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公开(公告)号：US11738415B2
公开(公告)日：2023-08-29
申请号：US17793565
申请日：2021-03-22
发明人： Takafumi Ohtake , Hiroaki Kawamata , Shinji Kikuchi , Keisuke Shinozaki , Yuki Fujino , Kazuya Kitazawa
IPC分类号： B23K35/36 , B23K35/362 , B23K35/02 , B23K101/42
CPC分类号： B23K35/362 , B23K35/3612 , B23K35/025 , B23K2101/42
摘要： A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.
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公开(公告)号：US20170190005A1
公开(公告)日：2017-07-06
申请号：US15128231
申请日：2015-02-27
IPC分类号： B23K35/362 , C22C13/00 , B23K35/26 , B23K35/02 , B23K35/36
CPC分类号： B23K35/362 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/36 , B23K35/3613 , C22C13/00
摘要： Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.
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公开(公告)号：US20230122883A1
公开(公告)日：2023-04-20
申请号：US17914495
申请日：2021-03-25
IPC分类号： B23K35/362 , B23K35/36 , B23K35/02
摘要： A flux for a solder paste includes rosin, an activator and a solvent. The solvent includes a monoalkylene glycol-based solvent and a solid solvent that is solid at 20° C. The total content of the monoalkylene glycol-based solvent and the solid solvent ranges from 40% by mass to 60% by mass with the total amount of the flux as 100%. The content of the solid solvent ranges from 5% by mass to 25% by mass with the total amount of the flux as 100%.
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公开(公告)号：US09902022B2
公开(公告)日：2018-02-27
申请号：US15128231
申请日：2015-02-27
IPC分类号： B23K35/362 , B23K35/26 , B23K35/36 , B23K35/02 , C22C13/00
CPC分类号： B23K35/362 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/36 , B23K35/3613 , C22C13/00
摘要： Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.
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公开(公告)号：US10160064B2
公开(公告)日：2018-12-25
申请号：US14911515
申请日：2013-08-12
发明人： Hideki Mori , Kazuya Kitazawa
IPC分类号： B23K35/362 , B23K35/02 , B23K35/36
摘要： A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.
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公开(公告)号：US20160184936A1
公开(公告)日：2016-06-30
申请号：US14911515
申请日：2013-08-12
发明人： Hideki Mori , Kazuya Kitazawa
IPC分类号： B23K35/362 , B23K35/02 , B23K35/36
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618
摘要： A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.
摘要翻译： 本发明的目的是通过抑制助焊剂残渣的碳化来提供具有改善的清洗性能的焊剂。 助熔剂含有有机酸，触变剂，松香和溶剂，其中含有14-20个碳原子的脂肪酸单烷醇酰胺作为触变剂。 作为触变剂，加入量为3-10重量％的脂肪酸单乙醇酰胺。 此外，作为有机酸，加入10重量％以下碳原子的二羧酸的量为4-10重量％。 此外，溶剂的添加量为30-60重量％。
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公开(公告)号：US11833620B2
公开(公告)日：2023-12-05
申请号：US16957537
申请日：2019-01-16
发明人： Yutaka Hashimoto , Kazuyori Takagi , Tomoko Nagai , Nanako Miyagi , Kazuya Kitazawa , Akiko Takaki , Kazuhiro Minegishi , Teppei Otsuki , Rina Horikoshi , Ryuichi Tsuda , Hiroyoshi Kawasaki , Masato Shiratori
CPC分类号： B23K35/3613 , B23K35/025 , B23K35/262 , C08K5/34924 , C08L93/04 , C22C13/00
摘要： Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.
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公开(公告)号：US11571771B2
公开(公告)日：2023-02-07
申请号：US16630250
申请日：2018-07-09
IPC分类号： B23K35/362 , B23K35/02
摘要： If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.
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