公开(公告)号：US20050269694A1

公开(公告)日：2005-12-08

申请号：US11192768

申请日：2005-07-29

Applicant: Christoph Luechinger

Inventor： Christoph Luechinger

IPC: H01L21/60 ,  H01L21/607 ,  H01L23/495 ,  H01L23/34

CPC classification number: H01L23/498 ,  B23K20/008 ,  B23K2101/32 ,  B23K2101/38 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/78316 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2924/206 ,  H01L2224/43848

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract translation: 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。

公开(公告)号：US08685791B2

公开(公告)日：2014-04-01

申请号：US13750741

申请日：2013-01-25

Applicant: Christoph B. Luechinger

Inventor： Christoph B. Luechinger

IPC: H01L21/00

CPC classification number: H01L23/498 ,  B23K20/008 ,  B23K2101/32 ,  B23K2101/38 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/78316 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/01049

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

公开(公告)号：US09214444B2

公开(公告)日：2015-12-15

申请号：US14399003

申请日：2013-05-07

Applicant: Heraeus Materials Technology GmbH & Co. KG

Inventor： Eugen Milke ,  Peter Prenosil ,  Sven Thomas

IPC: H01L23/00 ,  H01B1/02 ,  B21C1/00 ,  B21C9/00 ,  B32B15/01 ,  H01L25/07 ,  H01L25/16

CPC classification number: H01L24/48 ,  B21C1/003 ,  B21C9/00 ,  B32B15/01 ,  H01B1/023 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/207 ,  H01L2924/2075 ,  Y10T29/49117 ,  Y10T428/1275 ,  H01L2924/01028 ,  H01L2924/01014 ,  H01L2924/01012 ,  H01L2924/01008 ,  H01L2924/01205 ,  H01L2924/01204 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/01206 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2224/05599 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 μm2 to 800,000 μm2. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.

Abstract translation: 带，优选用于在微电子学中结合的粘合带包含含有铜的第一层，包含叠加在第一层上的铝的涂层和中间层。 在带的横截面视图中，第一层的面积份额为50至96％，横截面视图中的带的宽度和高度之间的纵横比为0.03至小于0.8。 带的截面积为25,000μm2至800,000μm2。 中间层含有至少一种包含第一层和涂层的材料的金属间相。 本发明还涉及一种用于将由该工艺获得的线材制成的线材制造到包含该线材的电气装置的方法，该方法包括所述电气装置的推进装置以及通过楔形连接器将两个元件通过导线连接的过程， 粘接。

公开(公告)号：US08685789B2

公开(公告)日：2014-04-01

申请号：US12776199

申请日：2010-05-07

Applicant: Christoph B. Luechinger

Inventor： Christoph B. Luechinger

IPC: H01L21/00

CPC classification number: H01L23/498 ,  B23K20/008 ,  B23K2101/32 ,  B23K2101/38 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/78316 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/01049

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract translation: 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。

公开(公告)号：US20070141755A1

公开(公告)日：2007-06-21

申请号：US11675534

申请日：2007-02-15

Applicant: Christoph Luechinger

Inventor： Christoph Luechinger

IPC: H01L21/00

CPC classification number: H01L23/498 ,  B23K20/008 ,  B23K2101/32 ,  B23K2101/38 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/78316 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/01049

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract translation: 柔性导电带超声波地结合到管芯的表面和端子从封装的引线框架。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。

公开(公告)号：US20060185892A1

公开(公告)日：2006-08-24

申请号：US11335125

申请日：2006-01-19

Applicant: Volker Guengerich ,  Horst Theuss

Inventor： Volker Guengerich ,  Horst Theuss

IPC: H05K1/16

CPC classification number: H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/66 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45686 ,  H01L2224/45688 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/86205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/1903 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/83205

Abstract: A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for the high-frequency coupling of components of the semiconductor device. The micro connecting elements have an at least three-layered structural form with a first layer of conducting material, a second layer of insulating material and a third layer of conducting material. In this configuration, the first and third layers and extend along a common center line and shield one another against electromagnetic interference fields. The first and third layers and are fixed on correspondingly adapted pairs of contact terminal areas of the components.

