公开(公告)号：US20170374743A1

公开(公告)日：2017-12-28

申请号：US15699570

申请日：2017-09-08

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Arata KISHI ,  Hironori MUNAKATA ,  Koji MOTOMURA ,  Hiroki MARUO

IPC分类号： H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US20150091187A1

公开(公告)日：2015-04-02

申请号：US14303128

申请日：2014-06-12

申请人： Freescale Semiconductor, Inc.

发明人： Douglas M. Reber ,  Mehul D. Shroff ,  Edward O. Travis

IPC分类号： H01L23/48 ,  H01L25/00 ,  H01L21/768 ,  H01L25/065

CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3185 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14131 ,  H01L2224/14517 ,  H01L2224/16111 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/24145 ,  H01L2224/81011 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81897 ,  H01L2224/81906 ,  H01L2224/81951 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/15788

摘要： A method for 3D device packaging utilizes through-hole metal post techniques to mechanically and electrically bond two or more dice. The first die includes a set of through-holes extending from a first surface of the first die to a second surface of the first die. The second die includes a third surface and a set of metal posts. The first die and the second die are stacked such that the third surface of the second die faces the second surface of the first die, and each metal post extends through a corresponding through-hole to a point beyond the first surface of the first die, electrically coupling the first die and the second die.

摘要翻译： 3D设备封装的方法利用通孔金属柱技术来机械地和电气地粘合两个或更多个骰子。 第一模具包括从第一模具的第一表面延伸到第一模具的第二表面的一组通孔。 第二模具包括第三表面和一组金属柱。 第一模具和第二模具被堆叠成使得第二模具的第三表面面向第一模具的第二表面，并且每个金属支柱延伸通过相应的通孔延伸到超过第一模具的第一表面的点， 电耦合第一管芯和第二管芯。

公开(公告)号：US20130043585A1

公开(公告)日：2013-02-21

申请号：US13568574

申请日：2012-08-07

申请人： Satoru WAKIYAMA ,  Hiroshi Ozaki

发明人： Satoru WAKIYAMA ,  Hiroshi Ozaki

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/11416 ,  H01L2224/11436 ,  H01L2224/11825 ,  H01L2224/11848 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81805 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

公开(公告)号：US09105625B2

公开(公告)日：2015-08-11

申请号：US13568574

申请日：2012-08-07

申请人： Satoru Wakiyama ,  Hiroshi Ozaki

发明人： Satoru Wakiyama ,  Hiroshi Ozaki

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/11416 ,  H01L2224/11436 ,  H01L2224/11825 ,  H01L2224/11848 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81805 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

摘要翻译： 一种半导体装置，包括：半导体元件; 形成在所述半导体部件上的Cu凸块; 以及被配置为电连接到所述Cu柱凸块的焊料凸块。

公开(公告)号：US20120127681A1

公开(公告)日：2012-05-24

申请号：US13010709

申请日：2011-01-20

申请人： Ji Man RYU ,  Kwan Ho LEE ,  Kyu Bum HAN ,  Seog Moon CHOI ,  Jin Su KIM

发明人： Ji Man RYU ,  Kwan Ho LEE ,  Kyu Bum HAN ,  Seog Moon CHOI ,  Jin Su KIM

IPC分类号： H01R9/00 ,  H05K3/00 ,  H01B5/00

CPC分类号： H05K3/306 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/1607 ,  H01L2224/16235 ,  H01L2224/16501 ,  H01L2224/811 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81899 ,  H01L2224/81906 ,  H01L2224/8192 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10401 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.

