公开(公告)号：US08773583B2

公开(公告)日：2014-07-08

申请号：US13086830

申请日：2011-04-14

申请人： Satoru Wakiyama ,  Hiroshi Ozaki

发明人： Satoru Wakiyama ,  Hiroshi Ozaki

IPC分类号： H04N5/225

CPC分类号： H01L27/14636 ,  H01L21/56 ,  H01L21/563 ,  H01L23/31 ,  H01L24/05 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L27/14605 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14683 ,  H01L27/1469 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/29035 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83104 ,  H01L2224/83365 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

摘要翻译： 本发明公开了一种半导体器件，包括：具有电子电路部分的第一半导体芯片和在其一个表面上形成的第一连接部分; 具有在其一个表面上形成的第二连接部分的第二半导体芯片，所述第二半导体芯片安装在所述第一半导体芯片上，所述第一和第二连接部分通过凸块相互连接; 形成为在所述第二半导体芯片的外缘的一部分上填充所述第一和第二半导体芯片之间的间隙的坝，所述外边缘的一部分位于所述电子电路部的形成区域的一侧; 并且填充到间隙中的底部填充树脂层，树脂层从第二半导体芯片的外边缘突出到电子电路部分的侧面被大坝阻止。

公开(公告)号：US20130043585A1

公开(公告)日：2013-02-21

申请号：US13568574

申请日：2012-08-07

申请人： Satoru WAKIYAMA ,  Hiroshi Ozaki

发明人： Satoru WAKIYAMA ,  Hiroshi Ozaki

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/11416 ,  H01L2224/11436 ,  H01L2224/11825 ,  H01L2224/11848 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81805 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

公开(公告)号：US07863741B2

公开(公告)日：2011-01-04

申请号：US12078893

申请日：2008-04-08

申请人： Hiroshi Ozaki ,  Satoru Wakiyama

发明人： Hiroshi Ozaki ,  Satoru Wakiyama

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor chip formed with a bump such that the bump corresponds to a pad electrode. The pad electrode is covered with a nickel layer. The bump has an indium layer and an intermediate metal compound layer disposed between the indium layer and the nickel layer, and the intermediate metal compound layer is formed by alloying the indium layer and a copper layer containing copper atoms of not less than 0.5 atomic percent and not more than 5 atomic percent with respect to the indium atoms in the indium layer.

摘要翻译： 形成有凸点的半导体芯片，使得该凸块对应于焊盘电极。 焊盘电极被镍层覆盖。 凸块具有设置在铟层和镍层之间的铟层和中间金属化合物层，并且通过使铟层和含有不少于0.5原子％的铜原子的铜层合金化而形成中间金属化合物层，以及 相对于铟层中的铟原子不超过5原子％。

公开(公告)号：US09105625B2

公开(公告)日：2015-08-11

申请号：US13568574

申请日：2012-08-07

申请人： Satoru Wakiyama ,  Hiroshi Ozaki

发明人： Satoru Wakiyama ,  Hiroshi Ozaki

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/11416 ,  H01L2224/11436 ,  H01L2224/11825 ,  H01L2224/11848 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81805 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

摘要翻译： 一种半导体装置，包括：半导体元件; 形成在所述半导体部件上的Cu凸块; 以及被配置为电连接到所述Cu柱凸块的焊料凸块。

公开(公告)号：US20110279717A1

公开(公告)日：2011-11-17

申请号：US13086830

申请日：2011-04-14

申请人： Satoru Wakiyama ,  Hiroshi Ozaki

发明人： Satoru Wakiyama ,  Hiroshi Ozaki

IPC分类号： H04N5/335 ,  H01L31/18 ,  H01L31/0216

CPC分类号： H01L27/14636 ,  H01L21/56 ,  H01L21/563 ,  H01L23/31 ,  H01L24/05 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L27/14605 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14683 ,  H01L27/1469 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/29035 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83104 ,  H01L2224/83365 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

