公开(公告)号：US20160212857A1

公开(公告)日：2016-07-21

申请号：US15002060

申请日：2016-01-20

申请人： JX NIPPON MINING & METALS CORPORATION

发明人： YOSHIYUKI MIYOSHI ,  MICHIYA KOHIKI ,  MASAFUMI ISHII

IPC分类号： H05K3/02 ,  H05K1/09

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D3/38 ,  C25D5/022 ,  C25D5/10 ,  C25D7/0614 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/421 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726

摘要： Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 μm or less.

摘要翻译： 提供一种设置有载体的铜箔，其能够在通过在树脂基板上层叠设置有载体的铜箔制造的层压体中从载体阱剥离超薄铜层。 具有依次具有载体，中间层和超薄铜层的载体的铜箔，其中，当使用基于JIS B0601-的激光显微镜测量与超薄铜层相对的载体的表面时， 1994年，表面的十点平均粗糙度Rz为6.0μm以下。

公开(公告)号：US20160183380A1

公开(公告)日：2016-06-23

申请号：US14907478

申请日：2014-07-23

申请人： JX NIPPON MINING & METALS CORPORATION

发明人： MASAFUMI ISHII ,  MISATO HONDA ,  NOBUAKI MIYAMOTO

IPC分类号： H05K3/02 ,  H05K3/38 ,  B32B15/08 ,  H05K3/20

CPC分类号： H05K3/025 ,  B32B3/26 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/08 ,  C23C18/1653 ,  C23C18/405 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/022 ,  C25D5/10 ,  C25D5/18 ,  C25D5/34 ,  C25D5/48 ,  C25D7/0614 ,  C25D7/0671 ,  H05K1/09 ,  H05K3/205 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K3/427 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0726 ,  H05K2203/1152

摘要： The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.

摘要翻译： 本发明提供一种表面处理铜箔，其能够在除去铜箔之后赋予基板表面的轮廓形状，该轮廓形状保持精细的布线成形性并且实现令人满意的无电镀铜镀层的粘合。 本发明还提供一种树脂基板，其具有保持精细布线成形性的表面的轮廓形状，并且实现令人满意的无电镀铜镀层的粘附。 本发明的表面处理铜箔是在铜箔上形成表面处理层的表面处理铜箔，表面处理层的表面的表面粗糙度Sz为2〜6μm。