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公开(公告)号：US20230221475A1
公开(公告)日：2023-07-13
申请号：US17768643
申请日：2020-10-09
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner , Daniel Aloysius Nolan , Wageesha Senaratne
IPC: G02B5/22
CPC classification number: G02B5/22
Abstract: A display device includes at least two adjacent display tiles having a seam therebetween, and an optical element at the seam to optically blur the seam between the adjacent display tiles, with each of the adjacent display tiles including a substrate, one or more light sources on a first surface of the substrate, and control electronics on a second surface of the substrate opposite the first surface.
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公开(公告)号：US11465941B2
公开(公告)日：2022-10-11
申请号：US17276856
申请日：2019-09-12
Applicant: CORNING INCORPORATED
Inventor： Bruce Gardiner Aitken , Sean Matthew Garner , Thomas Dale Ketcham , Daniel Aloysius Nolan , Jun Yang , Haitao Zhang
IPC: C04B35/486 , G11C13/04 , B82Y40/00
Abstract: A ceramic waveguide includes: a doped metal oxide ceramic core layer; and at least one cladding layer comprising the metal oxide surrounding the core layer, such that the core layer includes an erbium dopant and at least one rare earth metal dopant being: lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or oxides thereof, or at least one non-rare earth metal dopant comprising zirconium or oxides thereof. Also included is a quantum memory including: at least one doped polycrystalline ceramic optical device with the ceramic waveguide and a method of fabricating the ceramic waveguide.
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公开(公告)号：US11059270B2
公开(公告)日：2021-07-13
申请号：US16051938
申请日：2018-08-01
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner
Abstract: A method of forming a flexible glass-polymer laminate structure includes heating a polymer layer to an elevated temperature of greater than 20° C. and below a working temperature of a flexible glass substrate adjacent the polymer layer. The flexible glass substrate has a thickness of no more than about 0.3 mm. The flexible glass substrate is shaped with the polymer layer at the elevated temperature. The polymer layer is cooled below the elevated temperature such that the flexible glass-polymer laminate structure maintains a non-planar formation.
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公开(公告)号：US20190312067A1
公开(公告)日：2019-10-10
申请号：US15972628
申请日：2018-05-07
Applicant: CORNING INCORPORATED
Inventor： Sean Matthew Garner , Daniel Wayne Levesque, JR. , Robert George Manley , Garrett Andrew Piech , Rajesh Vaddi , Heather Nicole Vanselous
Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.
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公开(公告)号：US20180339505A1
公开(公告)日：2018-11-29
申请号：US16051938
申请日：2018-08-01
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner
Abstract: A method of forming a flexible glass-polymer laminate structure includes heating a polymer layer to an elevated temperature of greater than 20° C. and below a working temperature of a flexible glass substrate adjacent the polymer layer. The flexible glass substrate has a thickness of no more than about 0.3 mm. The flexible glass substrate is shaped with the polymer layer at the elevated temperature. The polymer layer is cooled below the elevated temperature such that the flexible glass-polymer laminate structure maintains a non-planar formation.
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Patent Agency Ranking
公开(公告)号：US20180312421A1
公开(公告)日：2018-11-01
申请号：US15581382
申请日：2017-04-28
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner , Timothy James Kiczenski , William Edward Lock , Thomas Matthew Sonner
Abstract: Embodiments are related to scalable surface feature formation in a substrate and, more particularly, to systems and methods for forming displays using mechanically pressed patterns.
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公开(公告)号：US20180166353A1
公开(公告)日：2018-06-14
申请号：US15753889
申请日：2016-08-19
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner , Jen-Chieh Lin , Michael Lesley Sorensen
CPC classification number: H05K3/0029 , C03B33/0222 , C03C15/00 , C03C17/002 , C03C17/008 , C03C23/0025 , C03C23/007 , C03C2217/445 , C03C2217/70 , H01L21/4807 , H01L23/15 , H05K1/024 , H05K1/028 , H05K1/0306 , H05K1/036 , H05K1/115 , H05K3/002 , H05K3/107 , H05K3/388 , H05K3/4038 , H05K3/4629 , H05K2201/0195 , H05K2201/09509 , H05K2203/0143 , H05K2203/0743 , H05K2203/075 , H05K2203/0776 , H05K2203/0789 , H05K2203/107 , H05K2203/1194 , H05K2203/1545 , Y02P40/57
Abstract: Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μm. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.
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公开(公告)号：US09701461B2
公开(公告)日：2017-07-11
申请号：US15073280
申请日：2016-03-17
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner , Jeffrey Allen Miller
CPC classification number: B65D85/48 , B65B5/06 , B65B23/20 , B65B35/50 , B65B61/22 , B65D57/00 , B65D81/02 , B65D81/127
Abstract: Packages and methods of packaging a plurality of glass sheets provide a stack of glass sheets with an interleaf protective sheet positioned between each adjacent pair of glass sheets. An outer portion of each interleaf protective sheet is bent over a portion of the peripheral edge of one of a corresponding adjacent pair of glass sheets to discourage relative shifting of the glass sheets with respect to one another. The stack of glass sheets are sandwiched between pressure members of an outer housing such that the pressure members each apply a support pressure that is distributed over an outer surface of a corresponding one of the pair of outermost glass sheets of the stack of glass sheets.
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公开(公告)号：US20160351837A1
公开(公告)日：2016-12-01
申请号：US15232401
申请日：2016-08-09
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner , Gregory Scott Glaesemann , James Joseph Price
CPC classification number: H01L51/0097 , C03C4/00 , C03C17/34 , H01L31/03926 , H01L2251/5338 , Y02E10/549
Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.
Abstract translation: 公开了一种柔性基底，其包括无定形无机组合物，其中所述基底具有小于约250μm的厚度，并且具有以下至少一种：a）脆性比小于约9.5（μm）-1/2，或b） 断裂韧性至少约为0.75MPa·（m）1/2。 还公开了包括这种柔性装置的电子设备。 还公开了一种制造柔性基材的方法，包括选择能够形成厚度小于约250μm的基材的无定形无机材料，并具有以下中的至少一种：a）小于约9.5（μm）的脆性比， -1/2，或b）断裂韧性为至少约0.75MPa·（m）1/2; 然后从所选择的无机材料形成衬底。
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公开(公告)号：US11685684B2
公开(公告)日：2023-06-27
申请号：US16613569
申请日：2018-05-15
Applicant: CORNING INCORPORATED
IPC: C03B23/00 , C03B23/023
CPC classification number: C03B23/023
Abstract: Embodiments of a method for making a contoured glass article and the resulting contoured glass article are disclosed. In one or more embodiments, the method includes cold bending a flat glass sheet having first and second opposing major surfaces, at least one region having a first thickness, and at least one region having a second thickness that is less than the first thickness, to produce cold bent glass sheet having at least one bend region along a portion of the at least one region having the second thickness; and restraining the cold bent glass sheet to produce the contoured glass article. One or more embodiments pertain to the resulting contoured glass article.
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