METHODS OF FORMING STRENGTHENED SINTERED GLASS STRUCTURES
    5.
    发明申请
    METHODS OF FORMING STRENGTHENED SINTERED GLASS STRUCTURES 审中-公开
    形成强化烧结玻璃结构的方法

    公开(公告)号:US20150367607A1

    公开(公告)日:2015-12-24

    申请号:US14768118

    申请日:2014-02-13

    IPC分类号: B32B17/06 C03C27/04 C03C17/04

    摘要: A strengthened layered glass structure includes a first substrate layer comprising a flexible glass sheet having a thickness of less than or equal to 300 μm, a second substrate layer, and a sintered glass frit material layer coupled to a first surface of the first substrate layer and a second surface of the second substrate layer, the sintered glass frit material layer comprising a sintered glass frit coupled to the first and second surfaces providing the flexible glass sheet with a compressive stress of at least about 100 MPa across a thickness of the flexible glass sheet.

    摘要翻译: 加强层状玻璃结构包括:第一基板层,其包括厚度小于或等于300μm的柔性玻璃板;第二基板层;以及与第一基板层的第一表面耦合的烧结玻璃料材料层;以及 所述第二基底层的第二表面,所述烧结玻璃料材料层包括连接到所述第一和第二表面的烧结玻璃料,所述烧结玻璃料通过所述柔性玻璃板的厚度提供柔性玻璃板至少约100MPa的压缩应力 。

    AIRTIGHT MEMBER AND ITS PRODUCTION PROCESS
    7.
    发明申请
    AIRTIGHT MEMBER AND ITS PRODUCTION PROCESS 审中-公开
    AIRTIGHT会员及其生产过程

    公开(公告)号:US20140023803A1

    公开(公告)日:2014-01-23

    申请号:US14012388

    申请日:2013-08-28

    IPC分类号: H05K5/06

    摘要: To provide a process for producing an airtight member, which can improve bonding property of a sealing layer to a highly thermally conductive substrate and reliability, in airtight sealing of a space between a glass substrate and a highly thermally conductive substrate by local heating by electromagnetic waves.A glass substrate having a sealing material layer having electromagnetic wave absorbing property provided on a sealing region, and a highly thermally conductive substrate having a glass layer formed on a sealing region, are laminated while the sealing material layer and the glass layer are brought into contact with each other. The sealing material layer is irradiated with electromagnetic waves through the glass substrate to heat and melt the sealing material layer thereby to bond it to the glass layer, so as to form a sealing layer which airtightly seals the space between the glass substrate and the thermally conductive substrate.

    摘要翻译: 为了提供一种能够提高密封层与导热性高的基板的接合性和可靠性的气密部件的制造方法,通过电磁波的局部加热在玻璃基板与高导热性基板之间的空间的气密密封中 。 在密封材料层和玻璃层接触的同时层叠具有设置在密封区域上的具有电磁波吸收性的密封材料层的玻璃基板和具有形成在密封区域上的玻璃层的高导热性基板 与彼此。 密封材料层通过玻璃基板被电磁波照射,以加热和熔化密封材料层,从而将其粘合到玻璃层上,从而形成密封层,该密封层气密地密封玻璃基板和导热 基质。

    METHOD OF TREATING SUBSTRATES FOR BONDING
    10.
    发明申请
    METHOD OF TREATING SUBSTRATES FOR BONDING 有权
    处理基板的接合方法

    公开(公告)号:US20080003436A1

    公开(公告)日:2008-01-03

    申请号:US11427023

    申请日:2006-06-28

    摘要: A method of treating a glass substrate for bonding. The method includes providing a glass substrate having a fritted portion of a ceramic frit material and a non-fritted portion. At least a portion of the fritted portion includes a bondable surface. The method further includes cleaning and activating the bondable surface for subsequent bonding. The cleaning and bonding steps are carried out by applying an air plasma to the bondable surface.

    摘要翻译: 处理玻璃基板以进行接合的方法。 该方法包括提供具有陶瓷玻璃料材料的烧结部分和非烧结部分的玻璃基板。 烧结部分的至少一部分包括可结合的表面。 该方法还包括清洁和激活可粘合的表面以用于随后的粘合。 清洁和粘合步骤通过将空气等离子体施加到可结合表面来进行。