公开(公告)号：US09601135B2

公开(公告)日：2017-03-21

申请号：US14607248

申请日：2015-01-28

Applicant: SEAGATE TECHNHOLOGY LLC

Inventor： Tong Zhao ,  Michael Christopher Kautzky ,  Michael Allen Seigler ,  Yongjun Zhao ,  Jay Jayashankar ,  Xiaoyue Huang

IPC: G11B5/31 ,  G11B5/60 ,  G11B11/105 ,  G11B5/00

CPC classification number: G11B5/314 ,  G11B5/6088 ,  G11B11/10536 ,  G11B2005/0021 ,  Y10T428/1157 ,  Y10T428/1171 ,  Y10T428/1193

Abstract: A device that includes a near field transducer (NFT); at least one cladding layer adjacent the NFT; and a discontinuous metal layer positioned between the NFT and the at least one cladding layer.

公开(公告)号：US09236068B2

公开(公告)日：2016-01-12

申请号：US14048081

申请日：2013-10-08

Applicant: Zhang Kunliang ,  Li Min ,  Zhou Yuchen ,  Zheng Min

Inventor： Zhang Kunliang ,  Li Min ,  Zhou Yuchen ,  Zheng Min

IPC: G11B5/127 ,  G11B5/33 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/39 ,  G11B5/31 ,  H01L43/12

CPC classification number: G11B5/332 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/315 ,  G11B5/3909 ,  G11B5/3912 ,  G11B5/3932 ,  G11B2005/3996 ,  Y10T29/49032 ,  Y10T29/49034 ,  Y10T29/49044 ,  Y10T29/49067 ,  Y10T428/1143 ,  Y10T428/115 ,  Y10T428/1157 ,  Y10T428/1171 ,  Y10T428/1193 ,  Y10T428/12819

Abstract: A hard bias (HB) structure for producing longitudinal bias to stabilize a free layer in an adjacent spin valve is disclosed and includes a composite seed layer made of at least Ta and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (Co/Ni)x laminated layer. The (Co/Ni)x HB layer deposition involves low power and high Ar pressure to avoid damaging Co/Ni interfaces and thereby preserves PMA. A capping layer is formed on the HB layer to protect against etchants in subsequent process steps. After initialization, magnetization direction in the HB layer is perpendicular to the sidewalls of the spin valve and generates an Mrt value that is greater than from an equivalent thickness of CoPt. A non-magnetic metal separation layer may be formed on the capping layer and spin valve to provide an electrical connection between top and bottom shields.

Abstract translation: 公开了用于产生纵向偏压以稳定相邻自旋阀中的自由层的硬偏压（HB）结构，其包括至少由Ta制成的复合晶种层和具有fcc（111）或hcp（001）结构的金属层 以提高上覆（Co / Ni）x叠层的垂直磁各向异性（PMA）。 （Co / Ni）x HB层沉积涉及低功率和高Ar压力，以避免损坏Co / Ni界面，从而保留PMA。 在HB层上形成覆盖层以防止后续工艺步骤中的蚀刻剂。 在初始化之后，HB层中的磁化方向垂直于自旋阀的侧壁，并产生大于CoPt当量厚度的Mrt值。 可以在封盖层和自旋阀上形成非磁性金属分离层，以提供顶部和底部屏蔽之间的电连接。

公开(公告)号：US09222168B2

公开(公告)日：2015-12-29

申请号：US14084600

申请日：2013-11-19

Applicant: Yung-I Chen

Inventor： Yung-I Chen

IPC: C23C8/10 ,  C23C28/02 ,  C23C14/58 ,  C22C5/04 ,  C22C27/02 ,  C22C27/04 ,  C23C14/16 ,  C23C8/00

CPC classification number: C23C14/5806 ,  C22C5/04 ,  C22C27/02 ,  C22C27/04 ,  C23C14/165 ,  C23C14/5853 ,  Y10T428/1171

Abstract: A forming method of a laminated structure by internal oxidation is provided. An alloy coating layer is formed. The alloy coating layer has a columnar grain structure and includes a first metal element and a second metal element, and the first metal element is oxidized more easily than the second metal element. Thereafter, a thermal oxidation treatment process is performed to the alloy coating layer, so as to form a plurality of oxide layers and a plurality of metal layers stacked alternately with each other from a surface portion of the alloy coating layer. A material of the oxide layers includes an oxide of the first metal element, and a material of the metal layers includes the second metal element.

