公开(公告)号：US12222370B2

公开(公告)日：2025-02-11

申请号：US17919739

申请日：2021-04-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe head and a probe card having the same are provided. The probe head includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.

公开(公告)号：US20250035670A1

公开(公告)日：2025-01-30

申请号：US18710173

申请日：2022-11-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Chang Hee HONG

IPC: G01R1/067

Abstract: The present invention provides an electrically conductive contact pin and an inspection device having improved inspection reliability for an inspection object. The electrically conductive contact pin is characterized in that a first connection portion contacts a support portion to form a current path when a first elastic portion is compressed, and a second connection portion contacts the support portion to form a current path when a second elastic portion is compressed. The inspection device comprises an installation member having a through hole for receiving the electrically conductive contact pin.

公开(公告)号：US20250020691A1

公开(公告)日：2025-01-16

申请号：US18274455

申请日：2022-01-25

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067 ,  G01R1/073

Abstract: Proposed is an electro-conductive contact pin which can implement a narrow pitch between electro-conductive contact pins and prevent the electro-conductive contact pins from being short-circuited even upon contact between center portions of the electro-conductive contact pins, through a manufacturing method for an electro-conductive contact pin, the manufacturing method including a step of forming a module area including pin bodies and a support frame supporting the pin bodies through connecting portions, and a coating layer forming step of forming a coating layer on the pin bodies.

公开(公告)号：US12169212B2

公开(公告)日：2024-12-17

申请号：US17912518

申请日：2021-03-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Sung Hyun Byun ,  Dong Hyeok Seo

IPC: G01R1/073 ,  G01R31/28

Abstract: Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.

公开(公告)号：US20240280609A1

公开(公告)日：2024-08-22

申请号：US18567345

申请日：2022-06-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067

CPC classification number: G01R1/06761

Abstract: The present invention provides an electrically conductive contact pin formed by laminating a plurality of metal layers, wherein the electrically conductive contact pin has improved physical or electrical properties.

公开(公告)号：US20240229287A1

公开(公告)日：2024-07-11

申请号：US18558360

申请日：2022-05-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: C25D11/18

CPC classification number: C25D11/18

Abstract: An anodized film structure according to the present invention comprises: a body, formed from an anodized film material, which is formed by anodizing a base metal and then removing the base metal; through holes having a greater inner width than pores formed during anodizing, and formed through the body; and an inner metal layer provided inside the body. Provided is the anodized film structure having enhanced physical and/or electrical properties to solve the problem of brittle fractures and impart partial conductivity.

公开(公告)号：US20240226994A9

公开(公告)日：2024-07-11

申请号：US18278173

申请日：2022-02-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B22C9/20 ,  B22D19/16

CPC classification number: B22C9/20 ,  B22D19/16

Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.

公开(公告)号：US20240131576A1

公开(公告)日：2024-04-25

申请号：US18278173

申请日：2022-02-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B22C9/20 ,  B22D19/16

CPC classification number: B22C9/20 ,  B22D19/16

Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.

公开(公告)号：US11852656B2

公开(公告)日：2023-12-26

申请号：US17214785

申请日：2021-03-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: G01R1/073

CPC classification number: G01R1/07342

Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

公开(公告)号：US20230384346A1

公开(公告)日：2023-11-30

申请号：US18031607

申请日：2021-10-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/04 ,  H01R13/24 ,  H01R43/16

CPC classification number: G01R1/0408 ,  H01R13/2407 ,  H01R43/16

Abstract: Proposed are an electrically conductive contact pin, a method for manufacturing the same, an inspection apparatus, a method for manufacturing a molded product, and a molded product manufactured thereby. More specifically, proposed are: a method for manufacturing an electrically conductive contact pin, the method including the steps of providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and having openings formed by etching at least partial regions of the anodic aluminum oxide mold to correspond to a shape of electrically conductive contact pins, forming a metal filler in each of the openings, and removing the anodic aluminum oxide mold; an electrically conductive contact pin including at least one micro-convex portion and a plurality of fine trenches; an inspection apparatus; a method for manufacturing a molded product; and a molded product manufactured thereby.