公开(公告)号：US12062618B2

公开(公告)日：2024-08-13

申请号：US18524118

申请日：2023-11-30

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L23/538 ,  H01L23/15 ,  H01L23/498 ,  H10K77/10 ,  H01L23/00 ,  H01L25/16

CPC分类号： H01L23/5384 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H10K77/10 ,  C09K2323/00 ,  C09K2323/03 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  Y02E10/549 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/1308 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/00014 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2224/48465 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2224/13109 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2224/13005 ,  H01L2924/206 ,  H01L2224/13005 ,  H01L2924/207 ,  H01L2224/03462 ,  H01L2924/00014 ,  H01L2224/1146 ,  H01L2924/00014 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/01029 ,  H01L2224/45139 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2224/48465 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/45124 ,  H01L2924/00014

摘要： A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

公开(公告)号：US20100246152A1

公开(公告)日：2010-09-30

申请号：US12722483

申请日：2010-03-11

申请人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Hsin-Jung Lo ,  Ping-Jung Yang ,  Te-Sheng Liu

发明人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Hsin-Jung Lo ,  Ping-Jung Yang ,  Te-Sheng Liu

IPC分类号： H05K7/00

CPC分类号： G06F1/16 ,  G11C5/147 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/60 ,  H01L23/66 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6611 ,  H01L2223/6666 ,  H01L2224/02166 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02321 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05176 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05541 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/11 ,  H01L2224/11009 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/1191 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/1302 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13609 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/48764 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/4918 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/81895 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/92127 ,  H01L2224/92147 ,  H01L2224/92225 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48869 ,  H01L2224/48744 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/0361 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L24/78 ,  H01L2224/85 ,  H01L21/56 ,  H01L21/78 ,  H01L2924/0635 ,  H01L2924/07025 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/0231

摘要： Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

摘要翻译： 公开了集成电路芯片和芯片封装，其包括在集成电路芯片的顶部处的过钝化方案，以及使用顶部后钝化技术和底部结构技术的集成电路芯片的底部的底部方案。 集成电路芯片可以通过过钝化方案或者通过钝化方案连接到外部电路或结构，例如球栅阵列（BGA）衬底，印刷电路板，半导体芯片，金属衬底，玻璃衬底或陶瓷衬底 底部方案。 描述了相关的制造技术。

公开(公告)号：US20120193785A1

公开(公告)日：2012-08-02

申请号：US13358496

申请日：2012-01-25

申请人： Mou-Shiung Lin ,  Ping-Jung Yang ,  Hsin-Jung Lo ,  Te-Sheng Liu ,  Jin-Yuan Lee

发明人： Mou-Shiung Lin ,  Ping-Jung Yang ,  Hsin-Jung Lo ,  Te-Sheng Liu ,  Jin-Yuan Lee

IPC分类号： H01L23/498

CPC分类号： H01L25/0657 ,  H01L21/76229 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/80 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/6835 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05187 ,  H01L2224/05558 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05655 ,  H01L2224/08145 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48755 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/48855 ,  H01L2224/80896 ,  H01L2224/8385 ,  H01L2224/83896 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12036 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1441 ,  H01L2924/1451 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2224/80 ,  H01L2224/83 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/80001 ,  H01L2224/82

摘要： Multichip packages or multichip modules may include stacked chips and through silicon/substrate vias (TSVs) formed using enclosure-first technology. Enclosure-first technology may include forming an isolation enclosure associated with a TSV early in the fabrication process, without actually forming the associated TSV. The TSV associated with the isolation enclosure is formed later in the fabrication process. The enclosure-first technology allows the isolation enclosures to be used as alignment marks for stacking additional chips. The stacked chips can be connected to each other or to an external circuit such that data input is provided through the bottom-most (or topmost) chip, data is output from the bottom-most (or topmost) chip. The multichip package may provide a serial data connection, and a parallel connection, to each of the stacked chips.

摘要翻译： 多芯片封装或多芯片模块可以包括堆叠芯片和通过使用封装第一技术形成的硅/衬底通孔（TSV）。 外壳首先技术可以包括在制造过程的早期形成与TSV相关联的隔离外壳，而不实际形成相关的TSV。 与隔离罩相关联的TSV在制造过程中稍后形成。 封装第一技术允许隔离外壳用作堆叠附加芯片的对准标记。 堆叠的芯片可以彼此连接或连接到外部电路，使得通过最底部（或最上面）芯片提供数据输入，数据从最底部（或最顶端）的芯片输出。 多芯片封装可以向每个堆叠的芯片提供串行数据连接和并联连接。

公开(公告)号：US20120170887A1

公开(公告)日：2012-07-05

申请号：US13338184

申请日：2011-12-27

申请人： Ping-Jung Yang ,  Hsin-Jung Lo ,  Te-Sheng Liu

发明人： Ping-Jung Yang ,  Hsin-Jung Lo ,  Te-Sheng Liu

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/12002 ,  G02B6/1221 ,  G02B6/132 ,  H01L21/568 ,  H01L23/522 ,  H01L2224/04105 ,  H01L2224/05 ,  H01L2224/11 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/48463 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2924/15153 ,  H05K1/0274

摘要： A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.

