公开(公告)号：US20240082942A1

公开(公告)日：2024-03-14

申请号：US18516123

申请日：2023-11-21

申请人： Illinois Tool Works Inc.

发明人： Bruce Patrick Albrecht ,  Christopher Hsu

IPC分类号： B23K9/04 ,  B05B5/00 ,  B05B5/025 ,  B05B7/22 ,  B05B12/18 ,  B22F3/115 ,  B22F7/06 ,  B22F10/22 ,  B22F10/31 ,  B22F10/368 ,  B22F10/50 ,  B22F12/90 ,  B23K9/02 ,  B23K9/23 ,  B23K20/00 ,  B23K31/02 ,  B23K31/12 ,  B29C64/112 ,  B29C64/40 ,  B33Y30/00 ,  B33Y50/02 ,  C23C4/131

CPC分类号： B23K9/04 ,  B05B5/001 ,  B05B5/0255 ,  B05B7/22 ,  B05B12/18 ,  B22F3/115 ,  B22F7/064 ,  B22F10/22 ,  B22F10/31 ,  B22F10/368 ,  B22F10/50 ,  B22F12/90 ,  B23K9/02 ,  B23K9/23 ,  B23K9/232 ,  B23K20/00 ,  B23K31/02 ,  B23K31/12 ,  B29C64/112 ,  B29C64/40 ,  B33Y30/00 ,  B33Y50/02 ,  C23C4/131 ,  B33Y10/00

摘要： An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

公开(公告)号：US11833623B2

公开(公告)日：2023-12-05

申请号：US16720420

申请日：2019-12-19

申请人： ILLINOIS TOOL WORKS INC.

发明人： Bruce Patrick Albrecht ,  Christopher Hsu

IPC分类号： B33Y30/00 ,  B23K9/04 ,  B29C64/112 ,  B22F3/115 ,  B05B12/18 ,  B23K9/23 ,  C23C4/131 ,  B22F7/06 ,  B23K9/02 ,  B05B7/22 ,  B05B5/00 ,  B29C64/40 ,  B33Y50/02 ,  B05B5/025 ,  B22F10/22 ,  B22F12/90 ,  B22F10/31 ,  B22F10/368 ,  B23K20/00 ,  B23K31/02 ,  B23K31/12 ,  B33Y10/00 ,  B23K103/02 ,  B23K103/18 ,  B23K103/04 ,  B05B5/08 ,  B05B7/18 ,  B23K103/24 ,  B23K103/20 ,  B22F10/25 ,  B22F12/17 ,  B22F12/55

CPC分类号： B23K9/04 ,  B05B5/001 ,  B05B5/0255 ,  B05B7/22 ,  B05B12/18 ,  B22F3/115 ,  B22F7/064 ,  B22F10/22 ,  B22F10/31 ,  B22F10/368 ,  B22F12/90 ,  B23K9/02 ,  B23K9/23 ,  B23K9/232 ,  B23K20/00 ,  B23K31/02 ,  B23K31/12 ,  B29C64/112 ,  B29C64/40 ,  B33Y30/00 ,  B33Y50/02 ,  C23C4/131 ,  B05B5/081 ,  B05B7/18 ,  B05B7/224 ,  B05B7/226 ,  B22F10/25 ,  B22F12/17 ,  B22F12/55 ,  B22F2999/00 ,  B23K2103/02 ,  B23K2103/05 ,  B23K2103/18 ,  B23K2103/20 ,  B23K2103/24 ,  B33Y10/00 ,  Y02P10/25 ,  B22F2999/00 ,  B22F7/064 ,  B22F2207/01 ,  B22F2999/00 ,  B22F10/22 ,  B22F2203/03 ,  B22F2999/00 ,  B22F10/31 ,  B22F2203/03

摘要： An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

公开(公告)号：US11819915B2

公开(公告)日：2023-11-21

申请号：US15786964

申请日：2017-10-18

申请人： Murata Manufacturing Co., Ltd.

发明人： Seitaro Washizuka

IPC分类号： B22F1/00 ,  B23K20/00 ,  B23K35/26 ,  C22C13/00 ,  B23K1/20 ,  B23K35/30 ,  B23K20/16 ,  B22F7/06 ,  B23K1/19 ,  C22C9/05 ,  B23K35/02 ,  C22C13/02 ,  C22C9/06 ,  B23K1/00 ,  B23K20/02 ,  H05K3/34 ,  C22C9/00 ,  B23K101/42

CPC分类号： B22F1/09 ,  B22F7/064 ,  B23K1/0002 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K20/00 ,  B23K20/026 ,  B23K20/16 ,  B23K35/025 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  C22C9/00 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  H05K3/3457 ,  B22F2998/10 ,  B22F2999/00 ,  B23K2101/42 ,  H05K2203/0425 ,  B22F2999/00 ,  B22F7/064 ,  B22F3/12 ,  B22F2998/10 ,  B22F7/064 ,  B22F2003/248 ,  C22C1/047 ,  B22F2999/00 ,  B22F1/09 ,  B22F1/10 ,  B22F3/12 ,  B22F2999/00 ,  B22F3/12 ,  B22F1/09 ,  B22F1/10