Abstract translation: 具有微连接元件的半导体器件及其制造方法。 在一个实施例中，半导体器件包括用于半导体器件的部件的高频耦合的多个微连接元件。 微连接元件具有至少三层结构形式，其具有第一层导电材料，第二层绝缘材料和第三层导电材料。 在该配置中，第一和第三层沿公共中心线延伸并相互屏蔽电磁干扰场。 第一和第三层并且固定在部件的相应适应的接触端子区域对上。

公开(公告)号：US12027490B2

公开(公告)日：2024-07-02

申请号：US17390101

申请日：2021-07-30

Applicant: Infineon Technologies AG

Inventor： Richard Knipper ,  Alexander Heinrich ,  Thorsten Scharf ,  Stefan Schwab

IPC: H01L23/00

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45033 ,  H01L2224/48472 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/85825

Abstract: A method for fabricating a semiconductor device includes providing a semiconductor die, arranging an electrical connector over the semiconductor die, the electrical connector including a conductive core, an absorbing feature arranged on a first side of the conductive core, and a solder layer arranged on a second side of the conductive core, opposite the first side and facing the semiconductor die, and soldering the electrical connector onto the semiconductor die by heating the solder layer with a laser, wherein the laser irradiates the absorbing feature and absorbed energy is transferred from the absorbing feature through the conductive core to the solder layer.

公开(公告)号：US20130134577A1

公开(公告)日：2013-05-30

申请号：US13750741

申请日：2013-01-25

Applicant: Christoph B. Luechinger

Inventor： Christoph B. Luechinger

IPC: H01L23/498

CPC classification number: H01L23/498 ,  B23K20/008 ,  B23K2101/32 ,  B23K2101/38 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/78316 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/01049

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract translation: 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。

公开(公告)号：US20130009296A1

公开(公告)日：2013-01-10

申请号：US13348308

申请日：2012-01-11

Applicant: Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

Inventor： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45014 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2224/83 ,  H01L2924/206

Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. The lead frame can include a plurality of terminals with stamped features at edges of the terminals. The stamped features can include flattened portions that are thinner than other portions of the terminals and extend laterally beyond the edges of the terminals. Such stamped features can help mechanically interlock the terminals with the plastic molding of the package body. The stamped features can include patterns and/or other features that may further increase interlocking between the terminals and the package body.

Abstract translation: 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 引线框架可以包括在端子的边缘处具有冲压特征的多个端子。 冲压的特征可以包括比端子的其它部分薄的扁平部分，并且横向延伸超过端子的边缘。 这种冲压的特征可以帮助机械地将端子与包装体的塑料成型机械地互锁。 冲压的特征可以包括可以进一步增加端子和封装主体之间的互锁的图案和/或其他特征。

公开(公告)号：US07468560B2

公开(公告)日：2008-12-23

申请号：US11335125

申请日：2006-01-19

Applicant: Volker Guengerich ,  Horst Theuss

Inventor： Volker Guengerich ,  Horst Theuss

IPC: H01L23/48 ,  H01L29/40

CPC classification number: H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/66 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45686 ,  H01L2224/45688 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/86205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/1903 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/83205

Abstract: A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for the high-frequency coupling of components of the semiconductor device. The micro connecting elements have an at least three-layered structural form with a first layer of conducting material, a second layer of insulating material and a third layer of conducting material. In this configuration, the first and third layers and extend along a common center line and shield one another against electromagnetic interference fields. The first and third layers and are fixed on correspondingly adapted pairs of contact terminal areas of the components.

Abstract translation: 具有微连接元件的半导体器件及其制造方法。 在一个实施例中，半导体器件包括用于半导体器件的部件的高频耦合的多个微连接元件。 微连接元件具有至少三层结构形式，其具有第一层导电材料，第二层绝缘材料和第三层导电材料。 在该配置中，第一和第三层沿公共中心线延伸并相互屏蔽电磁干扰场。 第一和第三层并且固定在部件的相应适应的接触端子区域对上。