Invention Grant
US09263394B2 Multiple bond via arrays of different wire heights on a same substrate
有权
通过不同导线高度的阵列在同一基片上的多重键合
- Patent Title: Multiple bond via arrays of different wire heights on a same substrate
- Patent Title (中): 通过不同导线高度的阵列在同一基片上的多重键合
-
Application No.: US14087252Application Date: 2013-11-22
-
Publication No.: US09263394B2Publication Date: 2016-02-16
- Inventor: Cyprian Emeka Uzoh , Rajesh Katkar
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/538 ; H01L23/00
Abstract:
An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.
Public/Granted literature
- US20150145141A1 Multiple Bond Via Arrays of Different Wire Heights on a Same Substrate Public/Granted day:2015-05-28
Information query
IPC分类:
