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公开(公告)号：US20230002877A1
公开(公告)日：2023-01-05
申请号：US17784436
申请日：2020-12-10
发明人： Fabian Junge
摘要： A method for production of a flat steel product including at least the following steps, completed in a continuous process: providing a flat steel product, wherein a protective metal layer of Zn, a Zn—Al alloy, a Zn—Mg alloy or a Zn—Mg—Al alloy is applied to at least one side by hot dip coating; at least partly removing a native oxide layer present on the surface of the protective metal layer by wetting this surface with an acidic solution of sulfuric acid, sulfurous acid, hydrochloric acid, phosphoric acid, phosphonic acid, nitric acid, formic acid, oxalic acid, acetic acid, citric acid, malic acid, tartaric acid, nitrous acid or hydrofluoric acid; activating the surface of the protective metal layer by applying an aqueous activation solution to the surface of the protective metal layer; and phosphating the activated surface of the protective metal layer by applying an aqueous phosphating solution to the activated surface.
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公开(公告)号：US11294285B2
公开(公告)日：2022-04-05
申请号：US16843123
申请日：2020-04-08
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Mei Yang , Jun Dai
IPC分类号： G03F7/095 , C23C30/00 , H05K3/38 , H05K3/06 , C23G1/10 , C23C28/02 , H05K3/40 , H05K3/18 , H05K1/09 , C23F1/44 , C23F1/02 , G03F7/20
摘要： A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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公开(公告)号：US20220002883A1
公开(公告)日：2022-01-06
申请号：US17339411
申请日：2021-06-04
发明人： Abhishek MANDAL , Nitin DEEPAK , Neha GUPTA , Prerna Sonthalia GORADIA , Ankur KADAM , Kenichi OHNO , David Alexander BRITZ , Lance A. SCUDDER
IPC分类号： C23G1/10 , C23C16/02 , C23C16/34 , C23C16/40 , C11D11/00 , C11D7/32 , C11D7/06 , C11D7/08 , B64F5/40
摘要： Embodiments of the present disclosure generally relate to methods for refurbishing aerospace components by removing corrosion and depositing protective coatings. In one or more embodiments, a method of refurbishing an aerospace component includes exposing the aerospace component containing corrosion to an aqueous cleaning solution. The aerospace component contains a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer. The method includes removing the corrosion from a portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the aluminum oxide layer, then exposing the aluminum oxide layer to a post-rinse, and forming a protective coating on the aluminum oxide layer.
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公开(公告)号：US10718043B2
公开(公告)日：2020-07-21
申请号：US16069250
申请日：2016-01-18
发明人： Koji Mitsuda , Kazuhiro Takahashi , Joe Ito , Hideto Seto , Hidenori Takebe
摘要： A titanium plate is provided in which a Vickers hardness Hv0.025 at a load of 0.245 N at a surface is 150 or less, and an average length of the profile elements RSm is 80 μm or less and a maximum height Rz is less than 1.5 μm, RSm and Rz being as defined in JIS B 0601: 2013. The titanium plate has good surface deformability.
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公开(公告)号：US10316414B2
公开(公告)日：2019-06-11
申请号：US15176699
申请日：2016-06-08
发明人： Zhongfen Ding , Mark R. Jaworowski
摘要： During a material removal method, a component is received that includes a component body and a coating on the component body. The component body includes metallic first material. The coating includes second material that is different from the first material. A solution is received that includes nitric acid and hydrogen peroxide. At least a portion of the coating is subjected to the solution in order to remove at least some of the second material from the component.
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公开(公告)号：US10182887B2
公开(公告)日：2019-01-22
申请号：US15696965
申请日：2017-09-06
申请人： BIOMET 3I, LLC
发明人： Robert L Mayfield , Ross W Towse
IPC分类号： A61C8/00 , C23F1/30 , C23F1/00 , A61L27/04 , B82Y30/00 , C23F1/26 , C23F1/38 , C23G1/10 , A61C13/00
摘要： A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution containing hydrogen peroxide and a basic solution to produce a nanoscale roughened surface consisting of ranopitting superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.
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公开(公告)号：US10033052B2
公开(公告)日：2018-07-24
申请号：US15100890
申请日：2015-01-22
发明人： Kazuhiro Takahashi , Taku Kagawa , Masanari Kimoto , Junko Imamura , Kiyonori Tokuno , Atsuhiko Kuroda
IPC分类号： H01M8/0228 , C25D9/08 , C22C14/00 , C22F1/18 , H01M8/0206 , H01M8/0215 , H01M8/0245 , C23C14/08 , C23C14/34 , C23C22/83 , C23C22/54 , C23G1/10 , C25D9/12 , C25D11/00 , H01M8/1018
摘要： The composition ratio of a titanium hydride [ITi—H/(ITi+ITi—H)]×100 found from the maximum intensity of metal titanium (ITi) and the maximum intensity of the titanium hydride (ITi—H) of the X-ray diffraction peaks measured at a surface of a titanium or a titanium alloy at an incident angle to the surface of 0.3° is 55% or more, a titanium oxide film is formed on an outermost surface of the titanium or the titanium alloy, and C is at 10 atomic % or less, N is at 1 atomic % or less, and B is at 1 atomic % or less in a position where the surface has been subjected to sputtering of 5 nm with argon. The titanium oxide film is formed by performing stabilization treatment after performing passivation treatment in prescribed aqueous solutions, and has a thickness of 3 to 10 nm.
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公开(公告)号：US10023939B2
公开(公告)日：2018-07-17
申请号：US15715892
申请日：2017-09-26
IPC分类号： C22C5/02 , B08B3/08 , C23C14/14 , C22B9/14 , C23C14/56 , B21C1/00 , B24B31/06 , C23G1/10 , B21C47/02 , C22B3/00 , C23C14/24 , B08B3/10 , B08B3/12 , B24B39/00
摘要： A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.
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公开(公告)号：US20180112301A1
公开(公告)日：2018-04-26
申请号：US15786057
申请日：2017-10-17
CPC分类号： C23C4/02 , C04B41/009 , C04B41/5353 , C04B41/91 , C23G1/08 , C23G1/10 , F01D5/005 , F01D5/288 , F05D2300/6033 , C04B35/16
摘要： A method for removing a coating including a rare earth silicate from a substrate including a ceramic or ceramic matrix composite may include contacting a coating comprising a rare earth silicate with a liquid comprising an active species. The active species may include at least one of a mineral acid or a base. The method also may include working the coating to cause removal of at least a portion of the coating.
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公开(公告)号：US20180102194A1
公开(公告)日：2018-04-12
申请号：US15712616
申请日：2017-09-22
发明人： Sang Yoon Park , Hui-Jun Won , Seonbyeong Kim , Wangkyu Choi , Mansoo Choi , Chong-Hun Jung , In-Ho Yoon , JeikWon Moon , Jun Young Jung , Jungsoon Park
摘要： The present invention provides a decontamination method including the steps of decontaminating an object containing radioactive contaminated metals or alloys with a chemical decontamination agent comprising sulfuric acid (H2SO4) and forming a Ba or Sr precipitate by adding Ba or Sr cation and hydroxyl ion or halogen anion salts to the decontamination waste water.The present invention also provides a kit for decontamination including a chemical decontamination agent including sulfuric acid (H2SO4) to decontaminate an object containing radioactive contaminated metals or alloys and Ba or Sr cation and hydroxyl ion or halogen anion salts to be added to the decontamination waste water to form a precipitate.
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