公开(公告)号：US11959940B2

公开(公告)日：2024-04-16

申请号：US17604492

申请日：2020-03-24

申请人： YOKOWO CO., LTD.

发明人： Kenichi Sato

IPC分类号： G01R1/067

CPC分类号： G01R1/06738

摘要： A contact probe capable of being used for an inspection of a semiconductor package in which a recess is formed in a terminal portion includes a plunger including a distal end portion that comes into contact with the terminal portion. The distal end portion includes a protruding portion protruding toward the terminal portion and a shoulder portion having a protruding height toward the terminal portion lower than that of the protruding portion.

公开(公告)号：US20240103038A1

公开(公告)日：2024-03-28

申请号：US17898400

申请日：2022-08-29

申请人： Microfabrica Inc.

发明人： Ming Ting Wu

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R3/00

CPC分类号： G01R1/06722 ,  G01R1/06738 ,  G01R1/0735 ,  G01R3/00

摘要： Probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segments and in some embodiments include narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements.

公开(公告)号：US20230400509A1

公开(公告)日：2023-12-14

申请号：US18454906

申请日：2023-08-24

申请人： ATG LUTHER & MAELZER GMBH

发明人： Stefan Weiss ,  Oleh Yuschuk ,  Christian Weindel

IPC分类号： G01R31/312 ,  G01R1/067 ,  G01R1/07 ,  G01R31/28

CPC分类号： G01R31/312 ,  G01R1/06738 ,  G01R1/07 ,  G01R31/2813

摘要： The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe.
The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

公开(公告)号：US20230204626A1

公开(公告)日：2023-06-29

申请号：US17124417

申请日：2020-12-16

申请人： Microfabrica Inc.

发明人： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC分类号： G01R1/067

CPC分类号： G01R1/06727 ,  G01R1/06738

摘要： Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

公开(公告)号：US20230176089A1

公开(公告)日：2023-06-08

申请号：US17912057

申请日：2021-03-11

申请人： NIDEC READ CORPORATION

发明人： Yusuke YOKOTA ,  Norihiro OTA

IPC分类号： G01R1/067 ,  G01R1/073 ,  H01L21/66

CPC分类号： G01R1/06722 ,  G01R1/073 ,  H01L22/00 ,  G01R1/06738

摘要： A contact terminal includes a tubular body and a first conductor. The tubular body has an end-side cutout provided in a shape cut out from one axial-direction end surface toward an other axial-direction side at one axial-direction end portion of the tubular body, a hole that is open at the one axial-direction end portion, and a pair of arms interposed between the end-side cutout and the hole. The first conductor includes a first insertion including an inclined portion having an outside diameter gradually increased toward one axial-direction side, and a first straight portion connected to the one axial-direction side of the inclined portion and having an outside diameter constant along the axial direction. The outside diameter of the first straight portion is larger than an inside diameter of the tubular body. The first straight portion is configured to be in contact with the pair of arms.

公开(公告)号：US20190041429A1

公开(公告)日：2019-02-07

申请号：US16134571

申请日：2018-09-18

申请人： Johnstech International Corporation

发明人： Jathan Edwards ,  Charles Marks ,  Brian Halvorson

IPC分类号： G01R1/073 ,  G01R1/067 ,  G01R3/00

CPC分类号： G01R1/07314 ,  G01R1/0466 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06772 ,  G01R1/07371 ,  G01R3/00

摘要： A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

公开(公告)号：US10078101B2

公开(公告)日：2018-09-18

申请号：US15125019

申请日：2015-03-10

申请人： Johnstech International Corporation

发明人： Jathan Edwards ,  Charles Marks ,  Brian Halvorson

IPC分类号： G01R1/067 ,  G01R31/00 ,  G01R1/073 ,  G01R3/00

CPC分类号： G01R1/07314 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06772 ,  G01R1/07371 ,  G01R3/00

摘要： A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

公开(公告)号：US20180172732A1

公开(公告)日：2018-06-21

申请号：US15654248

申请日：2017-07-19

申请人： Wing Cheuk LEUNG

发明人： Wing Cheuk LEUNG

IPC分类号： G01R1/073 ,  G01R31/28 ,  G01R1/067 ,  H01L21/48 ,  H01L23/00 ,  H01R13/02

CPC分类号： G01R1/07364 ,  G01R1/06733 ,  G01R1/06738 ,  G01R31/2886 ,  H01L21/4814 ,  H01L24/01 ,  H01R13/02

摘要： A system for semiconductor wafer testing, a tangent probe card and a probe head assembly thereof. The system has a tangent probe card and a tester. Testing ends of the probe card are flat, hence the allowable alignment budget will always be more generous for the tangent probe card. The probes are held on the probe head assembly, and once the alignment is achieved accurately during manufacture, the alignment will remain stable throughout the whole life cycle. The probe has a greater CCC due to its larger cross section. The throughput of the tangent probes is higher than that of the conventional probe card since there is no need to move the pointed pin/structure. No pointed pin/structure needs to be repaired, and the flat bottom surface of the probe head assembly is easier to clean and maintain.

公开(公告)号：US20180003737A1

公开(公告)日：2018-01-04

申请号：US15650721

申请日：2017-07-14

申请人： Translarity, Inc.

发明人： Douglas A. Preston ,  Morgan T. Johnson

IPC分类号： G01R1/067 ,  G01R31/28 ,  H01L21/66 ,  G01R1/073 ,  G01R3/00

CPC分类号： G01R1/06738 ,  G01R1/06744 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L22/14 ,  H01L22/32 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

公开(公告)号：US09835653B2

公开(公告)日：2017-12-05

申请号：US14276223

申请日：2014-05-13

申请人： International Business Machines Corporation

发明人： David M. Audette ,  Dennis M. Bronson, Jr. ,  Joseph K. V. Comeau ,  Dustin M. Fregeau ,  David L. Gardell ,  Frederick H. Roy, III ,  James R. Salimeno, III ,  Timothy D. Sullivan

IPC分类号： G01R3/00 ,  G01R1/073 ,  G01R31/28 ,  G01R1/067

CPC分类号： G01R3/00 ,  G01R1/06738 ,  G01R1/07314 ,  G01R1/07342 ,  G01R31/2886

摘要： A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.