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公开(公告)号：US20220223511A1
公开(公告)日：2022-07-14
申请号：US17372226
申请日：2021-07-09
IPC分类号： H01L23/498 , H01L23/047 , H01L23/00
摘要： A semiconductor device includes: an insulating substrate including a circuit pattern; a semiconductor chip mounted on the insulating substrate and connected to the circuit pattern; and an overcurrent interruption mechanism constituted with a same material as material of the circuit pattern, connected to the circuit pattern in series, wherein when an overcurrent flows, the overcurrent interruption mechanism melts and is cut.
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公开(公告)号：US20190103330A1
公开(公告)日：2019-04-04
申请号：US15959353
申请日：2018-04-23
IPC分类号： H01L23/055 , H01L23/31 , H01L23/00 , H01R12/58
CPC分类号： H01L23/055 , H01L23/053 , H01L23/24 , H01L23/3121 , H01L24/48 , H01L2224/45124 , H01L2224/48157 , H01L2924/13055 , H01R12/585 , H01L2924/00
摘要： A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.
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公开(公告)号：US20180226324A1
公开(公告)日：2018-08-09
申请号：US15784472
申请日：2017-10-16
发明人： Yoshitaka KIMURA , Yoshitaka OTSUBO
CPC分类号： H01L23/49 , H01L23/142 , H01L24/48 , H01L25/18 , H01L29/7395 , H01L29/861 , H01L2224/48091 , H01L2224/48137 , H01L2224/4816
摘要： A semiconductor device includes: a base plate including a metallic base plate and an insulating film provided on the metallic base plate; a semiconductor chip provided on the base plate; a control board disposed above the semiconductor chip; and a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board, wherein the relay terminal is directly fixed to the insulating film of the base plate.
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4.发明公开公开(公告)号：US20240087968A1
公开(公告)日：2024-03-14
申请号：US18323985
申请日：2023-05-25
发明人： Yoshitaka KIMURA
IPC分类号： H01L23/053 , H01L23/24 , H02M7/5387
CPC分类号： H01L23/053 , H01L23/24 , H02M7/53875
摘要： An object is to provide a technique that lowers the self-inductance of a semiconductor device. A semiconductor device includes an insulating substrate having a circuit pattern formed on an upper surface thereof, a semiconductor element mounted on the upper surface of the circuit pattern, and a plurality of electrode terminals each having one end portion bonded to the upper surface of the circuit pattern. The electrode terminals having portions of mutual adjacency of the plurality of electrode terminals are coated with the insulating film having a thickness of less than 100 at least at the portions.
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公开(公告)号：US20190157182A1
公开(公告)日：2019-05-23
申请号：US16115463
申请日：2018-08-28
发明人： Yoshitaka OTSUBO , Yoshitaka KIMURA
IPC分类号： H01L23/373 , H01L23/492 , H01L23/04
摘要： A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.
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公开(公告)号：US20170221853A1
公开(公告)日：2017-08-03
申请号：US15286771
申请日：2016-10-06
摘要： An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.
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公开(公告)号：US20240297229A1
公开(公告)日：2024-09-05
申请号：US18526582
申请日：2023-12-01
IPC分类号： H01L29/417 , H01L29/06 , H01L29/16 , H01L29/45 , H01L29/78
CPC分类号： H01L29/41741 , H01L29/0696 , H01L29/1608 , H01L29/45 , H01L29/7813 , H02P27/08
摘要： In a silicon carbide semiconductor device, in a plan view, a plurality of source contact holes is intermittently provided in a second direction along a trench gate, and a source electrode is provided on an insulating film and is electrically connected to a source layer via the plurality of source contact holes. Intermittent recesses reflecting the shapes of the plurality of source contact holes are provided on a surface of the source electrode on a side opposite to the semiconductor substrate.
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公开(公告)号：US20200211921A1
公开(公告)日：2020-07-02
申请号：US16454470
申请日：2019-06-27
发明人： Yoshitaka KIMURA
IPC分类号： H01L23/373 , H02M7/5387 , H01L21/56 , H01L21/52 , H01L21/54
摘要： A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.
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公开(公告)号：US20140225238A1
公开(公告)日：2014-08-14
申请号：US14099592
申请日：2013-12-06
发明人： Yoshitaka KIMURA , Mariko ONO , Akira GOTO
IPC分类号： H01L23/495 , H01L23/31
CPC分类号： H01L23/495 , H01L23/049 , H01L23/24 , H01L23/3107 , H01L23/3735 , H01L23/4006 , H01L25/065 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a metal substrate, semiconductor elements, wires, a control terminal, a main electrode terminal, a control substrate, a cover, a sealing resin, a case, and an insulator. The metal substrate includes a metal plate, an insulating layer formed on the top surface of the metal plate, and electrode patterns provided on the insulating layer. The semiconductor elements are secured to different ones of the electrode patterns by solder. The sealing resin seals the components within the case, such as the semiconductor elements. The insulator covers a portion of the surface of the insulating layer and at least a portion of the edge of each electrode pattern.
摘要翻译： 半导体器件包括金属基板，半导体元件，电线，控制端子，主电极端子，控制基板，盖子，密封树脂，壳体和绝缘体。 金属基板包括金属板，形成在金属板的顶表面上的绝缘层和设置在绝缘层上的电极图案。 通过焊料将半导体元件固定到不同的电极图案。 密封树脂密封壳体内的部件，例如半导体元件。 绝缘体覆盖绝缘层的表面的一部分和每个电极图案的边缘的至少一部分。
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公开(公告)号：US20180374817A1
公开(公告)日：2018-12-27
申请号：US15857931
申请日：2017-12-29
摘要： According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.
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