Multiple stack high voltage circuit for memory

    公开(公告)号:US12094558B2

    公开(公告)日:2024-09-17

    申请号:US18318264

    申请日:2023-05-16

    CPC classification number: G11C5/147 G11C7/1084 G11C17/165 G11C17/18

    Abstract: One aspect of this description relates to a memory array. The memory array includes a plurality of N-stack pass gates, a plurality of enable lines, a plurality of NMOS stacks, a plurality of word lines, and a matrix of resistive elements. Each N-stack pass gate includes a stage-1 PMOS core device and a stage-N PMOS core device in series. Each stage-1 PMOS is coupled to a voltage supply. Each enable line drives a stack pass gate. Each N-stack selector includes a plurality of NMOS stacks. Each NMOS stack includes a stage-1 NMOS core device and a stage-N NMOS core device in series. Each stage-1 NMOS core device is coupled to a ground rail. Each word line is driving a stack selector. Each resistive element is coupled between a stack pass gate and a stack selector. Each voltage supply is greater than a breakdown voltage for each of the core devices.

    VOLTAGE GENERATION CIRCUIT AND SEMICONDUCTOR MEMORY DEVICE

    公开(公告)号:US20240282356A1

    公开(公告)日:2024-08-22

    申请号:US18171024

    申请日:2023-02-17

    Inventor: Takahiko SATO

    CPC classification number: G11C11/4074 G11C5/147 G11C5/148

    Abstract: A voltage generation circuit and a semiconductor memory device capable of decreasing the layout size and the consumed current are provided. A voltage generation circuit includes a plurality of voltage generation units which generate different output voltages based on an external power supply voltage. Each of the plurality of voltage generation unit comprises a plurality of resistors that are connected in series to detect the output voltages. At least one of these resistors is coupled to and shared by the plurality of voltage generation units.

    Semiconductor device and memory device comprising the same

    公开(公告)号:US12066849B2

    公开(公告)日:2024-08-20

    申请号:US17744067

    申请日:2022-05-13

    CPC classification number: G05F1/56 G11C5/147 G11C7/10 H03F3/45071

    Abstract: A semiconductor device including an error amplifier configured to receive a voltage of an output node and a reference voltage, a flipped voltage follower (FVF) circuit configured to receive an output of the error amplifier and maintain the voltage of the output node at the reference voltage, and a bias current control circuit configured to receive first to third mode signals, control a magnitude of a bias current flowing through the FVF circuit based on the first to third mode signals, control the bias current of a first magnitude, based on the first mode signal, control the bias current of a second magnitude smaller than the first magnitude, based on the second mode signal, and control the bias current of a third magnitude smaller than the second magnitude, based on the third mode signal.

    STORAGE SYSTEM AND SEMICONDUCTOR PACKAGE WITH IMPROVED POWER SUPPLY EFFICIENCY

    公开(公告)号:US20240242742A1

    公开(公告)日:2024-07-18

    申请号:US18204806

    申请日:2023-06-01

    Applicant: SK hynix Inc.

    Inventor: Dong Sop LEE

    CPC classification number: G11C5/147

    Abstract: Data storage systems and semiconductor devices are disclosed. In an embodiment, a storage system includes a circuit board, a semiconductor device coupled to the circuit board and including at least one memory and a controller, wherein the controller is in communication with the at least one memory and configured to control the at least one memory, and a voltage level regulator coupled to the circuit board and including at least one switching element and located outside the at least one memory and the controller in the semiconductor device, the voltage level regulator configured to output, to at least one of the at least one memory or the controller, a driving voltage obtained by adjusting a level of at least one external voltage received from a device outside the semiconductor device.

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