公开(公告)号：US11756919B2

公开(公告)日：2023-09-12

申请号：US16766042

申请日：2018-02-07

Applicant: Mitsubishi Electric Corporation

Inventor： Daisuke Imai

IPC: H01L23/00 ,  H01L21/50 ,  H01L21/60

CPC classification number: H01L24/78 ,  H01L21/50 ,  H01L24/48 ,  H01L2021/60195 ,  H01L2224/48455 ,  H01L2224/78315 ,  H01L2224/78343 ,  H01L2224/859

Abstract: It is an object to enable a non-destructive inspection of reliability of a bonding part and enabling an accurate inspection. A wedge tool includes: a groove which is formed along a direction of an ultrasonic vibration in a tip portion and in which a bonding wire is disposed in a wedge bonding; a first planar surface and a second planar surface disposed on both sides of the groove; and at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding.

公开(公告)号：US20230154888A1

公开(公告)日：2023-05-18

申请号：US17987708

申请日：2022-11-15

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： Jon W. Brunner ,  Wei Qin ,  Aashish Shah ,  Hui Xu ,  Jeong Ho Yang

IPC: H01L23/00 ,  B23K20/10

CPC classification number: H01L24/78 ,  H01L24/85 ,  B23K20/10 ,  H01L24/48 ,  H01L2224/48221 ,  H01L2924/386 ,  H01L2224/78001 ,  H01L2224/78343 ,  H01L2224/78901 ,  H01L2224/7892 ,  H01L2224/78925 ,  H01L2224/85986 ,  H01L2224/859 ,  H01L2224/85205 ,  B23K2101/40

Abstract: A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.

公开(公告)号：US08584922B1

公开(公告)日：2013-11-19

申请号：US13947679

申请日：2013-07-22

Applicant: Orthodyne Electronics Corporation

Inventor： Christoph B. Luechinger ,  Orlando L. Valentin ,  Tao Xu

IPC: B23K1/06

CPC classification number: H01L24/84 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L31/18 ,  H01L31/188 ,  H01L2224/45014 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/78343 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y02E10/50 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.

Abstract translation: 提供超声波接合系统。 超声波接合系统包括结合头组件和由粘合头组件支撑的接合工具。 该系统还包括一个按压构件，该按压构件适于压靠使用该接合工具粘结的接合材料。 按压构件由接合头组件支撑，并且能够独立于接合工具相对于接合头组件移动。 超声波接合系统也可以是用于将带状材料接合到太阳能电池的部分的超声带接合系统或太阳能电池带接合系统。

公开(公告)号：US4347964A

公开(公告)日：1982-09-07

申请号：US149633

申请日：1980-05-14

Applicant: Nobuhiro Takasugi ,  Ryuichi Kyomasu

Inventor： Nobuhiro Takasugi ,  Ryuichi Kyomasu

IPC: H01L21/00 ,  H01L21/60 ,  H01L21/68 ,  H01L23/544 ,  B23K28/00

CPC classification number: H01L23/544 ,  H01L24/29 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/54473 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78343 ,  H01L2224/78801 ,  H01L2224/83805 ,  H01L2224/85121 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787

Abstract: In a wire bonding apparatus in which, by identifying recognition marks of a pellet or leads displaced from a reference position in wire-bonding a pellet of a semiconductor device to leads within a field of view of a television camera, the displacements of the bonding positions of the pellet and the lead are corrected and then bonding pads on the pellet are connected to the leads by wires, the field of view is moved from a reference view position in a given moving manner, whereby the recognition marks may be identified rapidly and reliably. This apparatus is well adapted for the wire bonding of a semiconductor device of the DILG sealing type, for example, which is poor in the position accuracy of the bonding position.

Abstract translation: 在一种引线接合装置中，通过识别在电视摄像机的视场内将半导体器件的芯片引线接合引线的芯片的识别标记或从参考位置偏移的引线，接合位置的位移 对芯片和引线进行校正，然后将芯片上的接合焊盘通过导线连接到引线，以给定的移动方式从参考视图位置移动视野，从而可以快速可靠地识别识别标记 。 该装置适用于DILG型密封型半导体器件的引线接合，例如，接合位置的位置精度差。

公开(公告)号：US09793236B2

公开(公告)日：2017-10-17

申请号：US14712932

申请日：2015-05-15

Applicant: SHINKAWA LTD.

Inventor： Naoki Sekine ,  Motoki Nakazawa ,  Yasuo Nagashima

IPC: B23K31/02 ,  H01L23/00 ,  B23K20/00 ,  B23K20/10

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K20/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78343 ,  H01L2224/78901 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/20753 ,  H01L2224/4554

Abstract: Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

公开(公告)号：US09230937B2

公开(公告)日：2016-01-05

申请号：US13468139

申请日：2012-05-10

Applicant: Kaori Sumitomo ,  Hideyuki Arakawa ,  Hiroshi Horibe ,  Yasuki Takata

Inventor： Kaori Sumitomo ,  Hideyuki Arakawa ,  Hiroshi Horibe ,  Yasuki Takata

IPC: H01L21/44 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05186 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78304 ,  H01L2224/78343 ,  H01L2224/81193 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/20755 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/207

Abstract: There is provided a technology capable of suppressing the damage applied to a pad. When the divergence angle of an inner chamfer part is smaller than 90 degrees, the ultrasonic conversion load in a direction perpendicular to the surface of the pad is very small in magnitude. In other words, the ultrasonic conversion load in a direction perpendicular to the surface of the pad is sufficiently smaller in magnitude than the ultrasonic conversion load in a direction in parallel with the surface of the pad. Consequently, when the divergence angle of the inner chamfer part is smaller than 90 degrees, the ultrasonic conversion load in a direction perpendicular to the surface of the pad can be sufficiently reduced in magnitude, which can prevent pad peeling.