摘要翻译： 本发明公开了一种半导体器件，包括：具有电子电路部分的第一半导体芯片和在其一个表面上形成的第一连接部分; 具有在其一个表面上形成的第二连接部分的第二半导体芯片，所述第二半导体芯片安装在所述第一半导体芯片上，所述第一和第二连接部分通过凸块相互连接; 形成为在所述第二半导体芯片的外缘的一部分上填充所述第一和第二半导体芯片之间的间隙的坝，所述外边缘的一部分位于所述电子电路部的形成区域的一侧; 并且填充到间隙中的底部填充树脂层，树脂层从第二半导体芯片的外边缘突出到电子电路部分的侧面被大坝阻止。

公开(公告)号：US20080277784A1

公开(公告)日：2008-11-13

申请号：US12078893

申请日：2008-04-08

申请人： Hiroshi Ozaki ,  Satoru Wakiyama

发明人： Hiroshi Ozaki ,  Satoru Wakiyama

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor chip formed with a bump such that the bump corresponds to a pad electrode. The pad electrode is covered with a nickel layer. The bump has an indium layer and an intermediate metal compound layer disposed between the indium layer and the nickel layer, and the intermediate metal compound layer is formed by alloying the indium layer and a copper layer containing copper atoms of not less than 0.5 atomic percent and not more than 5 atomic percent with respect to the indium atoms in the indium layer.

摘要翻译： 形成有凸点的半导体芯片，使得该凸块对应于焊盘电极。 焊盘电极被镍层覆盖。 凸块具有设置在铟层和镍层之间的铟层和中间金属化合物层，并且通过使铟层和含有不少于0.5原子％的铜原子的铜层合金化而形成中间金属化合物层，以及 相对于铟层中的铟原子不超过5原子％。

公开(公告)号：US08985580B2

公开(公告)日：2015-03-24

申请号：US12788213

申请日：2010-05-26

申请人： Hiroshi Ozaki

发明人： Hiroshi Ozaki

IPC分类号： G06F3/12 ,  H04N1/04 ,  G03G15/00

CPC分类号： G06F3/1205 ,  G03G15/502 ,  G03G15/5083 ,  G03G15/5087 ,  G03G15/6547 ,  G03G2215/00109 ,  G06F3/1253 ,  G06F3/1255 ,  G06F3/1264 ,  G06F3/1282 ,  G06F2206/1514

摘要： An information processing apparatus includes a designation unit configured to designate number-of-copies information indicating a number of copies of print media to be stacked in a lump as a unit via a user interface of a printer driver, and a transmission unit configured to set an attribute of a print job based on the number-of-copies information designated by the designation unit and to transmit the set attribute to an image forming apparatus.

摘要翻译： 一种信息处理设备，包括：指定单元，被配置为通过打印机驱动程序的用户界面将指示要堆叠的打印介质的数量的副本信息指定为一个单元;以及发送单元，被配置为设置 基于由指定单元指定的份数信息的打印作业的属性，并将该属性发送到图像形成装置。

公开(公告)号：US08390846B2

公开(公告)日：2013-03-05

申请号：US12098207

申请日：2008-04-04

申请人： Hiroshi Ozaki

发明人： Hiroshi Ozaki

IPC分类号： G06F3/12 ,  G06K15/00

CPC分类号： H04N1/0035 ,  G06F3/1205 ,  G06F3/1255 ,  G06F3/1285 ,  H04N1/00238 ,  H04N1/0048 ,  H04N1/00973 ,  H04N1/2315 ,  H04N1/2323 ,  H04N1/2338 ,  H04N1/32539 ,  H04N2201/0074 ,  H04N2201/0082 ,  H04N2201/0094

摘要： From an image-processing apparatus that can communicate via a network, updated configuration information is received, and configuration information for display is not updated based on the received configuration information so that an item to be processed is not reflected in configuration information of an item manually set by a user, and the configuration information for display is updated based on the received configuration information so that an item to be processed is reflected in the configuration information of an item that is not manually set by the user. Accordingly, the configuration information can be manually set while effectively using the configuration information received from the information-processing apparatus.

