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公开(公告)号：US12132139B2
公开(公告)日：2024-10-29
申请号：US17771840
申请日：2020-10-05
发明人： Tomohiro Tsutsui , Akira Inoue , Chinatsu Sanda , Katsumi Ono
CPC分类号： H01L31/188 , H01L31/0504
摘要： A solar panel manufacturing apparatus includes a stage on which a substrate is placed, a pressing plate to press an adhesive applied on the substrate and thereby spread the adhesive via a solar cell arranged at a predetermined position on the adhesive, and to retain the position of the solar cell relative to the substrate, and a curing unit to cure only a part of the adhesive spread between the substrate and the solar cell, while the pressing plate is pressing the adhesive and retaining the position of the solar cell relative to the substrate.
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2.发明授权公开(公告)号：US12132128B2
公开(公告)日：2024-10-29
申请号：US18517160
申请日：2023-11-22
发明人： Kairui Lin , Chaohua Zhang
IPC分类号： H01L31/0236 , H01L31/02 , H01L31/0224 , H01L31/077 , H01L31/18
CPC分类号： H01L31/02366 , H01L31/0201 , H01L31/022441 , H01L31/022475 , H01L31/077 , H01L31/188 , H01L31/1888
摘要： A back-contact cell with isolation grooves specifically disposed and a preparation method thereof. The back-contact cell includes: a silicon substrate having, on a back side, a polished region and a textured region disposed alternately along an X-axis direction of the back side, a first semiconductor layer disposed on the polished region, and a second semiconductor layer disposed on the textured region. The back-contact cell further includes a conductive film layer and a conductive mask layer sequentially disposed outwardly along a Z-axis direction of the back side. A conductive composite layer formed by the conductive mask layer and the conductive film layer is provided with isolation grooves disposed at intervals along the X-axis direction. The isolation groove is located above a contact interface between the first semiconductor layer and the second semiconductor layer in the Z-axis direction, and the isolation groove spans part of the polished region and part of the textured region in the X-axis direction.
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公开(公告)号：US20240243210A1
公开(公告)日：2024-07-18
申请号：US18309703
申请日：2023-04-28
发明人： Zhiqiu GUO , Liqin LIU , Chi ZHANG , Shiliang HUANG , Guohui HAO
IPC分类号： H01L31/048 , H01L31/18
CPC分类号： H01L31/048 , H01L31/188
摘要： A photovoltaic module and a method for manufacturing the photovoltaic module are provided. A respective solar cell has a front surface and a rear surface opposite to the front surface, each of which has a plurality of electrodes formed thereon. Each connection member of the plurality of connection members is configured to connect two adjacent solar cells of the plurality of solar cells and has a first end portion disposed over the front surface of a first solar cell of the two adjacent solar cells and a second end portion disposed over the rear surface of a second solar cell of the two adjacent solar cells. Each encapsulation layer includes a first encapsulation sub-layer and a second encapsulation sub-layer, where flowability of the first encapsulation sub-layer is smaller than flowability of the second encapsulation sub-layer.
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公开(公告)号：US20240154055A1
公开(公告)日：2024-05-09
申请号：US18280504
申请日：2021-12-21
CPC分类号： H01L31/188 , H01L31/0504
摘要： Improvements in the technical field of the production of solar modules, including a method for producing solar modules (2) in which at least two or more rows (4) of photovoltaic cells (3) are co-fed to a cell-fitting operation for a solar module (2).
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公开(公告)号：US20240145619A1
公开(公告)日：2024-05-02
申请号：US18409190
申请日：2024-01-10
发明人： Vergil R. SANDOVAL , Emmanuel C. Abas , Yafu Lin
CPC分类号： H01L31/188 , H01B13/0003 , H01L31/05 , Y10T29/49117
摘要： A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
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公开(公告)号：US11955577B2
公开(公告)日：2024-04-09
申请号：US17011707
申请日：2020-09-03
IPC分类号： H01L31/18 , B41F15/08 , H01L21/67 , H01L21/677 , H01L31/042 , H01L31/05
CPC分类号： H01L31/1876 , B41F15/0881 , H01L21/67092 , H01L21/67109 , H01L21/67207 , H01L21/67282 , H01L21/6776 , H01L31/042 , H01L31/0504 , H01L31/18 , H01L31/188 , Y02E10/50 , Y02P70/50
摘要： Multi-operation tools for photovoltaic cell processing are described. In an example, a multi-operation tool includes a conveyor system to move a photovoltaic (PV) cell continuously along a conveyor path through a laser scribing station and an adhesive printing station. Furthermore, the PV cell may be aligned to a laser head of the laser scribing station and a printer head of the adhesive printing station in a single alignment operation prior to being laser scribed and printed with an adhesive in a continuous process.