Abstract translation: 提供了能够抑制施加到垫的损伤的技术。 当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向的超声波转换载荷的大小非常小。 换句话说，垂直于焊盘表面的方向上的超声波转换负载在与焊盘表面平行的方向上的超声波转换载荷的幅度上足够小。 因此，当内倒角部分的发散角小于90度时，可以在与焊盘表面垂直的方向上的超声波转换载荷大大降低，从而可以防止焊盘剥离。

公开(公告)号：US20150249063A1

公开(公告)日：2015-09-03

申请号：US14712932

申请日：2015-05-15

Applicant: SHINKAWA LTD.

Inventor： NAOKI SEKINE ,  MOTOKI NAKAZAWA ,  YASUO NAGASHIMA

IPC: H01L23/00 ,  B23K20/10 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K20/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78343 ,  H01L2224/78901 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/20753 ,  H01L2224/4554

Abstract: Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

Abstract translation: 提供一种引线接合装置（10），包括：毛细管（28），线（30）穿过该毛细管插入; 和控制器（80）。 控制器（80）被配置为执行以下操作：包括：在第二接合操作之后的断开操作，在线被保持在其中时，使线插入的毛细管垂直于毛细管的轴向垂直于水平面。 夹紧状态，从而使线与第二接合点断开; 从所述第二接合点向所述预定接合点供给所述线的预接合动作，并且在所述预接合点进行预接合; 以及在预接合操作之后，将从毛细管的尖端突出的线成形为预定的弯曲形状的成形操作。

公开(公告)号：US08919631B2

公开(公告)日：2014-12-30

申请号：US13420739

申请日：2012-03-15

Applicant: Yam Mo Wong ,  Ka Shing Kwan ,  Hing Leung Li ,  Xiang Chao Li

Inventor： Yam Mo Wong ,  Ka Shing Kwan ,  Hing Leung Li ,  Xiang Chao Li

IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B06B3/00

CPC classification number: B23K20/007 ,  B06B3/00 ,  B23K20/002 ,  B23K20/004 ,  B23K20/005 ,  B23K20/10 ,  B23K20/103 ,  B23K20/106 ,  H01L24/78 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78343 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

Abstract translation: 公开了一种用于将换能器安装到引线接合器的接合头的装置。 特别地，当在半导体封装内的不同位置之间形成电互连时，引线接合器的结合头可用于机械地驱动换能器。 具体地，该装置包括：i）具有用于连接到换能器的连接器的弯曲结构，该弯曲结构被构造成弯曲; 以及ii）附接到所述弯曲结构的至少一个致动器，所述至少一个致动器可操作以弯曲所述弯曲结构，从而引起经由所述连接器连接到其上的所述换能器的位移。

公开(公告)号：US08746537B2

公开(公告)日：2014-06-10

申请号：US14059572

申请日：2013-10-22

Applicant: Orthodyne Electronics Corporation

Inventor： Christoph B. Luechinger ,  Orlando L. Valentin ,  Tao Xu

IPC: B23K1/06 ,  B23K20/10

CPC classification number: B23K20/004 ,  B23K20/10 ,  H01L24/37 ,  H01L24/45 ,  H01L24/77 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L31/188 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/773 ,  H01L2224/77313 ,  H01L2224/77315 ,  H01L2224/77316 ,  H01L2224/77321 ,  H01L2224/77343 ,  H01L2224/77352 ,  H01L2224/77611 ,  H01L2224/77702 ,  H01L2224/783 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/78316 ,  H01L2224/78321 ,  H01L2224/78343 ,  H01L2224/78352 ,  H01L2224/78611 ,  H01L2224/78702 ,  H01L2224/8412 ,  H01L2224/84205 ,  H01L2224/8512 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  Y02E10/50 ,  H01L2224/45099 ,  H01L2924/01026 ,  H01L2924/04563 ,  H01L2924/00012

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.

Abstract translation: 提供超声波接合系统。 超声波接合系统包括接合头组件和用于将导电接合材料接合到工件的接合工具。 超声波接合系统还包括适于压靠工件的按压构件，该按压构件由接合头组件支撑，并且能够相对于接合头组件可独立于接合工具而移动。 按压构件包括主体部分和在主体部分下方延伸的多个按压元​​件，按压元件构造成接触工件。

公开(公告)号：US20130306708A1

公开(公告)日：2013-11-21

申请号：US13947679

申请日：2013-07-22

Applicant: Orthodyne Electronics Corporation

Inventor： Christoph B. Luechinger ,  Orlando L. Valentin ,  Tao Xu

IPC: H01L23/00

CPC classification number: H01L24/84 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L31/18 ,  H01L31/188 ,  H01L2224/45014 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/78343 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y02E10/50 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.

Abstract translation: 提供超声波接合系统。 超声波接合系统包括结合头组件和由粘合头组件支撑的接合工具。 该系统还包括一个按压构件，该按压构件适于压靠使用该接合工具粘结的接合材料。 按压构件由接合头组件支撑，并且能够独立于接合工具相对于接合头组件移动。 超声波接合系统也可以是用于将带状材料接合到太阳能电池的部分的超声波带接合系统或太阳能电池带接合系统。