摘要： A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

公开(公告)号：US11814703B2

公开(公告)日：2023-11-14

申请号：US17338775

申请日：2021-06-04

申请人： NIPPON STEEL CORPORATION

发明人： Tomoyuki Kitaura ,  Yoshihisa Shirai ,  Hideki Fujii

IPC分类号： C22C14/00 ,  B21B3/00 ,  B32B15/01 ,  B32B3/26 ,  B23K20/00 ,  B21B1/22 ,  B21B1/02

CPC分类号： C22C14/00 ,  B21B1/22 ,  B21B3/00 ,  B23K20/00 ,  B32B3/26 ,  B32B15/01 ,  B21B1/02 ,  B21B2001/225 ,  Y10T428/12479 ,  Y10T428/12806

摘要： Provided is a titanium composite material 1 including: a first surface layer portion 2; an inner layer portion 4; and a second surface layer portion 3; wherein: the first surface layer portion 2 and the second surface layer portion 3 are composed of a titanium alloy; the inner layer portion 4 is composed of a commercially pure titanium including pores; a thickness of at least one of the first surface layer portion 2 and the second surface layer portion 3 is 2 μm or more, and a proportion of the thickness with respect to an overall thickness of the titanium composite material 1 is 40% or less; and a porosity in a cross section perpendicular to a sheet thickness direction is more than 0% and 30% or less.

公开(公告)号：US11658146B2

公开(公告)日：2023-05-23

申请号：US17374156

申请日：2021-07-13

申请人： Tokyo Electron Limited

发明人： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

CPC分类号： H01L24/75 ,  B23K20/00 ,  H01L21/02 ,  H01L21/67207 ,  H01L21/68 ,  H01L21/683 ,  H01L24/94 ,  H01L2224/759 ,  H01L2224/75744 ,  H01L2224/75802

摘要： A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US09919472B1

公开(公告)日：2018-03-20

申请号：US14280517

申请日：2014-05-16

申请人： Microfabrica Inc.

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Rulon J. Larsen, III ,  Uri Frodis ,  Kieun Kim ,  Dennis R. Smalley

IPC分类号： B23K20/00 ,  B29C65/48

CPC分类号： B23K20/00 ,  B23K20/10 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/04 ,  B23K2103/14 ,  B23K2103/26 ,  B23K2103/50 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00

摘要： Embodiments are directed to methods of producing devices using modified multi-layer, multi-material electrochemical fabrication processes and/or using a laser cutting processes wherein individual layers or layer groups are formed and then stacked and bonded to produce prototypes or production parts. The methods can reduce the cost and lead time of prototyping when compared with previous multi-layer, multi-material electrochemical fabrication processes and can also reduce the lead time of production quantities, by allowing multiple layers of a multilayer device to be formed simultaneously, e.g. in parallel on the same wafer. Additionally, these methods may be used to extend the maximum height to which parts may practically be made. Finally, the methods allow geometries that are impossible, impractical or difficult to release (e.g. microfluidic devices such as pumps or parts with long, narrow channels) to be fabricated in multiple pieces and then joined after full or partial release.

公开(公告)号：US20180068854A1

公开(公告)日：2018-03-08

申请号：US15810932

申请日：2017-11-13

申请人： Tadatomo SUGA ,  BONDTECH CO., LTD.

发明人： Tadatomo SUGA ,  Akira YAMAUCHI

IPC分类号： H01L21/18 ,  H01J37/32 ,  B23K20/00 ,  H05H1/46 ,  H01L21/02 ,  H05H3/02

CPC分类号： H01L21/187 ,  B23K20/00 ,  H01J37/3233 ,  H01L21/02 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/76251 ,  H01L25/0657 ,  H05H1/46 ,  H05H3/02

摘要： A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.

公开(公告)号：US20180065206A1

公开(公告)日：2018-03-08

申请号：US15563778

申请日：2015-07-23

申请人： Joseph P. MENNUCCI ,  Michael D. HARDY ,  Ronald R. DOS SANTOS ,  Donald G. MCDONNELL ,  EMS ENGINEERED MATERIALS SOLUTIONS, LLC

发明人： Joseph P. Mennucci ,  Michael D. Hardy ,  Ronald R. Dos Santos ,  Donald G. McDonnell ,  Michael Balkenhol

IPC分类号： B23K20/02 ,  B23K20/233 ,  B32B15/01

CPC分类号： B23K20/023 ,  B23K20/00 ,  B23K20/02 ,  B23K20/2333 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/166 ,  B23K2103/18 ,  B32B15/01 ,  B32B15/012 ,  B32B15/015 ,  B32B15/017 ,  C22C9/00 ,  C22C19/03 ,  C22C21/00 ,  C22C38/00 ,  C22C38/18

摘要： A clad metal composite produced according to a method for edge-to-edge cladding of two or more different metals (such as aluminum and copper). The metals are joined next to each other to form an edge-to-edge or side-by-side clad bimetal. In one embodiment, nine metal strips are used to create the desired clad metal composite. The design includes strips of metal that have industry standard cut edges (such as, slit-cut edges). The clad metal composite may include multiple layers of metals positioned edge-to-edge.