Abstract translation: 提供了通过内部氧化形成叠层结构的方法。 形成合金涂层。 合金涂层具有柱状晶粒结构，并且包括第一金属元素和第二金属元素，并且第一金属元素比第二金属元素更容易氧化。 然后，对合金被覆层进行热氧化处理工序，从合金被覆层的表面形成多个氧化物层和多个金属层，交替地层叠。 氧化物层的材料包括第一金属元素的氧化物，金属层的材料包括第二金属元素。

公开(公告)号：US08901728B2

公开(公告)日：2014-12-02

申请号：US14096504

申请日：2013-12-04

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara

IPC: H01L23/48 ,  H01L23/04 ,  H05K1/11 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  G11B5/48 ,  H05K1/18 ,  H05K3/18 ,  H01L21/66 ,  H01L23/31 ,  H01L21/56

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional structure in which a wiring and a pad part are provided on a surface is provided. A recessed gutter for wiring and a hole for the pad part having a depth that is greater than a thickness of the recessed gutter for wiring are provided on the surface of the three-dimensional structure. The hole for the pad part is provided in succession with the recessed gutter for wiring. At least a part of a wiring conductor is embedded in the recessed gutter for wiring and in the hole for the pad part.

Abstract translation: 提供了其中在表面上设置布线和焊盘部分的三维结构。 在三维结构的表面上设置用于布线的凹槽和用于焊盘部分的孔，其深度大于用于布线的凹槽的厚度。 用于焊盘部分的孔连续地设置有用于布线的凹槽。 布线导体的至少一部分嵌入到用于布线的凹槽中和用于垫部的孔中。

公开(公告)号：US08717708B2

公开(公告)日：2014-05-06

申请号：US12315523

申请日：2008-12-03

Applicant: Mao Nishiyama ,  Shuji Nishida ,  Hideaki Maeda ,  Masafumi Mochizuki

Inventor： Mao Nishiyama ,  Shuji Nishida ,  Hideaki Maeda ,  Masafumi Mochizuki

IPC: G11B5/127

CPC classification number: G11B5/3166 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315 ,  G11B5/3169 ,  Y10T428/1171 ,  Y10T428/1193

Abstract: Embodiments of the present invention provide a magnetic head for perpendicular magnetic recording, and a magnetic disk apparatus capable of preventing data erasure caused by alignment marks. In an embodiment, the magnetic head includes a head element including at least a main pole having a pole face on a flying surface and an auxiliary pole; alignment marks made of a magnetic material and used to detect the amount of lapping work when lapping the pole face of the main pole; and members made of a magnetic material, continuously extending in either direction with respect to the position of the main pole from within the alignment marks outward at least beyond the alignment marks.

Abstract translation: 本发明的实施例提供一种用于垂直磁记录的磁头，以及能够防止由对准标记引起的数据擦除的磁盘装置。 在一个实施例中，磁头包括头元件，头元件至少包括在飞行表面上具有极面的主极和辅助极; 由磁性材料制成的对准标记，用于在研磨主极的极面时检测研磨作业的数量; 以及由磁性材料制成的构件，其在相对于主极的位置的任一方向上从对准标记内部至少超过对准标记向外延伸。

公开(公告)号：US20140097004A1

公开(公告)日：2014-04-10

申请号：US14096514

申请日：2013-12-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

IPC: H05K1/11

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Abstract translation: 提供其中在表面上设置布线的三维结构。 三维结构的表面的至少一部分包括含有填料的绝缘层。 在三维结构的表面上设置用于布线的凹槽，并且布线导体的至少一部分嵌入到凹槽中用于布线。

公开(公告)号：US20140090876A1

公开(公告)日：2014-04-03

申请号：US14096504

申请日：2013-12-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

IPC: H05K1/11

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional structure in which a wiring and a pad part are provided on a surface is provided. A recessed gutter for wiring and a hole for the pad part having a depth that is greater than a thickness of the recessed gutter for wiring are provided on the surface of the three-dimensional structure. The hole for the pad part is provided in succession with the recessed gutter for wiring. At least a part of a wiring conductor is embedded in the recessed gutter for wiring and in the hole for the pad part.

