ,  H01L23/049 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/065 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a metal substrate, semiconductor elements, wires, a control terminal, a main electrode terminal, a control substrate, a cover, a sealing resin, a case, and an insulator. The metal substrate includes a metal plate, an insulating layer formed on the top surface of the metal plate, and electrode patterns provided on the insulating layer. The semiconductor elements are secured to different ones of the electrode patterns by solder. The sealing resin seals the components within the case, such as the semiconductor elements. The insulator covers a portion of the surface of the insulating layer and at least a portion of the edge of each electrode pattern.

摘要翻译： 半导体器件包括金属基板，半导体元件，电线，控制端子，主电极端子，控制基板，盖子，密封树脂，壳体和绝缘体。 金属基板包括金属板，形成在金属板的顶表面上的绝缘层和设置在绝缘层上的电极图案。 通过焊料将半导体元件固定到不同的电极图案。 密封树脂密封壳体内的部件，例如半导体元件。 绝缘体覆盖绝缘层的表面的一部分和每个电极图案的边缘的至少一部分。

公开(公告)号：US20150221525A1

公开(公告)日：2015-08-06

申请号：US14687619

申请日：2015-04-15

申请人： Mitsubishi Electric Corporation

发明人： Takami OTSUKI ,  Taichi OBARA ,  Akira GOTO

IPC分类号： H01L21/48 ,  B22D19/00 ,  B22D21/04

CPC分类号： H01L21/4821 ,  B22D19/00 ,  B22D21/04 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.

摘要翻译： 半导体器件包括绝缘衬底，形成在绝缘衬底上的布线图案，固定到布线图案的半导体芯片，由与布线图案相同的材料形成并与半导体芯片电连接的接合端子， 接线端子被固定到绝缘基板，接线端子的另一端向上延伸离开绝缘基板，以及控制电路，用于传输用于半导体芯片的控制信号，控制电路电连接到接线端子。

公开(公告)号：US20150332982A1

公开(公告)日：2015-11-19

申请号：US14615006

申请日：2015-02-05

申请人： Mitsubishi Electric Corporation

发明人： Mariko ONO ,  Akira GOTO ,  Rei YONEYAMA ,  Takami OTSUKI

IPC分类号： H01L23/043 ,  H01L23/495 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00 ,  H01L21/48 ,  H05K1/05 ,  H05K1/09 ,  H05K3/38 ,  H01L23/29

CPC分类号： H05K3/44 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/043 ,  H01L23/053 ,  H01L23/14 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/48 ,  H01L23/49534 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0326 ,  H05K1/056 ,  H05K1/09 ,  H05K3/38 ,  H05K3/381 ,  H05K3/383 ,  H05K2201/066 ,  H05K2203/06 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A metal base substrate of the present invention includes a copper plate made of copper, a metal layer that is formed on the copper plate and is made of a metal different from the copper, an insulating resin sheet that is formed by bonding a sheet made of an insulating resin onto the metal layer, and a circuit pattern formed on the insulating resin sheet.

摘要翻译： 本发明的金属基底板包括由铜制成的铜板，形成在铜板上并由不同于铜的金属制成的金属层，绝缘树脂片，其通过将由 金属层上的绝缘树脂和形成在绝缘树脂片上的电路图案。