摘要翻译： 描述了一种装置，其包括用于信号传输和电力/地面传送的波导结构。波导结构包括用于将光信号从光源装置传输到检测器的信号传输部分。 信号传输部分可以包括透明聚合物，金刚石或玻璃。 信号传输部分用于波导。 波导结构还包括围绕信号传输部分的电力/地面输送部分。 动力/地面输送部分由至少一个金属层组成。 因此，波导结构可以通过信号传输部分提供具有高速度和高体积的光信号传输，同时可以通过电源/接地传送部分向多个单元提供稳定的功率或接地参考。

公开(公告)号：US20110304008A1

公开(公告)日：2011-12-15

申请号：US13158315

申请日：2011-06-10

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L27/12

CPC分类号： H01L23/5227 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/5286 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687 ,  H01L2224/0345 ,  H01L2224/03831 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11622 ,  H01L2224/11849 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48871 ,  H01L2224/48881 ,  H01L2224/73207 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2224/48671 ,  H01L2224/48681 ,  H01L2224/05552 ,  H01L2924/00012

摘要： A semiconductor chip includes a silicon substrate, a transistor in or on a bottom side surface of the substrate, a metallization structure under a bottom side surface of the substrate, a dielectric layer under the substrate and between a first and second metal layers of the metallization structure, a passivation layer under the metallization structure and the dielectric layer, where an opening in the passivation layer may be under a contact point of the metallization structure, a polymer layer under the passivation layer, a metal post under the passivation layer and in the polymer layer, where the polymer layer may not cover a bottom surface of the metal post, a metal bump connected with the bottom surface of the metal post, a micro-lense over the top side surface of the substrate, and a glass substrate over the micro-lense and over the top side surface of the substrate.

摘要翻译： 半导体芯片包括硅衬底，在衬底的底侧表面中或其上的晶体管，在衬底的底侧表面下方的金属化结构，在衬底下方的介电层以及金属化的第一和第二金属层之间 在金属化结构和介电层下方的钝化层，其中钝化层中的开口可以在金属化结构的接触点下方，钝化层下面的聚合物层，钝化层下方的金属柱 聚合物层，其中聚合物层可能不覆盖金属柱的底表面，与金属柱的底表面连接的金属凸块，在基底的顶侧表面上的微观透镜，以及在该基底上的玻璃基底 微透镜并且在衬底的顶侧表面上方。

公开(公告)号：US11538763B2

公开(公告)日：2022-12-27

申请号：US17372459

申请日：2021-07-11

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L23/538 ,  H01L23/15 ,  H01L23/498 ,  H01L51/00 ,  H01L23/00 ,  H01L25/16

摘要： A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

公开(公告)号：US20200161245A1

公开(公告)日：2020-05-21

申请号：US16752650

申请日：2020-01-26

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L23/538 ,  H01L51/00 ,  H01L23/498 ,  H01L23/15

摘要： A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

公开(公告)号：US10453819B2

公开(公告)日：2019-10-22

申请号：US16139040

申请日：2018-09-23

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L23/00 ,  H05K1/09 ,  H01L51/00 ,  H01L23/15 ,  H01L23/498 ,  H01G4/12 ,  H05B33/08 ,  H01L25/16

摘要： A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein one of the conductors comprise a copper-tungsten alloy material, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors.

公开(公告)号：US20170047313A1

公开(公告)日：2017-02-16

申请号：US15261956

申请日：2016-09-11

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L25/16 ,  H01L33/62 ,  H01L33/48 ,  H01L25/075

CPC分类号： H01L23/5384 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L51/0096 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  Y02E10/549 ,  Y10T428/10 ,  Y10T428/1036 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2224/48227 ,  H01L2224/16225 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/206 ,  H01L2924/207

摘要： A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

摘要翻译： 显示装置包括显示面板基板和位于所述显示面板基板上的玻璃基板，其中所述显示面板基板包括多个接触垫，显示区域，第一边界，第二边界，第三边界和第四边界，其中所述 显示区域包括第一边缘，第二边缘，第三边缘和第四边缘，其中所述第一边界平行于所述第三边界和所述第一和第三边缘，其中所述第二边界平行于所述第四边界，所述第二边界 第四边缘，其中在所述第一边界和所述第一边缘之间的第一最小距离，其中所述第二边界和所述第二边缘之间的第二最小距离，所述第三边界和所述第三边缘之间的第三最小距离，所述第四边界之间的第四距离 边界和所述第四边缘，并且其中所述第一，第二，第三和第四最小距离小于100微米，并且其中所述玻璃基板 包括通过所述玻璃基板的多个金属导体，并且多个金属凸块位于所述玻璃基板和所述显示面板基板之间，其中所述金属导体之一通过所述金属凸块中的一个连接到所述接触垫之一。

公开(公告)号：US08837872B2

公开(公告)日：2014-09-16

申请号：US13338184

申请日：2011-12-27

申请人： Ping-Jung Yang ,  Hsin-Jung Lo ,  Te-Sheng Liu

发明人： Ping-Jung Yang ,  Hsin-Jung Lo ,  Te-Sheng Liu

IPC分类号： G02B6/12 ,  G02B6/43 ,  G02B6/132 ,  G02B6/122 ,  H05K1/02

CPC分类号： G02B6/43 ,  G02B6/12002 ,  G02B6/1221 ,  G02B6/132 ,  H01L21/568 ,  H01L23/522 ,  H01L2224/04105 ,  H01L2224/05 ,  H01L2224/11 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/48463 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2924/15153 ,  H05K1/0274

摘要： A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.

摘要翻译： 描述了一种装置，其包括用于信号传输和电力/地面传送的波导结构。波导结构包括用于将光信号从光源装置传输到检测器的信号传输部分。 信号传输部分可以包括透明聚合物，金刚石或玻璃。 信号传输部分用于波导。 波导结构还包括围绕信号传输部分的电力/地面输送部分。 动力/地面输送部分由至少一个金属层组成。 因此，波导结构可以通过信号传输部分提供具有高速度和高体积的光信号传输，同时可以通过电源/接地传送部分向多个单元提供稳定的功率或接地参考。