公开(公告)号：US20170317048A1

公开(公告)日：2017-11-02

申请号：US15523865

申请日：2015-11-06

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION

发明人： Norie MATSUBARA ,  Shinji ISHIKAWA ,  Tomohiro UNO ,  Takayuki SHIMIZU ,  Naoya KITAMURA

IPC分类号： H01L23/00 ,  B22F7/08 ,  C22C1/08 ,  C22C19/03

CPC分类号： H01L24/32 ,  B22F7/08 ,  B23K20/00 ,  C22C1/08 ,  C22C19/03 ,  H01B5/16 ,  H01L21/52 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/29011 ,  H01L2224/29155 ,  H01L2224/29355 ,  H01L2224/3201 ,  H01L2224/32245 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/10272

摘要： The present invention provides a conductive bonded assembly utilizing particles of Ni or an Ni alloy as conductive particles so as to enable firing under non-pressing conditions and further realize an excellent bonding strength, electron migration characteristic, and ion migration characteristic. The conductive bonded assembly of the present invention is a conductive bonded assembly of an electronic component which has a first bondable member (for example, electrode material), a second bondable member (for example, a semiconductor device on an Si or SiC substrate), and a conductive bonding layer bonding these bondable members together, where the bonding layer is an Ni sintered body formed by a sintered body of Ni particles which has a porosity of 30% or less, and, further, can be obtained by heating and sintering the Ni particles at the time of firing where the Ni sintered bonding layer is formed.

公开(公告)号：US20170144219A1

公开(公告)日：2017-05-25

申请号：US15219921

申请日：2016-07-26

申请人： United Technologies Corporation

发明人： JinQuan Xu

IPC分类号： B22D27/04 ,  B33Y40/00 ,  B33Y80/00 ,  B22C9/10 ,  B22C9/22 ,  B22D29/00 ,  B22D25/02 ,  B22F3/105 ,  B22F3/24 ,  B22F5/04 ,  B23K15/00 ,  B23K26/342 ,  B23K26/70 ,  B23K37/00 ,  F01D5/00 ,  F01D5/12 ,  F01D9/04 ,  F02C7/22 ,  F23R3/00 ,  B33Y10/00

CPC分类号： B22D27/045 ,  B22C9/02 ,  B22C9/04 ,  B22C9/10 ,  B22C9/108 ,  B22C9/12 ,  B22C9/22 ,  B22D23/06 ,  B22D25/02 ,  B22D29/001 ,  B22F3/1055 ,  B22F3/24 ,  B22F5/007 ,  B22F5/009 ,  B22F5/04 ,  B22F2003/248 ,  B22F2998/10 ,  B23K1/0018 ,  B23K9/04 ,  B23K9/167 ,  B23K15/0046 ,  B23K15/0086 ,  B23K20/00 ,  B23K26/34 ,  B23K26/342 ,  B23K26/70 ,  B23K31/02 ,  B23K37/00 ,  B23K2101/001 ,  B23P6/005 ,  B23P6/007 ,  B23P6/045 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y80/00 ,  C30B11/00 ,  C30B11/003 ,  C30B21/02 ,  C30B29/52 ,  F01D5/005 ,  F01D5/12 ,  F01D5/18 ,  F01D5/186 ,  F01D5/187 ,  F01D9/04 ,  F02C7/222 ,  F05D2220/32 ,  F05D2230/21 ,  F05D2230/233 ,  F05D2230/234 ,  F05D2230/235 ,  F05D2230/238 ,  F05D2230/30 ,  F05D2230/80 ,  F05D2240/122 ,  F05D2240/304 ,  F05D2260/202 ,  F05D2260/204 ,  F05D2300/175 ,  F05D2300/20 ,  F05D2300/606 ,  F05D2300/608 ,  F23R3/002 ,  Y02P10/292 ,  Y02P10/295

摘要： A method of manufacturing a replacement body for a component is provided. The method includes the steps of: a) additively manufacturing a crucible for casting of the replacement body; b) solidifying a metal material within the crucible to form a directionally solidified microstructure within the replacement body; and c) removing the crucible to reveal the directionally solidified replacement body.