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公开(公告)号：US20240014619A1
公开(公告)日：2024-01-11
申请号：US18348186
申请日：2023-07-06
申请人： Xaba Inc.
CPC分类号： H01R43/205 , H01L31/188
摘要： An apparatus includes: at least one conductive wire spool; a motion platform that includes a first actuator for following a first programmed motion in a first dimension and a second actuator for following a second programmed motion in a second dimension that is perpendicular to the first direction; a deposition head that is mounted to the motion platform, receives a conductive wire from the conductive wire spool, and attaches the conductive wire onto a surface of a substrate; and a controller that causes the motion platform to move along a programmed deposition path on the surface of the substrate, wherein at least a portion of the programmed deposition path varies in the first dimension and in the second dimension.
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公开(公告)号：US11869992B2
公开(公告)日：2024-01-09
申请号：US17971369
申请日：2022-10-21
发明人： Seung Bum Rim , Gabriel Harley
IPC分类号： H01L31/0443 , H01L31/02 , H01L31/0368 , H01L31/18 , H01L27/142
CPC分类号： H01L31/0443 , H01L27/1421 , H01L31/02008 , H01L31/03682 , H01L31/1804 , H01L31/188 , Y02E10/50 , Y02E10/547 , Y02P70/50
摘要： A solar cell can include a built-in bypass diode. In one embodiment, the solar cell can include an active region disposed in or above a first portion of a substrate and a bypass diode disposed in or above a second portion of the substrate. The first and second portions of the substrate can be physically separated with a groove. A metallization structure can couple the active region to the bypass diode.
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公开(公告)号：US20240006544A1
公开(公告)日：2024-01-04
申请号：US18369011
申请日：2023-09-15
发明人： Xiu FENG , Menglei XU , Jie YANG , Xinyu ZHANG
IPC分类号： H01L31/0224 , H01L31/05 , H01L31/048 , H01L31/18
CPC分类号： H01L31/022441 , H01L31/188 , H01L31/0488 , H01L31/0516
摘要： A solar cell including: a substrate having front and back surfaces, the back surface including first and second regions staggered and spaced from each other, and a gap region provided between one first region and one adjacent second region, a plurality of first pyramidal texture structure regions formed corresponding to a plurality of gap regions and a distance between a top and bottom thereof is 2-4 μm; a first conductive layer formed over the first region; a second conductive layer formed over the second region, the second conductive layer has a conductivity type opposite to the first conductive layer; a first electrode forming electrical contact with the first conductive layer; a second electrode forming electrical contact with the second conductive layer; and a boundary region between the gap region and the conductive layer(s) adjacent thereto, the boundary region including strip or line-patterned texture structures arranged at intervals.
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公开(公告)号：US20230411552A1
公开(公告)日：2023-12-21
申请号：US18210231
申请日：2023-06-15
申请人： HANWHA CORPORATION
发明人： Sung Gyu JEON , Dong Jin Chung , Min Kyo Jung
IPC分类号： H01L31/18
CPC分类号： H01L31/188
摘要： A wire jig provided configured to support a plurality of wires includes: a body frame having a window on an inside of the body portion; and a plurality of supporting frames arranged to correspond to the window, each supporting frame comprising a plurality of supporting elements contacting the plurality of wires, and arranged to form n rows (n is a natural number greater than 1) in a width direction of the body frame, wherein the plurality of supporting frames are sequentially arranged from a 1st row to an nth row, and the plurality of supporting elements included in any one of the supporting frames have a different arrangement from the plurality of supporting elements included in at least one of the other supporting frames.
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