摘要翻译： 这里公开了一种焊接连接引脚，半导体封装基板和使用该半导体封装基板的半导体芯片的安装方法。 使用插入印刷电路板的通孔中的焊接连接销将半导体芯片安装在印刷电路板上，从而防止半导体封装基板的变形和由于外部冲击引起的疲劳失效。

公开(公告)号：US5438222A

公开(公告)日：1995-08-01

申请号：US28606

申请日：1993-03-08

申请人： Shunpei Yamazaki

发明人： Shunpei Yamazaki

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L23/4951 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/81951 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/19041

摘要： A miniaturized electronic device and a manufacturing method for the same is disclosed. Solder is provided on pads provided on leads and corresponding pads provided on an electronic part chip of the electronic device are placed on the solder. The solder is radiated with infrared rays and thereby melted. Then connecting parts are completed. This electronic device does not have a die and wires for bonding. Therefore, it is more miniaturized than a conventional electronic device.

摘要翻译： 公开了一种小型化电子器件及其制造方法。 将焊料设置在设置在引线上的焊盘上，并且将设置在电子器件的电子部件芯片上的相应焊盘放置在焊料上。 焊料用红外线辐射，从而熔化。 然后连接部件完成。 该电子设备不具有用于接合的管芯和电线。 因此，比传统的电子设备更小型化。

公开(公告)号：US20240113061A1

公开(公告)日：2024-04-04

申请号：US18530123

申请日：2023-12-05

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

摘要： An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US09659908B1

公开(公告)日：2017-05-23

申请号：US14937022

申请日：2015-11-10

申请人： Intel Corporation

发明人： Shubhada H. Sahasrabudhe ,  Sandeep B Sane ,  Siddarth Kumar ,  Shalabh Tandon

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/81365 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815

摘要： Discussed generally herein are methods and devices for more reliable Package on Package (PoP) Through Mold Interconnects (TMIs). A device can include a first die package including a first conductive pad on or at least partially in the first die package, a dielectric mold material on the first die package, the mold material including a hole therethrough at least partially exposing the pad, a second die package including a second conductive pad on or at least partially in the second die package the second die package on the mold material such that the second conductive pad faces the first conductive pad through the hole, and a shape memory structure in the hole and forming a portion of a solder column electrical connection between the first die package and the second die package.

公开(公告)号：US09515006B2

公开(公告)日：2016-12-06

申请号：US14303128

申请日：2014-06-12

申请人： Freescale Semiconductor, Inc.

发明人： Douglas M. Reber ,  Mehul D. Shroff ,  Edward O. Travis

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L25/00 ,  H01L21/768 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3185 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14131 ,  H01L2224/14517 ,  H01L2224/16111 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/24145 ,  H01L2224/81011 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81897 ,  H01L2224/81906 ,  H01L2224/81951 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/15788

摘要： A method for 3D device packaging utilizes through-hole metal post techniques to mechanically and electrically bond two or more dice. The first die includes a set of through-holes extending from a first surface of the first die to a second surface of the first die. The second die includes a third surface and a set of metal posts. The first die and the second die are stacked such that the third surface of the second die faces the second surface of the first die, and each metal post extends through a corresponding through-hole to a point beyond the first surface of the first die, electrically coupling the first die and the second die.

摘要翻译： 3D设备封装的方法利用通孔金属柱技术来机械地和电气地粘合两个或更多个骰子。 第一模具包括从第一模具的第一表面延伸到第一模具的第二表面的一组通孔。 第二模具包括第三表面和一组金属柱。 第一模具和第二模具被堆叠成使得第二模具的第三表面面向第一模具的第二表面，并且每个金属支柱延伸通过相应的通孔延伸到超过第一模具的第一表面的点， 电耦合第一管芯和第二管芯。

公开(公告)号：US20150303167A1

公开(公告)日：2015-10-22

申请号：US14790146

申请日：2015-07-02

申请人： c/o SONY CORPORATION

发明人： Satoru WAKIYAMA ,  Hiroshi OZAKI

IPC分类号： H01L23/00 ,  H01L25/00

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/11416 ,  H01L2224/11436 ,  H01L2224/11825 ,  H01L2224/11848 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81805 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

摘要翻译： 一种半导体装置，包括：半导体元件; 形成在所述半导体部件上的Cu凸块; 以及被配置为电连接到所述Cu柱凸块的焊料凸块。