Abstract translation: 提供了其中在表面上设置布线和焊盘部分的三维结构。 在三维结构的表面上设置用于布线的凹槽和用于焊盘部分的孔，其深度大于用于布线的凹槽的厚度。 用于焊盘部分的孔连续地设置有用于布线的凹槽。 布线导体的至少一部分嵌入到用于布线的凹槽中和用于垫部的孔中。

公开(公告)号：US20140063647A1

公开(公告)日：2014-03-06

申请号：US13605934

申请日：2012-09-06

Applicant: Norihiro Okawa ,  Koji Sakamoto ,  Koji Okazaki

Inventor： Norihiro Okawa ,  Koji Sakamoto ,  Koji Okazaki

IPC: G11B5/33 ,  G11B21/02 ,  B82Y30/00

CPC classification number: G11B5/3932 ,  B82Y25/00 ,  G01R33/093 ,  G11B5/1278 ,  G11B5/3163 ,  H01F10/3254 ,  Y10T428/11 ,  Y10T428/1157 ,  Y10T428/1171

Abstract: In one embodiment, a magnetic head includes a sensor stack of thin films including a free layer; a hard bias structure comprising a first foundation layer, a second foundation layer formed on the first foundation layer and a hard bias layer formed above the second foundation layer, wherein portions of the first and second foundation layers positioned along a side wall of the sensor stack have a discrete island structure. Additional embodiments are also disclosed.

Abstract translation: 在一个实施例中，磁头包括包括自由层的薄膜的传感器堆叠; 包括第一基础层，形成在第一基础层上的第二基础层和形成在第二基础层上方的硬偏置层的硬偏压结构，其中第一和第二基础层沿传感器堆叠的侧壁定位的部分 具有离散的岛结构。 还公开了另外的实施例。

公开(公告)号：US08617322B2

公开(公告)日：2013-12-31

申请号：US12953461

申请日：2010-11-24

Applicant: Yung-I Chen ,  Rong-Tan Huang ,  Bing-Nan Tsai

Inventor： Yung-I Chen ,  Rong-Tan Huang ,  Bing-Nan Tsai

IPC: C23C8/10 ,  C23C28/00

CPC classification number: C23C14/5806 ,  C22C5/04 ,  C22C27/02 ,  C22C27/04 ,  C23C14/165 ,  C23C14/5853 ,  Y10T428/1171

Abstract: A laminated structure by internal oxidation includes an alloy coating layer structured as columnar grains. The alloy coating layer includes a first metal element and a second metal element, wherein the first metal element is oxidized more easily than the second metal element. The surface layer portion of the alloy coating layer has a plurality of oxide layers and a plurality of metal layers stacked alternately with each other. The material of the oxide layers includes the oxide of the first metal element and the material of the metal layers includes the second metal element.

Abstract translation: 通过内部氧化的层叠结构包括构成柱状晶粒的合金被覆层。 合金涂层包括第一金属元件和第二金属元件，其中第一金属元件比第二金属元件更容易氧化。 合金涂层的表层部分具有多个氧化物层和彼此交替堆叠的多个金属层。 氧化物层的材料包括第一金属元素的氧化物，金属层的材料包括第二金属元素。

公开(公告)号：US08553352B2

公开(公告)日：2013-10-08

申请号：US13758711

申请日：2013-02-04

Applicant: International Business Machines Corporation

Inventor： Robert G. Biskeborn ,  Jason Liang ,  Calvin S. Lo

IPC: G11B5/187

CPC classification number: G11B5/313 ,  G11B5/00821 ,  G11B5/1871 ,  G11B5/255 ,  G11B5/3106 ,  G11B5/60 ,  Y10T428/1171

Abstract: A magnetic tape head according to one embodiment includes a first section having a tape bearing surface (TBS) and portions that are recessed from the TBS; a thin film section coupled to the first section, the thin film section comprising transducers for at least one of reading from and writing to a magnetic tape; and a lubricating layer above at least the first section. Additional systems and methods are also disclosed.

Abstract translation: 根据一个实施例的磁带头包括具有带状表面（TBS）的第一部分和从TBS凹进的部分; 耦合到所述第一部分的薄膜部分，所述薄膜部分包括用于从磁带读取和写入至少一个的换能器; 以及至少在第一部分上方的润滑层。 还公开了附加的系统和方法。