摘要翻译： 从可以经由网络进行通信的图像处理装置，接收到更新的配置信息，并且基于接收的配置信息不更新用于显示的配置信息，使得待处理的项目不被手动地反映在项目的配置信息中 基于所接收的配置信息更新用于显示的配置信息，使得要处理的项目被反映在用户未手动设置的项目的配置信息中。 因此，可以有效地使用从信息处理装置接收到的配置信息来手动设置配置信息。

公开(公告)号：US20130036368A1

公开(公告)日：2013-02-07

申请号：US13584933

申请日：2012-08-14

申请人： Osamu Fukushima ,  Hajime Fujii ,  Hiroshi Ozaki

发明人： Osamu Fukushima ,  Hajime Fujii ,  Hiroshi Ozaki

IPC分类号： G06F3/01

CPC分类号： H04N21/4622 ,  G06Q30/06 ,  H04N21/2665 ,  H04N21/42203 ,  H04N21/4223 ,  H04N21/4307 ,  H04N21/437 ,  H04N21/4382 ,  H04N21/47202 ,  H04N21/6125 ,  H04N21/6131 ,  H04N21/6175 ,  H04N21/6181 ,  Y10S705/901 ,  Y10S705/902 ,  Y10S705/903 ,  Y10S705/904 ,  Y10S705/911

摘要： In a data providing server, whether or not specified compressed content data generated by means of a specified compression coding method corresponding to terminal identification information has been stored in a content database is detected, according to content specifying data transmitted from a portable dedicated terminal. If the specified compressed content data has been stored, the data providing server reads and transmits this to the portable dedicated terminal. And if the specified compressed content data has not been stored, the data providing server generates the specified compressed content data by means of the specified compression coding method, and transmits this to the portable dedicated terminal.

摘要翻译： 在数据提供服务器中，根据从便携式专用终端发送的内容指定数据，检测是否已经将与终端识别信息对应的特定压缩编码方法生成的指定压缩内容数据存储在内容数据库中。 如果已经存储了指定的压缩内容数据，则数据提供服务器读取并将其发送到便携式专用终端。 如果指定的压缩内容数据尚未被存储，则数据提供服务器通过指定的压缩编码方式生成指定的压缩内容数据，并将其发送到便携式专用终端。

公开(公告)号：US20110199035A1

公开(公告)日：2011-08-18

申请号：US13124021

申请日：2009-10-13

申请人： Hisashi Ooto ,  Taro Kishibe ,  Hiroshi Ozaki ,  Ryuhei Watabe ,  Satoru Doi

发明人： Hisashi Ooto ,  Taro Kishibe ,  Hiroshi Ozaki ,  Ryuhei Watabe ,  Satoru Doi

IPC分类号： H02P3/06

CPC分类号： H02P29/0241 ,  E05F15/70 ,  H02H7/08 ,  H02P27/08

摘要： A motor control device, which receives at least two emergency stop signals, includes an LSI, a PWM signal transmission circuit, a drive circuit, and an inverter circuit. The LSI generates PWM signals. The PWM signal transmission circuit transmits the PWM signals. The drive circuit generates inverter drive signals. The inverter circuit includes a P-side power switching device and an N-side power switching device. The drive circuit includes a P-side drive circuit for driving the P-side power switching device, and an N-side drive circuit for driving the N-side power switching device. One of the emergency stop signals is inputted to the P-side drive circuit and the PWM signal transmission circuit. The other emergency stop signal is inputted to the N-side drive circuit and the PWM signal transmission circuit. In response to the receipt of an emergency stop signal, the PWM signal transmission circuit stops transmitting the PWM signals, and the drive circuit stops outputting the inverter drive signals.

摘要翻译： 接收至少两个紧急停止信号的电动机控制装置包括LSI，PWM信号传输电路，驱动电路和逆变器电路。 LSI产生PWM信号。 PWM信号传输电路传输PWM信号。 驱动电路产生逆变器驱动信号。 逆变器电路包括P侧电源开关器件和N侧电源开关器件。 驱动电路包括用于驱动P侧电源开关器件的P侧驱动电路和用于驱动N侧电源开关器件的N侧驱动电路。 其中一个紧急停止信号被输入到P侧驱动电路和PWM信号传输电路。 另一个紧急停止信号被输入到N侧驱动电路和PWM信号传输电路。 响应于接收到紧急停止信号，PWM信号发送电路停止发送PWM信号，并且驱动电路停止输出逆变器驱动信号。